Solder Mask:
-
Standard:
LPI photo liquid-imageable green solder mask.
Typical Thickness 1.0mils (25µm), Taiyo Model PSR-4000BN
Plating Finish:
Standard SnPb:
HASL - Hot Air Solder leveling with controlled Sn63 plating for flatness for coplanarity.
Lead Free (Pb-Free):
White tin: (Also known as "Immersion Tin" Sn100)
Immersion Silver: 5~16 micro-inches (0.12~0.40µm) • Typical: 8~12 micro-inches (0.2~0.3µm)
OSP: Bare copper (Entek 106 Organic Solder Preservative)
ENIG: 5 micro-inches (0.127µm) Immersion Gold over 150 micro-inches (3.8µm)electroless nickel.
Hard Gold: 30 micro-inches (0.76µm) Electroplated Gold over (3.8µm) electroless nickel.
Note: Hard Gold (99.0~99.7%) is recommended for connector fingers only.
Wire Bondable:
ENEPIG (NiPdAu) IPC-4556
Ni: 118~236 micro-inches (3~6µm) Electroless Nickel
Pd: 2~6 micro-inches (0.05~0.15µm) Electroless Palladium
Au: 1.2 micro-inches (0.025µm) Min. Immersion Gold
NiAu (Soft Gold 99.999%): 25~50 micro-inches (0.6~1.3µm) Gold over 150 micro-inches (3.8µm) electroless nickel.
ENIG: Bondable only with aluminum (Al) wire.
Board Material:
Standard Tin-Lead (HASL):
FR-4 epoxy glass Tg=140°C
Lead Free:
Multifunctional FR-4 Tg=175°C
Polyimide Tg=270°C
BT - Bismaleimde Triazine Tg=240°C
Rogers RO-4003C White Ceramic Glass Woven Tg=280°C
Board Thickness:
Standard 0.062" (1.5mm) typical. Other thickness available.
Alternate double layer core thickness: 0.005" • 0.008" • 0.010" • 0.014" • 0.021" • 0.028" • 0.039" • 0.047" • 0.059" • 0.093" • 0.125"
Copper Clad:
Standard 1 oz [Thickness: 1.4 mil (0.035mm or 35µm)].
Special 1/2 oz [Thickness: 0.7 mil (0.018mm or 18µm)].
Special 2 oz [Thickness: 2.8 mil (0.070mm or 70µm)].
Note: Ounce (oz) is the weight per square foot (ft2).
Layers:
Double Sided:
Repeated pads on both sides.
Kits are supplied with enough components for one side of the board only.
Multilayer:
Multi-layer boards available on special order.
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