PST Thermal Die
Wire Bondable
 
 
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Thermal Test Die
Wire Bondable Pads
 
 
 
PST Series - Thermal Test Die with Resistive Heaters
Nbr
Pads
Features Pitch Die Size
(mm)
Die
Thickness
Waffle Tray
Qty
5" Wafer
(125mm)
Die Qty
Bondable
Pad
Single Die
Part Number
Unsawn Wafer
Part Number
Photo Schematic
32 Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
X=230µm
Y=230µm
2.5mm
100 mil
100~635µm
4~25 mil
100 Die
2" Tray
1600 Die
5" Wafer
ø102µm
4.0 mil
PST1-G2.5A PSTW1-G2.5A
□122µm
4.8 mil
PST1-B2.5A PSTW1-B2.5A
21 Heating Elements
2x Resistive Heaters

Temperature Sense
5x Serial Diode Sensor
X=460µm
Y=690µm
3.81mm
150 mil
100~635µm
4~25 mil
64 Die
2" Tray
700 Die
5" Wafer
ø100µm
4.0 mil
PST2-G3.8A PSTW2-G3.8A
Ø127µm
5.5 mil
PST2-N3.8A PSTW2-N3.8A
□150µm
5.9 mil
PST2-C3.8A PSTW2-C3.8A
76 Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
X=231µm
Y=231µm
5.08mm
200 mil
100~635µm
4~25 mil
36 Die
2" Tray
340 Die
5" Wafer
□120µm
4.7 mil
PST3-B5A PSTW3-B5A
48 Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner
X=381µm
Y=508µm
6.35mm
250 mil
100~635µm
4~25 mil
25 Die
2" Tray
236 Die
5" Wafer
Ø100µm
4.0 mil
PST4-G6.3A PSTW4-G6.3A
60 Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner
X=381µm
Y=508µm
7.8mm
306 mil
100~635µm
4~25 mil
64 Die
4" Tray
146 Die
5" Wafer
Ø182µm
7.2 mil
PST5-U7.8A PSTW5-U7.8A
82 Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner
X=381µm
Y=508µm
10mm
400 mil
100~635µm
4~25 mil
49 Die
4" Tray
80 Die
5" Wafer
□183µm
7.2 mil
PST6-D10A PSTW6-D10A
Note 1: Standard Die thickness 635um (25MIL)
Note 2: Thinning available: 500um (20MIL), 430um (17MIL), 360um (14MIL), 250um (10MIL), 200um (8MIL), 150um (6MIL), 100um (4MIL)
Note 3: JEDEC Moisture Sensitivity Level MSL-1.
Note 4: Applications: Use PST series test die to heat semicoductor packages and measure changes in temperatures, ΘJC and ΘJA. A four pad layout allows Kelvin connections. A temperature monitoring circuit uses a bridge network. Chips include serial five-diode temperature sense network. Power up to 2.5W per die.
Note 5: Stack Die: Multiple die can be thinned to 127um (5mils) and stacked in offset pryamid fashion for easy wire bonding. Use 0.0381mm thick non-conductive die attach material between PST-2 to PST-4 and PST-4 to PST-6. Use electrically conductive die attach material between PST-6 and the substrate.
Note 6: Resistive Heaters: All die have dual resistive heaters connection Rs to Rf. Typically powered 0 to 3.5V at 160mA (0.5W)
Note 7: Temperature Sense Network: All PST series die have serial five-diodes to sense temperature.
Note 8: Meets JEDEC specification EIA/JESD51-4.
 
   

Wafer Box Cassette

(Closed) Wafer Shipper (Open)
Rotatable Model Rotatable Model
       
 
 
 
Test Die Part Numbering System
PST 1 - G 2.5 A - BG250 W
Thermal Die PST Series   Pad Size Die Size (mm) Pad   Backgrind
Option
Packaging
Options
PST = Single Die
PSTW = Wafer 5"
1 ~ 6   B = □120µm - 4.7 mil
C = □150µm - 6.0 mil
D = □183µm - 7.2 mil
G = Ø100µm - 4.0 mil
N = Ø127µm - 5.0 mil
U = Ø182µm - 7.1 mil
2.5 - 100 mil (PST1)
3.8 - 150 mil (PST2)
5 = - 200 mil (PST3)
6.3 - 250 mil (PST4)
7.8 - 307 mil (PST5)
10 - 400 mil (PST6)
Other sizes available
Wire-Bond
A = Al98%/Si1%/Cu1%

  Ball  
E = Sn63/PB37
C = SAC305
  Thickness Example:
BG200 = 200µm = 8mil

BG250 = 250µm = 10mil

Blank = 635µm = 25mil
Single Die:
W = 2" Waffle Pack
P = 4" Waffle Pack


Unsawn Wafer:
C = Cassette
J = Jar/Clam Shell
Al98%/Si1%/Cu1% Pads
Drawing Numbering System
   1       2       5       2       0       0   
PST Bonding/Ball PST Series / Die Size Packaging Thickness Bond Pad Size Variation
1 = PST Series
Wire Bond Pads


2 = PST Series
With Solder Balls
Or Bumps
1 = PST1 (2.5mm - 100 mil)
2 = PST2 (3.81mm - 150 mil)
3 = PST3 (5.08mm - 200 mil)
4 = PST4 (6.35mm - 250 mil)
5 = PST5 (7.8mm - 307 mil)
6 = PST6 (10mm - 400 mil)
Single Die:
0 = 4" Waffle Tray (P)
5 = 2" Waffle Tray (W)


Unsawn Wafer Format:
7 = Clam Shell, Cassette, etc
0 = 635um (25mil)
1 = 250um (10mil)
2 = 200um (8mil)
3~9 = Other
PST1
0 = Ø102µm
2 = SQ122µm

PST2
0 = Ø100µm
1 = Ø127µm
3 = SQ150µm

PST3
2 = SQ120µm

PST4
0 = Ø100µm

PST5
4 = Ø182µm

PST6
5 = SQ183µm

0 = Standard
1~9 = Other
 
 
 
        
 
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

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