Epoxy-glass FR-4 is standard for most kits. FR-4
is a good quality, general-purpose material used throughout
the electronics industry.
When high temperatures during assembly or burn-in are anticipated,
polyimide should be considered as an option. Polyimide's Tg is 270ūC.
Most board lamanents use 1.0 oz. of copper during fabrication.
Hot Air Solder Leveling
TopLine uses hot air solder leveling (HASL)during board fabrication for controlled plating flatness
which assures coplanarity for fine pitch components.
Liquid Photoimageable Solder Mask
Most kits use liquid photoimageable (LPI) soldermask which yields a very even solder mask
and does not interfere with solder paste screen printing.
X,Y Theta: (Accessory)
Component coordinate data in relationship to the lower left tooling hole on the PCB Board.
Gerber Data: (Accessory)
Used to make a metal stencil for the application of solder paste is available for all boards.
A minimum of two global fiducials are provided for correction of translational offsets (x and y position)
and rotational offsets (theta position) located diagonally opposed as far apart as possible on the circuit
Used to locate the position of an individual component.
Kits are supplied with enough components to populate one side of the board only.
Most boards are double sided.
|Standard Board Specification
||5.5" x 4" (140mm x 100mm)
||LPI (Liquid Photoimageable)
||HASL (Hot Air Solder Leveling)SnPb
||Tin, Gold (ENIG), Immersion Silver and OSP
||.125" (3.18mm) 4-places