WLP / WL-CSP Wafer Level Package   0.3mm  0.4mm  0.5mm  More BGA   More Products   Home   WLP Wafer Level Package Copper Pillar Design 0.3mm pitch WLP - Wafer Level Package Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty 4" Waffle Pack SnPb SnAgCu Lead Free - RoHS 196 14x14 0.3mm 4.2mm Si 225 - WLP196T.3C-DC148D 264 17x17 6-row 0.3mm 6mm Si 100 - WLP264T.3C-DC173D 400 20x20 0.3mm 6mm Si 100 - WLP400T.3C-DC208D 676 26x26 0.3mm 7.8mm Si 64 - WLP676T.3C-DC260D Pitch = 0.3mm    Ball diameter 0.20mm    Cu Pad diameter 0.15mm Other ball count available.   More sizes available Seated Height (including balls) 0.57mm (+/- 0.03mm) X/Y Size Body Formula= (Matrix -1) x 0.3mm + 0.3mm   0.4mm pitch WLP Wafer Level Package Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty 4" Waffle Pack SnPb SnAgCu Lead Free - RoHS 100 10x10 0.4mm 4mm Si 225 - WLP100T.4C-DC108D 144 13x13 4-Row 0.4mm 6mm Si 100 - WLP144T.4C-DC133D 196 14x14 0.4mm 5.6mm Si 100 - WLP196T.4C-DC148D 256 16x16 0.4mm 6.4mm Si 64 - WLP256T.4C-DC168D 309 18x18 7-Row 0.4mm 7.6mm Si 64 - WLP309T.4C-DC187D 400 20x20 0.4mm 8mm Si 64 - WLP400T.4C-DC208D 676 26x26 0.4mm 10.4mm Si 49 - WLP676T.4C-DC260D 900 30x30 0.4mm 12mm Si 36 - WLP900T.4C-DC307D Pitch = 0.4mm    Ball diameter 0.25mm    Cu Pad diameter 0.20mm More Sizes available Seated Height (including balls) 0.61mm (+/- 0.03mm) X/Y size formula = (Matrix -1) x 0.4mm + 0.4mm   0.5mm pitch WLP - Wafer Level Package Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty 4" Waffle Pack SnPb SnAgCu Lead Free - RoHS 64 8x8 0.5mm 4mm Si 225 - WLP64T.5C-DC088D 112 11x11 4-Row 0.5mm 6mm Si 100 - WLP112T.5C-DC113D 144 12x12 0.5mm 6mm Si 100 - WLP144T.5C-DC127D 256 16x16 0.5mm 8mm Si 64 - WLP256T.5C-DC168D 400 20x20 0.5mm 10mm Si 49 - WLP400T.5C-DC208D 676 26x26 0.5mm 13mm Si 36 - WLP676T.5C-DC260D 900 30x30 0.5mm 15mm Si 25 - WLP900T.5C-DC307D Pitch = 0.5mm    Ball diameter 0.30mm    Cu Pad Diameter 0.25mm More Sizes available Seated Height (including balls) 0.64mm (+/- 0.03mm) X/Y Size Formula = (Matrix -1) x 0.5mm + 0.5mm   Ball Alloy: Standard Ball type C = SAC305 (Sn96.5/Ag3.0/Cu0.5)    Example: WLP400T.3C-DC208 Alternate Ball type C1 = LF35-SAC105 (Sn98.3/Ag1.2/Cu0.5)    Example: WLP400T.3C1-DC208   Ball Information - Before Reflow       Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm         Cu Pad 0.15mm 0.20mm 0.25mm         Solder Ball 0.20mm 0.25mm 0.30mm       Ball Information - After Reflow       Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm         Ball Width 0.20mm 0.26mm 0.31mm         Ball Height 0.17mm 0.21mm 0.24mm       All WLP devices are rated JEDEC Moisture Sensitivity Level MSL-1 Width of Daisy Chain tracing between ball pads is 20µm     WLP Cross Section Copper Pillar Design                  0.3mm  0.4mm  0.5mm  More Products   Home     Top of Page   TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000  •  Fax: 1-478-451-3000 Email: sales@topline.tv ©2010 TopLine. All Rights Reserved. Home