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Quartz Die For Underfill Experiments |
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| Useful Links: Flip Chip Catalog Practice PC Boards Part Number System Wire bondable Test Die 1 | ||||||||||
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| Quartz Die - Eutetic Bumps, SAC Bumps and Without Bumps | ||||||||||
| Bumps | Bump Matrix | Pitch | Die Size (mm) |
Bump Size Height Diameter |
Tray Qty | Eutectic Bumps Sn63/Pb37 Order Number |
Pb-Free Bumps Lead Free SAC - Sn/Ag/Cu Order Number |
Without Bumps Order Number |
Ref | Quick View |
| 48 | 12x12 Perimeter |
18mil 457µm |
6.3mm | 140µm ø178µm |
25pcs Waffle 2" |
FCQ48D6.3E457-ISO | - | FCNQ48D6.3C457-ISO | FBT250 |
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