Flip Chips
With Daisy Chain
 
Useful Links:  Practice PC Boards     Part Number System     More Wire bondable Test Die      Quartz Die For Underfill Experiments
 
Example Full Array
With Daisy Chain
Example Perimeter
With Daisy Chain


Flip Chips with Daisy Chain (Eutetic and SAC Bumps)
Bumps Bump Matrix Pitch Die Size
(mm)
Bump
Height
UBM
øDia
Tray Qty Eutectic
Sn63/Pb37
Order Number
Pb-Free
Lead Free
SAC - Sn/Ag/Cu
Order Number
Ref Quick View
48 12x12
Perimeter
457µm 6.3mm 140µm ø178µm 25pcs
Waffle 2"
FC48D6.3E457-DC FC48D6.3C457-DC FBT250
88 22x22
Perimeter
204µm 5.08mm 107µm ø102µm 36
Waffle 2"
FC88G5.08E204-DC FC88G5.08C204-DC PB08
112 28x28
Perimeter
152.5µm 5.08mm 85µm ø88µm 36pcs
Waffle 2"
FC112K5.08E152-DC FC112K5.08C152-DC PB06
176 44x44
Perimeter
204µm 10.2mm 107µm ø102µm 49pcs
Waffle 4"
FC176G10E204-DC FC176G10C204-DC PB08
x4
220 44x66
Perimeter
204µm 10mm x
15mm
107µm ø102µm 20pcs
Waffle 4"
FC220G10x15E204-DC FC220G10x15C204-DC PB08
x6
317 18x18
Full Array
254µm 5.08mm 125µm ø102µm 36pcs
Waffle 2"
FC317G5.08E254-DC FC317G5.08C254-DC FA10
484 22x22
Full Array
200µm 5.0mm 74µm ø102µm 36pcs
Waffle 2"
- FC484G5C200-DC -
569 24x24
Full Array
204µm 5.08mm 89µm ø102µm 36pcs
Waffle 2"
FC569G5.08E204-DC FC569G5.08C204-DC FA08
1268 36x36
Full Array
254µm 10.2mm 125µm ø102µm 49pcs
Waffle 4"
FC1268G10E254-DC FC1268G10C254-DC FA10
x4
1936 44x44
Full Array
200µm 10mm 74µm ø102µm 49pcs
Waffle 4"
- FC1936G10C200-DC FC484
x4
2276 48x48
Full Array
204µm 10mm 89µm ø102µm 49pcs
Waffle 4"
FC2276G10E204-DC FC2276G10C204-DC FA08
x4
2853 54x54
Full Array
254µm 15mm 125µm ø102µm 16pcs
Waffle 4"
FC2853G15E254-DC FC2853G15C254-DC FA10
x9
4356 66x66
Full Array
200µm 15mm 74µm ø102µm 16pcs
Waffle 4"
- FC4356G15C200-DC FC484
x9
5072 72x72
Full Array
254µm 20mm 125µm ø102µm 9pcs
Waffle 4"
FC5072G20E254-DC FC5072G20C254-DC FA10
x16
5121 72x72
Full Array
204µm 15mm 89µm ø102µm 16pcs
Waffle 4"
FC5121G15E204-DC FC5121G15C204-DC FA08
x9
7744 88x88
Full Array
200µm 20mm 74µm ø102µm 9pcs
Waffle 4"
- FC7744G20C200-DC FC484
x16
9104 96x96
Full Array
204µm 20mm 89µm ø102µm 9pcs
Waffle 4"
FC9104G20E204-DC FC9104G20C204-DC FA08
x16
 
General Specifications:
Die thickness: Standard 24 mil (600~650µm).
Thin die (back grinding) to 8mils (200µm) available on special order.
6mils (150µm) available on "as-is" basis with yield loss.
 
UBM Al/NiV/Cu: Total Thickness: 16K Å  Al= 4K Å / NiV= 4K Å / Cu= 8K Å
Metal Thickness: 8.9K Å   (Pitch 152µm)    17K Å   (Pitch 204~457µm)
Passivation Thickness: 8K Å   (Pitch 152~204µm)    10K Å   (Pitch 254~457µm)
 
Standard Passivation Type: Nitride
 
Optional Polyimide Passivation provides:
Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination.
 
Options and Accessories:
Quartz die available with and without bumps (without daisy chain)
5-inch wafers available for all items.
Tape and reel (T&R) packaging available special order.
 
Geometries  •   UBM  •   Bumps  •   Eutectic Properties
 
 
 
 
 
 
Unbumped Die (Al Pads) with Daisy Chain and Passivation Openings for Wire Bonding
Pads Pad Matrix Pitch Die Size
(mm)
Passivation
Opening
Diameter
Tray Qty Metal Backing
For Eutectic
Soldering
Mount with
Die Attach
Adhesives
Order Number
Ref Quick View
48 12x12
Perimeter
457µm 6.3mm 100~150µm 25pcs
Waffle 2"
FCN48D6.3A457M-DC FCN48D6.3A457-DC FBT250
88 22x22
Perimeter
204µm 5.08mm 80~100µm 36
Waffle 2"
FCN88G5.08A204M-DC FCN88G5.08A204-DC PB08
112 28x28
Perimeter
152.5µm 5.08mm 55~86µm 36pcs
Waffle 2"
FCN112K5.08A152M-DC FCN112K5.08A152-DC PB06
176 44x44
Perimeter
204µm 10mm 80~100µm 49pcs
Waffle 4"
FCN176G10A204M-DC FCN176G10A204-DC PB08
x4
Geometries  •   See 12 more wire bondable Test Die
        
 
 




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