WLP / WL-CSP
Wafer Level Package
 
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WLP Wafer Level Package
Copper Pillar Design

 
0.3mm pitch WLP - Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size □ Tape
& Reel
Tray Qty
4" Waffle Pack
Ref Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.3mm 0.6mm
Call 484
2"-Tray
TEG0306
0.56□
WLP4T.3C-DC022D   360 ° Model   360 ° Daisy Chain
16 4x4 0.3mm 1.2mm
W=8mm
P=4mm
400
2"-Tray
TEG0306
1.16□
WLP16T.3C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.3mm 1.8mm
W=8mm
P=4mm
100
2"-Tray
TEG0306
1.76□
WLP36T.3C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.3mm 2.4mm
W=12mm
P=8mm
100
2"-Tray
TEG0306
2.36□
WLP64T.3C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.3mm 3.0mm
W=12mm
P=8mm
256 TEG0306
2.96□
WLP100T.3C-DC108D   360 ° Model   360 ° Daisy Chain
144 12x12 0.3mm 3.6mm
W=12mm
P=8mm
196 TEG0306
3.56□
WLP144T.3C-DC127D   360 ° Model   360 ° Daisy Chain
196 14x14 0.3mm 4.2mm
W=12mm
P=8mm
49p 2"-Tray
196p 4"-Tray
TEG0306
4.16 □
WLP196T.3C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.3mm 4.8mm
W=12mm
P=8mm
144 TEG0306
4.76 □
WLP256T.3C-DC168D   360 ° Model   360 ° Daisy Chain
264 17x17
6-row
0.3mm 6mm
W=16mm
P=12mm
121 WLP264
5.96□
WLP264T.3C-DC173D   360 ° Model   360 ° Daisy Chain
400 20x20 0.3mm 6mm
W=16mm
P=12mm
121 TEG0306
5.96□
WLP400T.3C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.3mm 7.8mm
W=16mm
P=12mm
72 TEG0306
7.76□
WLP676T.3C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.3mm 9.0mm
- 49 TEG0306
8.96□
WLP900T.3C-DC307D   360 ° Model   360 ° Daisy Chain
1600 40x40 0.3mm 12.0mm
- 36 TEG0306
11.96□
WLP1600T.3C-DC407D   360 ° Model   360 ° Daisy Chain
2500 50x50 0.3mm 15.0mm
- 25 TEG0306
14.96□
WLP2500T.3C-DC507D   360 ° Model   360 ° Daisy Chain
6400 80x80 0.3mm 24.0mm
- 9 TEG0306
23.96□
WLP6400T.3C-DC807D   360 ° Model   360 ° Daisy Chain
Pitch = 0.3mm    Ball diameter 0.20mm    Cu Pad diameter 0.15mm
Other ball count available.   More sizes available
Seated Height (including balls) 0.57mm (+/- 0.03mm)

X/Y Size Body Formula= (Matrix -1) x 0.3mm + 0.3mm
 
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
0.4mm pitch WLP Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size
Tape
& Reel
Tray Qty
4" Waffle Pack
Ref Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.4mm 0.8mm
W=8mm
P=4mm
100
2"-Tray
TEG0408
0.76□
WLP4T.4C-DC022D   360 ° Model   360 ° Daisy Chain
16 4x4 0.4mm 1.6mm
W=8mm
P=4mm
100p 2"-Tray
289p 4"-Tray
TEG0408
1.56□
WLP16T.4C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.4mm 2.4mm
W=12mm
P=8mm
100p 2"-Tray
529p 4"-Tray
TEG0408
2.36□
WLP36T.4C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.4mm 3.2mm
W=12mm
P=8mm
256 TEG0408
3.16□
WLP64T.4C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.4mm 4mm
W=12mm
P=8mm
196 TEG0408
3.96□
WLP100T.4C-DC108D   360 ° Model   360 ° Daisy Chain
144 12x12 0.4mm 4.8mm
W=12mm
P=8mm
144 TEG0408
4.76□
WLP144T.4C-DC127D   360 ° Model   360 ° Daisy Chain
144 13x13
4-Row
0.4mm 6mm
W=16mm
P=12mm
121 WLP144
5.96□
WLP144T.4C-DC133D   360 ° Model   360 ° Daisy Chain
196 14x14 0.4mm 5.6mm
W=12mm
P=8mm
121 TEG0408
5.56□
WLP196T.4C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.4mm 6.4mm
W=16mm
P=12mm
121 TEG0408
6.36□
WLP256T.4C-DC168D   360 ° Model   360 ° Daisy Chain
400 20x20 0.4mm 8mm
W=16mm
P=12mm
72 TEG0408
7.96□
WLP400T.4C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.4mm 10.4mm
- 49 TEG0408
10.36□
WLP676T.4C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.4mm 12mm
- 36 TEG0408
11.96□
WLP900T.4C-DC307D   360 ° Model   360 ° Daisy Chain
Pitch = 0.4mm    Ball diameter 0.25mm    Cu Pad diameter 0.20mm
More Sizes available
Seated Height (including balls) 0.61mm (+/- 0.03mm)

X/Y size formula = (Matrix -1) x 0.4mm + 0.4mm
 
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
0.5mm pitch WLP - Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size □ Tape
& Reel
Tray Qty
4" Waffle Pack
Ref. Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.5mm 1.0mm
W=8mm
P=4mm
100
2"-Tray
TEG0510
0.96□
WLP4T.5C-DC022D   360 ° Model   360 ° Daisy Chain
6 2x3 0.5mm 1.0x1.5mm
W=8mm
P=2mm
call - WLP6T.5C-DC023D - -
8 2x4 0.5mm 1.0x2.0mm
W=8mm
P=4mm
204
2"-Tray
TEG0510
0.96x1.96
WLP8T.5C-DC024D   360 ° Model   360 ° Daisy Chain
16 4x4 0.5mm 2.0mm
W=8mm
P=4mm
529 TEG0510
1.96□
WLP16T.5C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.5mm 3.0mm
W=12mm
P=8mm
256 TEG0510
2.96□
WLP36T.5C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.5mm 4.0mm
W=12mm
P=8mm
196 TEG0510
3.96□
WLP64T.5C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.5mm 5.0mm
W=12mm
P=8mm
144 TEG0510
4.96□
WLP100T.5C-DC108D   360 ° Model   360 ° Daisy Chain
112 11x11
4-Row
0.5mm 6.0mm
W=16mm
P=12mm
121 WLP112
5.96□
WLP112T.5C-DC113D   360 ° Model   360 ° Daisy Chain
144 12x12 0.5mm 6.0mm
W=16mm
P=12mm
121 TEG0510
5.96□
WLP144T.5C-DC127D   360 ° Model   360 ° Daisy Chain
196 14x14 0.5mm 7.0mm
W=16mm
P=12mm
81 TEG0510
6.96□
WLP196T.5C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.5mm 8.0mm
W=16mm
P=12mm
72 TEG0510
7.96□
WLP256T.5C-DC168D   360 ° Model   360 ° Daisy Chain
400 20x20 0.5mm 10mm
- 49 TEG0510
9.96□
WLP400T.5C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.5mm 13mm
- 25 TEG0510
12.96□
WLP676T.5C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.5mm 15mm
- 25 TEG0510
14.96□
WLP900T.5C-DC307D   360 ° Model   360 ° Daisy Chain
Pitch = 0.5mm    Ball diameter 0.30mm    Cu Pad Diameter 0.25mm
More Sizes available
Seated Height (including balls) 0.64mm (+/- 0.03mm)

X/Y Size Formula = (Matrix -1) x 0.5mm + 0.5mm
 
Ball Alloy:
Standard Ball type C = SAC305 (Sn96.5/Ag3.0/Cu0.5)    Example: WLP400T.3C-DC208
 
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
WLP - Ball Information - Before Reflow
          Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm    
        Ø Cu Pad 0.15mm 0.20mm 0.25mm
   
        Ø Solder Ball 0.20mm 0.25mm 0.30mm
   
 
WLP - Ball Information - After Reflow
          Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm    
        Ball Width 0.20mm 0.26mm 0.31mm
   
        Ball Height 0.17mm 0.21mm 0.24mm
   
 
eWLP Pad Size - Embedded Die in PCB
          Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm    
        Ø Cu Pad 0.15mm 0.20mm 0.25mm
   
        Flatness
Tolerance
+/-20µm +/-20µm +/-20µm    
        Backgrind
With Extra
Fine-Polish
#2000
Grit
#2000
Grit
#2000
Grit
   
 
All WLP devices are rated JEDEC Moisture Sensitivity Level MSL-1
Width of Daisy Chain tracing between ball pads is 20µm
Material of RDL is Low-K Cu 99% pure
Passivation: Polyimide 4um thick
Encapsulation: Epoxy resin structure 50um thick
 
 
WLP Cross Section
Copper Pillar Design.
 
 
WLP Encapsulation Material Properties
 
 
WLP Drawing Numbering System
    5         4         127         0    
Series Pitch Daisy Chain
Ball Matrix
Packaging
5 = WLP With Ball Balls (400um)
Standard

6 = eWLP Without Balls (200um)
50um Cu Post Embedded Application

Special:
7 = eWLP Without Balls (360um)
50 Cu Post Embedded Application

8 = eWLP Without Balls (200um)
10 Cu Post Embedded Application
3 = 0.3mm
4 = 0.4mm
5 = 0.5mm

Special:
6 = 0.65mm
Row/Column Matrix
First 2-digits

Daisy Chain Pattern
3rd digit

999 Unsawn Wafer
Tray:
0 = 4-inch Waffle Pack (T)
8 = 2-inch Waffle Pack (W)
6 = JEDEC Tray (J) Thin Tray
7 = JEDEC Tray (H) Thick Tray

Carrier Tape:
1 = T&R Reel (E7A or E13A) Ball Down
2 = Cut Tape - (E)

Wafer Format:
3 = Sawn Wafer UV Tape & Ring (Full)
4 = Sawn Wafer UV Tape & Ring (Partial)
5 = Unsawn Wafer, Without Ring

 
 
 
WLP Part Numbering System
    WLP         196         T         .4         C         -  DC148         D    
Series Nbr Balls Package Code Pitch Ball Alloy Daisy Chain
Pattern
Die
Si
WLP = With Ball Balls

eWLP = Without Balls
Embedded Application
4 ~ 2500 T = 4-inch Waffle Tray
W = 2-inch Waffle Tray
J = JEDEC Tray Thin Tray
H = JEDEC Tray Thick Tray

E = Tape cut without leader
E7A = T&R 7-inch Reel
E13A = T&R 13-inch Reel

U = Sawn Wafer
On UV Tape
Wafer Ring
3 = 0.3mm
4 = 0.4mm
5 = 0.5mm

Special:
6 = 0.65mm
C=SAC305
Sn96.5/Ag3.0/Cu0.5



Blank= Pure Cu Pillar
Without Solder Balls
For embedded Application
eWLP only
Row/Column Matrix
With Daisy Chain
Pattern
Thickness (WLP Pad Down):
D = 400µm


Backgrind eWLP (Pad Down):
D1= 200µm Thick
10um Cu Post

D2= 200µm Thick
50um Cu Post

D3= 360µm Thick
50um Cu Post

Backgrind eWLP (Pad Up):
U1= 200µm Thick
10um Cu Post

U2= 200µm Thick
50um Cu Post

Not Recommended:
251µm ~ 359µm


 
 
 
 
 
        
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv



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