Patents & Trademarks
 
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Patents Owned by TopLine
Patents
U.S. Patent Nbr Field Product Brief Date Google
Patent
Download Note
9,629,259 B1 CGA
Column Grid Array
FLIP-PACK® Refillable apparatus for aligning and dispensing solder columns in an array 2017
Granted
Google PDF  
9,521,753 B1 Vibration
Attenuation
PID
Particle Impact Damper
Vibration damping
circuit card assembly
2016
Granted
Google PDF NASA
License
9,108,262 B1 CGA
Column Grid Array
PIN-PACK® Disposable apparatus for aligning and dispensing solder columns in an array 2015
Granted
Google PDF  
D808,350 S CGA
Column Grid Array
Graphite Fixture for delivering interconnect members onto a substrate. 2018
Granted
     
Pending Vibration
Attenuation
Tunable PID
Particle Impact Damper
Vibration damping
circuit board assembly
2017
Pending
     
Pending Vibration
Attenuation
Quick Response PID
Particle Impact Damper
Vibration damping
circuit board assembly
2017
Pending
     
D512970 S1 Integrated Circuits QFP
Lead Straightener
Universal lead straightener for integrated circuit devices 2005
Granted
Google PDF  
 
 
 
 
Trademarks
Trademark Goods & Services First
Use
Year Registration
Class 9. Electronic Components, namely, Integrated Circuits, Microprocessors, Capacitors, Resistors, Transistors, Diodes, Chips, Inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2013
Registered
USPTO
Registration
4,313,144
TOPLINE® Class 9. Computer chips; integrated circuits; integrated circuit components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; semiconductors; semiconductor chips; semiconductor components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2014
Registered
USPTO
Registration
4,591,591
PIN-PACK® Class 9. Computer Chips; integrated circuits; integrated circuit components; semiconductos; semiconductor chips; semiconductor components; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, quad flat packs, flip chips, ball grid arrays and printed circuit boards. 2014 2015
Registered
USPTO
Registration
4,727,622
FLIP-PACK® Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2015 2017
Registered
USPTO
Registration
5,250,619
Inspired by GravityTM Class 9. Electronic components namely, particle impact dampers
for attenuating vibration in printed circuit boards and mechanical assemblies.
2016 2018
Published
USPTO
Serial
87/640,243
Class 9. Electronic components, namely, Integrated Ciruits and Quad Flat Packs 2007   -
 
 
 



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