901000 Kit

Flip Chip Kit
FC176 203µm (8 mils) Pitch
K&S PB08-400x400 (old FTC PB8 4x4)

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Laminate FR4 board for placement and daisy chain continuity testing after assembly. Each substrate has 10 sites for mounting flip chips with 176 bumps 10.2mm x 10.2mm with 203µm pitch.

Laminate Substrate:

  • Tetra-functional double sided FR-4
  • Tg = 180°C
  • 3~8 micro-inch Gold flash over 100~200 microinches electroless nickel
  • 1/2-ounce copper thickness
  • Local and Global Fiducial Marks
  • traces 4 mil lines and spaces
  • Single Sided mounting 10-sites
  • Green LPI Solder Mask
  • Fingers .05" (1.27mm) pitch
  • Board 4" x 6" (100mm x 150mm)
  • Board Thickness .031" (0.8mm)
  • 4-tooling holes .125" (3.17mm)

  • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    Kit Order Number
    Laminate FR4 Board 1 5
    Flip Chip FC176 8 40

    Optional Accessories
    Parts Placement Data ASCII File
    Solder Paste Artwork, Gerber File
    Spare Board Only, Order Number 901001

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