Wire Bond Library Technical Papers, Presentations and References Bonding Wire   Bonding Wire Catalog   •   Wire Home   •   ISO Certificates     Web Sites Ref Title Company Author Subject Nbr Pages File Size Download File Year Pub. 1 NASA NEPP Links to Referenes NASA NEPP Home 143 additional references on Wire Bonds N/A N/A http 2018 2 NASA NEPP Wire Bonds Home NASA NEPP Home NASA describes Assuance Issues related to Electronic Wire Bonds N/A N/A http 2018 3 Bonding Trouble Shooting Ball Bonding Shinkawa Home Typical Trouble Shooting Techniques for Ball Bonding N/A N/A http 2019 4 Bonding Lab Wire Bonding Cycle Tanaka Home Lecture for bonding cycle N/A N/A http 2019 Video Ref Title Company Language Subject Minutes File Year Pub. 1 Bonding Wire trends for EV Electric Vehicles TANAKA English Bud Crockett discusses trends and future needs of bonding wire for EV electric vehicles and charging stations at IPC Apex conference. 5m 2019 Mil-Spec and Industry Standards Ref Title Source Language Subject File Size File Type Year Pub. 1 Bond Strength Destructive Bond Pull Test USA MIL-STD-883 Method 2011.9 English Grams-force pull to a bond installed in a package 1mb PDF 2013 2 Bonding Strength NonDestructive Bond Pull USA MIL-STD-883 Method 2023.7 English Non Destructive Bond Pull 1mb PDF 2013 3 Department of Defense Test Method Standard Microciruits USA MIL-STD-883 Full Edition English With Change 2 10mb PDF 2017 Application Guidelines Ref Title Source Language Subject File Size File Type Year Pub. 1 Wire Bondability to Bonding Pads Quick View Wire & Pads English Gold, Copper and Silver wire for different bond pad materials 100kb PDF 2019 2 DC Fusing Current and Safe Operating Current of Microelectronic Bonding Wires ISTF English Fusing current theories are discussed in detail. Proposed safe equations are derived for calculating DC fusing current and maximum DC design crurent for aluminum and gold bonding wire and ribbon. 1.0mb PDF 1989 3 Vibration Resistance and Durability of Wirebond for EV Batteries Printed Circuit Design & Fab Circuit Assembly English Loop height is directly proportional to vibration resistance. Higher strength wire showed higher vibration resistance but only with amplitudes. Ribbon wires showed better resistance than round wires in X and Z vibration directions.Bond terminals (battery cell and busbar) rigidity with respect to wirebond are important for enhanced vibration resistance. 2.8mb PDF 2024 4 Tears of Wine and Palladium-coated Copper Wire Semiconductor Digest March 2024 English Mixing of palladium and copper within conventional palladium-coated copper wires is explained by the Marangoni effect. 1.0mb PDF 2024 ISO Quality Certificate Ref Certificate Title Organization Certification Body Subject File Size File Type Expire 1 ISO 9001 : 2015 TANAKA ELECTRONICS SIGNAPORE PTE LTD TUV Design, Development and Manufacture of Bonding Wires 180Kb jpg 2024 June 28 2 ISO 14001 : 2015 TANAKA ELECTRONICS SIGNAPORE PTE LTD TUV Manufacture of Bonding Wires 180Kb jpg 2023 December 31 3 ISO 45001 : 2018 TANAKA ELECTRONICS SIGNAPORE PTE LTD TUV Occupational Health and Safety Management System Manufacture of Bonding Wires 180Kb jpg 2023 September 4 4 IATF 16949 TANAKA ELECTRONICS SIGNAPORE PTE LTD TUV Design and Manufacture of Bonding Wires 180Kb jpg 2023 July 26 5 ISO 9001 : 2015 TANAKA KIKINZOKU KOGYO K.K. Japan JQA Design and Development of Wires for Sensors, Medical Device Component and other items 180Kb jpg 2024 March 17 6 ISO 14001 : 2018 TANAKA DENSHI KOGYO K.K. Japan JQA Design and Manufacturing of Bonding Wires 180Kb jpg 2023 August 1 7 IATF 16949 TANAKA DENSHI KOGYO K.K. Japan JQA Design and Manufacturing of Bonding Wires and Aluminum Bonding Ribbons 180Kb jpg 2024 August 1 8 ISO 45001 : 2018 TANAKA DENSHI KOGYO K.K. Japan JQA Occupational Health and Safety Management System 180Kb jpg 2024 September 24 TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000  •  Fax: 1-478-451-3000 Email: sales@topline.tv Home