Ball Grid Array Kit
BGA352 and BGA400
with Daisy Chain Test


Actual Size: 4" x 5.5" (100 x 140mm) 		 

Kits are supplied with BGA352 Perimeter 1.27mm pitch and LBGA400 Full Array 1.5mm pitch.

BGA121 is not included.

Features:

  • Hot Air Soldering Leveling
  • LPI Solder Mask
  • FR4 Board .062"
  • Single Sided
  • Tooling Holes .125"
  • Fiducial Marks
  • Etched defined pads 0.89mm (35mils)diameter

    Enlarge Photo

    • After Mounting to Test Board
    BGA352 BGA400

        Manual Assembly Machine Run
    Component Pitch Order #
    917000
    1 Kit    		 Order #
    917006
    6 Kits    		 Order #
    917012
    12 Kits    		 Order #
    917024
    24 Kits    		 Order #
    917048
    48 Kits
    Board   1 6 12 24 48
    BGA 352 1.27mm 2 12 24 48 96
    LBGA 400 1.5mm 2 12 24 48 96

    Optional Accessories
    Parts Placement Data - X, Y, Theta ASCII File - Order Number 917005
    Solder Paste Artwork - Gerber File - Order Number 917004

    Spare Parts
    Components Quantity Order Number
    PC Board Only 1 917001


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    TopLine Corporation
    95 Highway 22 W
    Milledgeville, GA 31061, USA
    Toll Free USA/Canada (800) 776-9888
    International: 1-478-451-5000  •  Fax: 1-478-451-3000
    Email: Info