903000 Kit

Flip Chip Kit
FC317 254µm (10 mils) Pitch
K&S FA10-200x200 (old FTC FA10 2x2)

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Laminate FR4 board for placement and daisy chain continuity testing after assembly. Each substrate has 10 sites for mounting flip chips with 317 bumps 5.08mm x 5.08mm with 254µm pitch full array.

Laminate Substrate:

  • 4-Layer FR-4
  • Tg = 180°C
  • 3~8 micro-inch immersion Gold over electroless nickel
  • 1/4-oz copper, plated up to 1-oz
  • Local and Global Fiducial Marks
  • Traces 3 mil lines and spaces
  • Single Sided mounting 10-sites
  • Green LPI Solder Mask
  • Fingers .05" (1.27mm) pitch
  • Board 3.8" x 5.5" (96mm x 140mm)
  • Board Thickness .031" (0.8mm)
  • 4-tooling holes .125" (3.17mm)

  • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    Laminate FR4 Board 1
    Flip Chip FA317 36

    Optional Accessories
    Parts Placement Data ASCII File - Order Number 903004
    Solder Paste Artwork, Gerber File, Order Number 903005
    Spare Board Only, Order Number 903001

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