Mil-Spec and Industry Standards |
Ref |
Title |
Source |
Language |
Subject |
File Size |
File Type |
Year Pub. |
1 |
Bond Strength Destructive Bond Pull Test |
USA MIL-STD-883 Method 2011.9 |
English |
Grams-force pull to a bond installed in a package |
1mb |
 PDF |
2013 |
2 |
Bonding Strength NonDestructive Bond Pull |
USA MIL-STD-883 Method 2023.7 |
English |
Non Destructive Bond Pull |
1mb |
 PDF |
2013 |
3 |
Department of Defense Test Method Standard Microciruits |
USA MIL-STD-883 Full Edition |
English |
With Change 2 |
10mb |
 PDF |
2017 |
|
|
 |
|
|
Application Guidelines |
Ref |
Title |
Source |
Language |
Subject |
File Size |
File Type |
Year Pub. |
1 |
Wire Bondability to Bonding Pads |
Quick View Wire & Pads |
English |
Gold, Copper and Silver wire for different bond pad materials |
100kb |
 PDF |
2019 |
ISO Quality Certificate |
Ref |
Certificate Title |
Organization |
Certification Body |
Subject |
File Size |
File Type |
Expire |
1 |
ISO 9001 : 2015 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Design, Development and Manufacture of Bonding Wires |
225Kb |
 jpg |
2021 June 28 |
1 |
ISO 14001 : 2015 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Manufacture of Bonding Wires |
180Kb |
 jpg |
2020 December 31 |
1 |
IATF 16949 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Design and Manufacture of Bonding Wires |
180Kb |
 jpg |
2021 August 2 |
1 |
IATF 16949 |
TANAKA DENSHI KOGYO K.K. Japan |
JQA |
Design and Manufacturing of Bonding Wires and Aluminum Bonding Ribbons |
180Kb |
 jpg |
2021 August 1 |
TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
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