NASA Marshall Space Flight Center developed a novel way to attenuate destructive vibratory forces to reduce damage in printed circuit assemblies.
This innovation extends the life of the card assembly including IC packages that operate under harsh environments, thermal stress and vibration
The PID is mounted near the geometric center of the PC board assembly where vibratory forces are the greatest.
The kinetic energy is transfer to the PID to dampen vibration in the circuit card assembly.
PID provides more reduction in vibration than using alternative methods of adding heavy metal supports, bumpers or increasing the thickness of the PC board.
PID are commercially available COTS components. Mounting methods include: standard surface mount soldering, snap-in throughhole, screw mounting and epoxy mounting with permanent adhesives. Engineering development kits are currently under development.More Details >>.