Actual Size: 4" x 5.5" (100 x 140mm)
Kits are supplied with BGA352 Perimeter 1.27mm pitch and LBGA400 Full Array 1.5mm pitch.
BGA121 is not included.
Hot Air Soldering Leveling
LPI Solder Mask
FR4 Board .062"
Tooling Holes .125"
Etched defined pads 0.89mm (35mils)diameter