Die mechanical dummy Si silcon die: mirrored, polished or with etched patterns. Wafer or singulated sawn die. We backgrind to thickness you require. BARE DIE , BAREDIE , For experimental use in the lab for dicing practice, pick and place, wire-bonding practice. Daisy chain available. DUMY DIE , MD , ED, WMD, WED series. ED380-5X3.2-BG300 , MD-3X1.5 BG304-WP2 , MD.89X.87-304-UH8 , 181263 , ED-0.25X0.25MM-BG250-WP2, 1MM X 1.435MM X 0.225MM , MD-15x15-P , MD-15x15-BG680-P , MD-15x15-BG680P , MDX-5x5-BG250-P MDX5x5BG250-P MDX-6X6-BG250-P , MD-SIO2-3.0-BG100-W , MD-SIO2-3.0-BG200-W , MD-SIO2-5.0-BG100-W , MD-SIO2-5.0-BG200-W , 131005 , 132005 , 131003 , 132003

		Mirrored & Patterned Dummy Die

Mechanical Dummy Die

Mirrored and Etched Patterns

Experimental use in Lab

Variety of Applications

Go to Wafer

Example Die with Etch Patterns

Quick Specs:
Material: Si (Silicon)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks


Dummy Die Part Numbering System
MD	-	5.0x3.5	-	BG250	-	W
Die Type		Size in millimeter		Back Grinding Thickness µm		Packaging
Single Die MD=Mirrored Die MDX=Course Ground Die MD-SIO2=Die with Oxide ED=Etched Pattern Die Sawn Wafer WMD=Mirrored Die WED=Patterned Die		All sizes available 0.25 ~ 25mm Square Die: 1.0 = 1.0mm SQ 2.5 = 2.5mm SQ Etc Rectangule Die: 5.0x3.5 = 5.0x3.5mm 10x7.5 = 10x7.5mm Etc		Blank= No Backgrinding BG100=100µm BG125=125µm BG150=150µm BG250=250µm BG300=300µm BG500=500µm All thickness available: 50um ~ 1.6mm		MD & ED series: Packed in Tray W = Waffle Pack 2-inch P = Waffle Pack 4-inch WMD & WED series: Diced/Sawn on Tape NH8 = 8-inch Plastic Hoop Non-UV UH8 = 8-inch Plastic Hoop UV Tape NT8 = Dicing Tape 8" Ring Disco FF108 • K&S FF105 UV8 = UV Tape 8" Ring Disco FF108 • K&S FF105 UV12 = 12-inch UV Tape & Ring

Variety of options and packaging are available. Tell us your application.


Die and Wafer Ordering
Mirrored Die Single Waffle Pack	Pattern Die Single Waffle Pack	Mirrored Die Sawn Wafer Tape & Ring	Pattern Die Sawn Wafer Tape & Ring
MD-mm x mm-BG250-W BG back grind optional Packed in 2-inch Waffle Tray	ED-mm x mm-BG250-P BG back grind optional Packed in 4-inch Waffle Tray	WMD-mm x mm-BG3250-UV8 BG back grind optional Cured UV Tape 8-inch Metal Ring	WED-mm x mm-BG250-UV12 BG back grind optional Cured UV Tape 12-inch Metal Ring

Back grinding available all thicknesses. Variety of packaging options are available. Tell us your application.


Related Links: Wafer Test Die Flip Chip
TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv • Home