903000 Kit

Flip Chip Kit
FC317 254µm (10 mils) Pitch
K&S FA10-200x200 (old FTC FA10 2x2)


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Laminate FR4 board for placement and daisy chain continuity testing after assembly. Each substrate has 10 sites for mounting flip chips with 317 bumps 5.08mm x 5.08mm with 254µm pitch full array.


Laminate Substrate:

  • 4-Layer FR-4
  • Tg = 180°C
  • 3~8 micro-inch immersion Gold over electroless nickel
  • 1/4-oz copper, plated up to 1-oz
  • Local and Global Fiducial Marks
  • Traces 3 mil lines and spaces
  • Single Sided mounting 10-sites
  • Green LPI Solder Mask
  • Fingers .05" (1.27mm) pitch
  • Board 3.8" x 5.5" (96mm x 140mm)
  • Board Thickness .031" (0.8mm)
  • 4-tooling holes .125" (3.17mm)


    • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    903000
    Eutectic SnPb    		 Kit Order Number
    903002
    Eutectic SnPb    		 Kit Order Number
    903900
    Lead Free    		 Kit Order Number
    903901
    Lead Free
    Laminate FR4 Board
    Ni-Au ENIG    		 1 1 1 1
    Flip Chip FC317
    Eutectic SnPb Bumps    		 36 pcs 10 pcs - -
    Flip Chip FC317
    SAC Lead Free Bumps    		 - - 36 pcs 10 pcs

    Optional Accessories
    Parts Placement Data ASCII File - Order Number 903004
    Solder Paste Artwork, Gerber File, Order Number 903005
    Spare Board Only, Order Number 903001


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