Mirrored & Patterned
Dummy Mechanical Si Wafers
 
 
 
Mechanical Dummy Wafers and Die
Mirrored and Etched Patterns
Experimental use in Lab
Variety of Applications
 
Go to Dummy Die
Quick Specs:
Wafer Material: Si (Silicon)
Wafer size 4~12 inch (100~300mm)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks

 
Wafer Part Numbering System
WM 8 BG250 - C
Wafer Type Size Code Inch Back Grinding
Thickness µm
  Packaging
WM=Mirrored
Mechancial Wafer

WE=Etched
Patterned Wafer

WMD=Sawn
Mirrored Wafer

MED=Sawn
Etched Wafer
4-inch (100mm)
5-inch (125mm)
6-inch (150mm)
8-inch (200mm)
12-inch (300mm)
Blank= No Backgrinding

BG100=100µm
BG200=200µm
BG300=300µm

All thickness available
  C = Cassette
J = Jar (Coin Stack)
B = Bulk Coin Stack
H = Hoop
NTR = Nitto Tape & Ring
UVR = UV Tape & Ring
Variety of options are available. Please tell us your application.
 
Die Part Numbering System
MD - 5x5mm BG250 - WP2
Die Type - Size in millimeter Back Grinding
Thickness µm
  Packaging
MD=Mirrored
Mechancial
Die

ED=Etched
Patterned Die
- All sizes available
0.25 ~ 25mm
Blank= No Backgrinding

BG100=100µm
BG200=200µm
BG300=300µm

All thickness available
  WP2 = Waffle Pack 2-inch
WP4 = Waffle Pack 4-inch
H = Hoop
NTR = Nitto Tape & Ring
UVR = UV Tape & Ring
Variety of options and packaging are available. Tell us your application.
 
Wafer & Die Ordering Information
Wafer Size Wafer
Jar
Wafer
Cassette
Wafer
Tape & Ring
Die
Sawn Wafer
Tape & Ring
Die
Singulated
Waffle Pack
4-Inch
100mm
WM4-J
Mirrored Wafer

WE4-J
Etched Wafer
WM4-C
Mirrored Wafer

WE4-C
Etched Wafer
WM4-NTR
Mirrored Wafer

WE4-NTR
Etched Wafer
WMD4-mm x mm-NTR
Mirrored Wafer

WED4-mm x mm-NTR
Etched Wafer
MD - mm x mm-WP2
Mirrored Die

ED - mm x mm-WP2
Etched Die
5-Inch
125mm
WM5-J
Mirrored Wafer

WE5-J
Etched Wafer
WM5-C
Mirrored Wafer

WE5-C
Etched Wafer
WM5-NTR
Mirrored Wafer

WE5-NTR
Etched Wafer
WMD5-mm x mm-NTR
Mirrored Wafer

WED5-mm x mm-NTR
Etched Wafer
MD - mm x mm-WP2
Mirrored Die

ED - mm x mm-WP2
Etched Die
6-Inch
150mm
WM6-J
Mirrored Wafer

WE6-J
Etched Wafer
WM6-C
Mirrored Wafer

WE6-C
Etched Wafer
WM6-NTR
Mirrored Wafer

WE6-NTR
Etched Wafer
WMD6 - mm x mm-NTR
Mirrored Wafer

WED6 - mm x mm-NTR
Etched Wafer
MD - mm x mm-WP2
Mirrored Die

ED - mm x mm-WP2
Etched Die
8-Inch
200mm
WM8-J
Mirrored Wafer

WE8-J
Etched Wafer
WM8-C
Mirrored Wafer

WE8-C
Etched Wafer
WM8-NTR
Mirrored Wafer

WE8-NTR
Etched Wafer
WMD8 - mm x mm-NTR
Mirrored Wafer

WED8 - mm x mm-NTR
Etched Wafer
MD - mm x mm-WP2
Mirrored Die

ED - mm x mm-WP2
Etched Die
12-Inch
300mm
WM12-J
Mirrored Wafer

WE12-J
Etched Wafer
WM12-C
Mirrored Wafer

WE12-C
Etched Wafer
WM12-NTR
Mirrored Wafer

WE12-NTR
Etched Wafer
WMD12 - mm x mm-NTR
Mirrored Wafer

WED12 - mm x mm-NTR
Etched Wafer
MD - mm x mm-WP2
Mirrored Die

ED - mm x mm-WP2
Etched Die
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
 

Related Links:
Dummy Die   Test Die   Flip Chip  


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