Enlarge: Assembled Board (Top)
Board Size 4"x5.5" (10x14cm) Same pattern repeated on bottom side.
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TopLine Mixed Technology 1 Kit has fine-pitch QFP, SOIC, SOT, PLCC, SMT chips, DIP and more.
Board Features:
Choice of Final finish:
• Immersion Tin (Sn)
• ENIG (Ni/Au)Gold
• OSP Copper
• Immersion Silver
• HASL SnPb
LPI Solder Mask - PSR4000 AUS5
FR4 Tg=175°C
Size - 4"x5.5" (10x14cm)
Thickness 0.062" (1.6mm)
2-Layer Board
Lead Free RoHS Version
Plated Throughholes (PTH)
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
Enlarge:
Bare Board (Top)
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