BGA676 1.0mm Kit
with BGA100 0.8mm
Daisy Chain Ball Grid Array

Enlarge: Board    
Board Size 4.0"x5.5" (10x14cm)
Click for bottom view

Enlarge: BGA100 Daisy chain

Daisy Chain After Mounting BGA100		  

TopLine 998xxx series Kit has daisy chain mounting sites for BGA676 (DC269) with 1.0mm pitch and BGA100 (DC109) 0.8mm pitch. Solder mask defined pad for BGA676 is Ø18mils (Ø0.46mm). Solder mask defined pad for BGA100 is Ø15mils (Ø0.38mm).

Full chain loop BGA676 Daisy chain and BGA100 Daisy chain verify correct assembly with an ohm-meter at 2 test points per component. Practice reflow with heavy copper ground.

Pad Cu 1.0-oz (copper) 1.4mil (0.035mm) thickness on 4-layers.

Board Features:

  • Choice of Final finish:
        • ENIG (Ni/Au) Gold
  • LPI Solder Mask - PSR4000BN Green
  • FR4 Tg=170°C
  • Size - 4.0"x5.5" (10x14cm)
  • Thickness 0.062" (1.6mm)
  • 4-Layer Board - Heavy Ground
  • Heavy Copper Fill 1.0-Oz
  • Dog Bone Daisy Chain Pad outer layers
  • BGA pads repeated on Top and bottom
  • Tooling Holes .125" (3.17mm)
  • IPC Fiducials - 0.062" (1.57mm)

    Enlarge:  BGA676 Mounting Site
    Daisy Chain After Mounting BGA676

    		•
     
     
      BOM Kit Contents
    BGA676/BGA100 Kit
    Ask for Other Kit Quantities Available
    Kit BOM Components
    Per
    Board
    Order #
    998900
    1 Kit
    RoHS
    Order #
    998300
    1 Kit
    SnPb
    Order #
    998100
    1 Kit
    SnPb
    Order #
    998906
    6 Kits
    RoHS
    Order #
    998306
    6 Kits
    SnPb
    Order #
    998106
    6 Kits
    SnPb
    Order #
    998910
    10 Kits
    RoHS
    Order #
    998310
    10 Kits
    SnPb
    Order #
    998110
    10 Kits
    SnPb
    PC Board ENIG
    Gold (Ni/Au)    		 1 1 - 6 6 - 10 10 -
    PC Board HASL
    SnPb
    Tin-Lead    		 - - 1 - - 6 - - 10
    BGA676
    27mm SQ
    Pitch 1.0mm    		 SAC305
    RoHS    		 3 - - 18 - - 30 - -
    BGA676
    27mm SQ
    Pitch 1.0mm    		 Sn63/Pb37
    Tin-Lead    		 - 3 3 - 18 18 - 30 30
    BGA100
    10mm SQ
    Pitch 0.8mm    		 SAC305
    RoHS    		 3 - - 18 - - 30 - -
    BGA100
    10mm SQ
    Pitch 0.8mm    		 Sn63/Pb37
    Tin-Lead    		 - 3 3 - 18 18 - 30 30
     
     
    Free Download Solder Paste Gerber & Parts Placement Data
    Step 1. Click Here for TopLine's Document Center. Sign up and Log in.
    Step 2. Click link "Gerber Files"
    Step 3. Click link "998009a" BGA676 Board
    Step 4. Download files
     
     
    Spare Board Order Number System
    998 009
    Series Finish
    BGA676/BGA100 Board

    Size:
    4.0"x5.5"
    (10x14cm)    		 009 = ENIG (NiAu)
    001 = HASL (SnPb)


    Other final finish available.
     
    Spare Parts Daisy Chain
    Substrate Ball
    ØDiameter    		 Ball
    Material
    BGA676 Plastic PBGA Ø25mil
    0.63mm    		 Sn63/Pb37
    BGA676 Plastic PBGA Ø25mil
    0.63mm    		 SAC305
    Sn96.5/Ag3.0/Cu0.5
    BGA100 Plastic PBGA Ø16mil
    0.40mm    		 Sn63/Pb37
    BGA100 Plastic PBGA Ø15mil
    0.40mm    		 SAC305
    Sn96.5/Ag3.0/Cu0.5
    Other ball configurations available
     
     
     
     
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    95 Highway 22 W
    Milledgeville, GA 31061, USA
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    International: 1-478-451-5000
    Email: sales@topline.tv

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