Patents & Trademarks   TopLine Home  •   USPTO Trademark Search  •  USPTO Patent Search 1  •   USPTO Patent Search 2  •   Google Patent Search   Patents Owned by TopLine Patents Patent Nbr Field Product Brief Date Google Patent Download Note TBA CCGA Column Grid Array Indium-Niobium Solder Columns Indium-Niobium Solder Columns for Cryogenic and Quantum Computers 2024 Utility Application TOPLIN.023A Google PDF   10,937,752 CCGA Column Grid Array Lead Free Solder Column Copper Core Lead Free Solder Columns and methods for making same 2021 Granted TOPLIN.022A Google PDF   CN 114055006 B CCGA Column Grid Array Lead Free Solder Column Copper Core Lead Free Solder Columns and methods for making same 2023 Granted TOPLIN.022CN Google PDF   D908648 CCGA Column Grid Array Graphite Fixture Adjustable fixture for aligning column grid array substrates 2021 Granted TOPLIN.021DA Google PDF   D874413 CGA1752 Column Grid Array Graphite Fixture Fixture for deliverying 1752 interconnect members onto a substrate 2020 Granted TOPLIN.018DA Google PDF   CN 111822899 B CCGA Column Grid Array Copper Braided Solder Column Solder Columns and methods for making same 2022 Granted TOPLIN.020CN Google En Google Zh PDF   10,477,698 B1 CCGA Column Grid Array Copper Braided Solder Column Solder Columns and methods for making same 2019 Granted TOPLIN.020A Google PDF   9,629,259 B1 CGA Column Grid Array FLIP-PACK® Refillable apparatus for aligning and dispensing solder columns in an array 2017 Granted TOPLIN.009A Google PDF   9,108,262 B1 CGA Column Grid Array PIN-PACK® Disposable apparatus for aligning and dispensing solder columns in an array 2015 Granted TOPLIN.006A Google PDF   D808350 S CGA Column Grid Array Graphite Fixture Fixture for delivering interconnect members onto a substrate. 2018 Granted TOPLIN.010A Google PDF   9,521,753 B1 Vibration Attenuation PID Particle Impact Damper Vibration damping circuit card assembly 2016 Granted Google PDF NASA License 10,041,558 B1 Vibration Attenuation Tunable PID Particle Impact Damper Vibration damping circuit board assembly 2018 Granted TOPLIN.011A Google PDF   10,021,779 B1 Vibration Attenuation Quick Response PID Particle Impact Damper Vibration damping circuit board assembly 2018 Granted TOPLIN.012A Google PDF   D842351 S Vibration Attenuation Toroidal Shape Particle Impact Damper Vibration damping circuit board assembly 2019 Granted TOPLIN.014A Google PDF   10,704,639 Vibration Attenuation Unidirectional Particle Impact Damper Vibration damping circuit board assembly 2020 Granted TOPLIN.015A Google PDF   D512970 S1 Integrated Circuits QFP Lead Straightener Universal lead straightener for integrated circuit devices 2005 Granted TOPLIN.002A Google PDF           Trademarks Trademark Goods & Services First Use Year Registration Class 9. Electronic Components, namely, Integrated Circuits, Microprocessors, Capacitors, Resistors, Transistors, Diodes, Chips, Inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2013 Registered USPTO Registration 4,313,144 Japan Registration 5,593,255 TOPLINE® Class 9. Computer chips; integrated circuits; integrated circuit components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; semiconductors; semiconductor chips; semiconductor components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2014 Registered USPTO Registration 4,591,591 PIN-PACK® Class 9. Computer Chips; integrated circuits; integrated circuit components; semiconductos; semiconductor chips; semiconductor components; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, quad flat packs, flip chips, ball grid arrays and printed circuit boards. 2014 2015 Registered USPTO Registration 4,727,622 FLIP-PACK® Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2015 2017 Registered USPTO Registration 5,250,619 SPRING-PACKTM Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2018 - - Inspired by Gravity® Class 9. Electronic components namely, particle impact dampers for attenuating vibration in printed circuit boards and mechanical assemblies. 2016 2018 Registered USPTO Registration 5,469,015 Class 9. Electronic components, namely, Integrated Ciruits and Quad Flat Packs 2007   -
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