Mirrored & Patterned
Dummy Mechanical Si Wafers
 
 
 
Mechanical Dummy Wafers and Die
Mirrored and Etched Patterns
Experimental use in Lab
Variety of Applications
 
Go to Dummy Die
Quick Specs:
Wafer Material: Si (Silicon)
Wafer size 4~12 inch (100~300mm)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks

 
Unsawn Wafer Part Numbering System
WM 8 - BG250 - C
Wafer Type Size Code Inch   Back Grinding
Thickness µm
  Packaging
WM=Wafer
Mirrored
Dummy
(Unsawn)

WE=Wafer
Etched
Patterned
(Unsawn)
4-inch (100mm)
5-inch (125mm)
6-inch (150mm)
8-inch (200mm)
12-inch (300mm)
  BG75=75µm
BG100=100µm
BG200=200µm
BG300=300µm
BG500=500µm

Blank= No Backgrinding

All thickness available
  C = Cassette
J = Jar (Coin Stack)
B = Bulk Coin Stack
H = Hoop
NT = Nitto Tape & Ring
UV = UV Tape & Ring
Variety of options are available.
Order Quantity: 1= 1 Full Wafer, 2=2 Full Wafers, 5= 5 Full Wafers, etc
Please tell us your application.
 
Sawn Wafer Part Numbering System
WMD - 1.0 - BG250 - NT8
Wafer Type   Die Size (mm)   Back Grinding
Thickness µm
  Packaging
WMD=Wafer
Mirrored Die
(Sawn)

WED=Wafer
Etched Die
(Sawn)
  Example:
1.0 = 1.0mm SQ
2.5 = 2.5mm SQ
5.0 = 5.0mm SQ
12 = 12mm SQ

2.3x5.1 =
2.3mm x5.1mm
Rectangle

All Sizes Available
  Example:
BG75=75µm
BG100=100µm
BG200=200µm
BG300=300µm
BG500=500µm

Blank= Not Specified


All thickness available
  Sawn Wafer:
NH8 = Plastic Hoop 8" Ring (Non-UV)
UH8 = Plastic Hooop 8" Ring (UV Tape)
NT8 = Dicing Tape 8" Ring
NH8 = Plastic Hoop 8" Ring
NT12 = Dicing Tape 12" Ring
UV8 = UV Tape 8" Ring
UV12 = UV Tape 12" Ring
Variety of options are available.
Order Quantity: 1= 1 Full Wafer, 2=2 Full Wafers, 5= 5 Full Wafers, etc
Please tell us your application.
 
Single Die Part Numbering System
MD - 4.7x8.0 BG250 - W
Die Type - Size in millimeter Back Grinding
Thickness µm
  Packaging
MD=Mirrored
Mechancial
Die

ED=Etched
Patterned Die
  Example Square Die:
0.6 = 0.6mm SQ
1.0 = 1.0mm SQ
2.5 = 2.5mm SQ
5.0 = 5.0mm SQ
12 = 12mm SQ

Example Rectangle Die
2.3x5.1 =
2.3mm x5.1mm

All Sizes Available
0.25 ~ 25mm
Blank= No Backgrinding

BG100=100µm
BG200=200µm
BG300=300µm

All thickness available
  W = Waffle Pack 2-inch
P = Waffle Pack 4-inch

H = Hoop
NTR = Nitto Tape & Ring
UV = UV Tape & Ring

NH8 = Plastic Hoop 8" Ring (Non-UV)
UH8 = Plastic Hooop 8" Ring (UV Tape)

NT8 = Dicing Tape 8" Ring
NH8 = Plastic Hoop 8" Ring

UV8 = UV Tape 8" Ring

NT12 = Dicing Tape 12" Ring
UV12 = UV Tape 12" Ring
Variety of options and packaging are available.
Order Quantity = Sold by number of die
Tell us your application.
 
Wafer & Die Ordering Information
Wafer Size Wafer
Jar
Wafer
Cassette
Wafer
Tape & Ring
Die
Sawn Wafer
Tape & Ring
Die
Singulated
Waffle Pack
4-Inch
100mm
WM4-J
Mirrored Wafer

WE4-J
Etched Wafer
WM4-C
Mirrored Wafer

WE4-C
Etched Wafer
WM4-NTR
Mirrored Wafer

WE4-NTR
Etched Wafer
WMD4-mm x mm-NTR
Mirrored Wafer

WED4-mm x mm-NTR
Etched Wafer
MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
5-Inch
125mm
WM5-J
Mirrored Wafer

WE5-J
Etched Wafer
WM5-C
Mirrored Wafer

WE5-C
Etched Wafer
WM5-NTR
Mirrored Wafer

WE5-NTR
Etched Wafer
WMD5-mm x mm-NTR
Mirrored Wafer

WED5-mm x mm-NTR
Etched Wafer
MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
6-Inch
150mm
WM6-J
Mirrored Wafer

WE6-J
Etched Wafer
WM6-C
Mirrored Wafer

WE6-C
Etched Wafer
WM6-NTR
Mirrored Wafer

WE6-NTR
Etched Wafer
WMD6 - mm x mm-NTR
Mirrored Wafer

WED6 - mm x mm-NTR
Etched Wafer
MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
8-Inch
200mm
WM8-J
Mirrored Wafer

WE8-J
Etched Wafer
WM8-C
Mirrored Wafer

WE8-C
Etched Wafer
WM8-NTR
Mirrored Wafer

WE8-NTR
Etched Wafer
WMD8 - mm x mm-NTR
Mirrored Wafer

WED8 - mm x mm-NTR
Etched Wafer
MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
12-Inch
300mm
WM12-J
Mirrored Wafer

WE12-J
Etched Wafer
WM12-C
Mirrored Wafer

WE12-C
Etched Wafer
WM12-NTR
Mirrored Wafer

WE12-NTR
Etched Wafer
WMD12 - mm x mm-NTR
Mirrored Wafer

WED12 - mm x mm-NTR
Etched Wafer
MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
 

Related Links:
Dummy Die   Test Die   Flip Chip  


TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv  •   Home