Patents & Trademarks
 
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Patents Owned by TopLine
Patents
Patent Nbr Field Product Brief Date Google
Patent
Download Note
US 9,629,259 B1 CGA
Column Grid Array
FLIP-PACKTM Refillable apparatus for aligning and dispensing solder columns in an array 2017 Google PDF  
US 9,521,753 B1 Vibration Attenuation PID
Particle Impact Damper
Vibration damping circuit card assembly 2016 Google PDF NASA
License
US 9,108,262 B1 CGA
Column Grid Array
PIN-PACK® Disposable apparatus for aligning and dispensing solder columns in an array 2015 Google PDF  
Pending CGA
Column Grid Array
Graphite Fixture for delivering interconnect members onto a substrate. Pending Google PDF  
US D512,970 S1 Integrated Circuits QFP
Lead Straightener
Universal lead straightener for integrated circuit devices 2005 Google PDF  
 
 
 
 
Trademarks
Trademark Goods & Services First
Use
Year Registration
Class 9. Electronic Components, namely, Integrated Circuits, Microprocessors, Capacitors, Resistors, Transistors, Diodes, Chips, Inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2013
Registered
USPTO
Registration
4,313,144
TOPLINE® Class 9. Computer chips; integrated circuits; integrated circuit components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; semiconductors; semiconductor chips; semiconductor components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2014
Registered
USPTO
Registration
4,591,591
PIN-PACK® Class 9. Computer Chips; integrated circuits; integrated circuit components; semiconductos; semiconductor chips; semiconductor components; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, quad flat packs, flip chips, ball grid arrays and printed circuit boards. 2014 2015
Registered
USPTO
Registration
4,727,622
FLIP-PACKTM Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2015 2016
Filed

Published
2017
USPTO
Serial
8,728,4743
Inspired by Gravity℠ Class 9. Electronic components, namely, particle impact dampers 2016   -
Class 9. Electronic components, namely, Integrated Ciruits and Quad Flat Packs 2007   -
 
 
 



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