BQFP132 Kit
True 25 mil Pitch JEDEC Standard


Actual Size: 4" x 5.5" (100 x 140mm) 		 

     Learn to place and solder bumpered Quad Flat packs. The bumpers protect their leads during handling. Parts are supplied on tape and reel.

Features:

  • Hot Air Soldering Leveling
  • LPI Solder Mask
  • FR4 Board .062"
  • Double Sided
  • Tooling Holes .125"
  • Fiducial Marks


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    •   Manual
    Assembly    		 Machine Run
    Component Pitch
    Order #
    961300
    1 Kit
    Order #
    961306
    6 Kits
    Order #
    961312
    12 Kits
    Order #
    961325
    25 Kits
    Order #
    961350
    50 Kits
    Board   1 6 12 25 50
    BQFP132 25 mils 4 25 50 100 200

    Optional Accessories
    Parts Placement Data X, Y, Theta ASCII File Order Number 961304
    Solder Paste Artwork, Gerber File, Order Number 961305
    Solder Paste Stencil, Order Number 961309, Call for Details

    Spare Parts
    Components Quantity Order Number
    PC Board Only 1 961301
    BQFP132 1 100760
    BQFP132 25 229621
    BQFP132 50 229622


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