Board Size 4.0"x5.5" (10x14cm)
Click for bottom view
Enlarge: BGA100 Daisy chain
Daisy Chain After Mounting BGA100
TopLine 998xxx series Kit has daisy chain mounting sites for BGA676 (DC269) with 1.0mm pitch and BGA100 (DC109) 0.8mm pitch. Solder mask defined pad for BGA676 is Ø18mils (Ø0.46mm). Solder mask defined pad for BGA100 is Ø15mils (Ø0.38mm).
Full chain loop BGA676 Daisy chain and BGA100 Daisy chain verify correct assembly with an ohm-meter at 2 test points per component. Practice reflow with heavy copper ground.
Pad Cu 1.0-oz (copper) 1.4mil (0.035mm) thickness on 4-layers.
Choice of Final finish:
• ENIG (Ni/Au) Gold
LPI Solder Mask - PSR4000BN Green
Size - 4.0"x5.5" (10x14cm)
Thickness 0.062" (1.6mm)
4-Layer Board - Heavy Ground
Heavy Copper Fill 1.0-Oz
Dog Bone Daisy Chain Pad outer layers
BGA pads repeated on Top and bottom
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
BGA676 Mounting Site
Daisy Chain After Mounting BGA676