Enlarge: Bare Board
Board Size 5.5"x8.0" (14x20cm) Click for bottom view
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TopLine CGA1752 Kit has 4 daisy chain (DC427) mounting sites for CGA1752. Copper pad is Ø28mils (Ø0.71mm). SRO Mask opening Ø 32mil (Ø0.82mm).
Test points for 4 loops continuity measurements after mounting CGA1752. Daisy chain CGA1752 to verify correct assembly with a ohm-meter at 3 pairs of test points. Loops include 2 outer rings and double inner rings under the die area. Other pads are grounded to practice reflow with very heavy copper ground.
Pad Cu (copper) thickness 3.7mil (0.094mm) equivalent to 2.6-oz copper on 4-layers.
Board Features:
Choice of Final finish:
• ENIG (Ni/Au)Gold
• ENEPIG (Ni/Pd/Au)
LPI Solder Mask - PSR4000BN Green
FR4 Tg=170°C
Size - 5.5"x8.0" (14x20cm)
Thickness 0.100" (2.5mm)
4-Layer Board - Heavy Ground
Heavy Copper Fill 2.6-Oz
Via in Pad Construction.
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
Enlarge:
CGA1752 Mounting Site
Click Daisy Chain After Mounting CGA1752
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