BGA676 Pitch 0.8mm
Concentric Ring Daisy Chain
For Testing Surface Cleanliness

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BGA676 Concentric Ring Board
NSMD Pitch 0.8mm
 
Enlarge BGA676: Top Side   •  Bottom Side
Top Side BGA324
Board Size 4"x5" (10x12.5cm)
Click for Assembly Drawings


 

TopLine 999145 BGA676 cleanliness board has a special concetric ring Daisy Chain for detecting residue between the BGA pads. Top side has a single site for mounting a BGA676 0.8mm Pitch 23x23mm. The bottom side has tracings to connect the concentric daisy chain pattern to plated throughhole test points. BGA pads are non-soldermask defined (NSMD). This double layer board is 0.062-inch (1.6mm) thick. Standard 999145 board is Tin-Lead SnPb HASL. Lead free RoHS boards are also available.

Board Features:

  • Final finish: HASL (Tin-Lead)
  • LPI Solder Mask - PSR4000BV AUS5
  • FR4 Tg=170°C Isola FR406
  • Size - 4"x5.0" (10x12.5cm)
  • Thickness 0.062" (1.6mm)
  • 2-Layer Board (Cu 1oz)
  • Tooling Holes - None
  • IPC Fiducials - 0.062" (1.57mm)

    Enlarge:  After Mounting BGA676 Details
    Click for Placement Map

  •  
      BGA676 Concentric Ring
    Daisy Chain Board

    Call for Kit Quantities Available
    Kit BOM Components
    Per
    Board

    Order #
    Board - HASL
    Tin-Lead (SnPb)
    1 999145
    BGA676
    Tin-Lead (SnPb)
    1 BGA676T.8-DC269D

    Download Solder Paste Gerber & Parts Placement Data
    Step 1. Click Here for TopLine's Document Center. Sign up and Log in.
    Step 2. Click link "Gerber Files"
    Step 3. Click link "999145a" BGA676 Kit
    Step 4. Download files

    Board Order Number System
    999 145
    Series Design
    Application Specific BGA676 Board - 2L
    4"x5" (10x12.5cm)
    HASL (Tin-Lead)
    Other Variations Available
     
    Spare Boards
    Board Finish Type Order Number
    HASL (Tin Lead) Non-RoHS 999145
    ENIG (Ni-Au) Gold RoHS Call
     
     
    Spare Parts
    Ball Alloy Type Drawing
    Sn63/Pb37 Non RoHS BGA676T.8-DC269D
    SAC305 RoHS BGA676T.8C-DC269D

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