| Mil-Spec and Industry Standards |
| Ref |
Title |
Source |
Language |
Subject |
File
Size |
File
Type |
Year
Pub. |
| 1 |
Bond Strength
Destructive Bond Pull Test |
USA
MIL-STD-883
Method 2011.9 |
English |
Grams-force pull to a bond installed in a package |
1mb |
PDF |
2013 |
| 2 |
Bonding Strength
NonDestructive Bond Pull |
USA
MIL-STD-883
Method 2023.7 |
English |
Non Destructive Bond Pull |
1mb |
PDF |
2013 |
| 3 |
Department of Defense
Test Method Standard
Microciruits |
USA
MIL-STD-883
Full Edition |
English |
With Change 2 |
10mb |
PDF |
2017 |
| |
| |
 |
| |
| |
| Application Guidelines |
| Ref |
Title |
Source |
Language |
Subject |
File
Size |
File
Type |
Year
Pub. |
| 1 |
Wire Bondability to Bonding Pads |
Quick View
Wire &
Pads |
English |
Gold, Copper and Silver
wire for different bond pad materials |
100kb |
PDF |
2019 |
| ISO Quality Certificate |
| Ref |
Certificate Title |
Organization |
Certification Body |
Subject |
File
Size |
File
Type |
Expire |
| 1 |
ISO 9001 : 2015 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Design, Development and Manufacture of Bonding Wires |
225Kb |
jpg |
2021
June 28 |
| 1 |
ISO 14001 : 2015 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Manufacture of Bonding Wires |
180Kb |
jpg |
2020
December 31 |
| 1 |
IATF 16949 |
TANAKA ELECTRONICS SIGNAPORE PTE LTD |
TUV |
Design and Manufacture of Bonding Wires |
180Kb |
jpg |
2021
August 2 |
| 1 |
IATF 16949 |
TANAKA DENSHI KOGYO K.K. Japan |
JQA |
Design and Manufacturing of Bonding Wires and Aluminum Bonding Ribbons |
180Kb |
jpg |
2021
August 1 |
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