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Pad Detail Other Kits
Laminate FR4 board for placement and daisy chain continuity testing after assembly.
Each substrate has 10 sites for mounting flip chips with 176 bumps 10.2mm x 10.2mm with 203µm pitch.
Tetra-functional double sided FR-4
Tg = 180°C
3~8 micro-inch Gold flash over 100~200 microinches electroless nickel
1/2-ounce copper thickness
Local and Global Fiducial Marks
traces 4 mil lines and spaces
Single Sided mounting 10-sites
Green LPI Solder Mask
Fingers .05" (1.27mm) pitch
Board 4" x 6" (100mm x 150mm)
Board Thickness .031" (0.8mm)
4-tooling holes .125" (3.17mm)