1989 |
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TopLine offers QFP100 25mil pitch. |
1990 |
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TopLine introduces
0.5mm pitch QFP208.
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1991 |
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TopLine introduces TSOP
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1992 |
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TopLine introduces 0.4mm pitch QFP256.
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1993 |
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TopLine introduces practice PCB and kits.
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1994 |
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TopLine introduces TQFP 0.3mm pitch.
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1995 |
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TopLine introduces BGA Ball Grid Arrays and flip chips.
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1996 |
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TopLine adds CSP Chip Scale Packages including µBGA.
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1997 |
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TopLine launches website.
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1998 |
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TopLine adds 1.0mm pitch BGA.
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1999 |
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TopLine introduces 0.8mm pitch CSP.
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2000 |
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Wide range of "lead-free" components and 0.5mm pitch CSP.
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2001 |
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TopLine expands Products.
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2002 |
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TopLine moves to new headquarters.
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2003 |
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TopLine expands. Opens sales office in Georgia.
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2004 |
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TopLine opens BGA manufacturing facility.
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2005 |
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TopLine expands Lead Free (No-Pb) RoHS compatible products.
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2006 |
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TopLine opens BGA assembly in Silicon Valley facility.
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2007 |
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TopLine produces BGA 0.4mm daisy chain (No-Pb) RoHS.
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2008 |
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TopLine introduces Open Cavity QFN for microelectronics prototyping.
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2009 |
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TopLine expands facility near Altanta, Georgia.
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2010 |
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TopLine introduces WLP Series, wafer level WL-CSP with daisy chain.
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2011 |
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TopLine introduces eWLP Series, embedded die with daisy chain.
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2012 |
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TopLine introduces BGA 0.3mm pitch daisy chain.
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2013 |
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TopLine establishes manufacturing of CCGA Column Grid Arrays and solder columns at California facility.
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2014 |
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NASA transfers technology to TopLine to manufacture CCGA Micro-Coil Springs .
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2015 |
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TopLine partners with Tanaka to provide gold, silver, aluminum and copper wire for semiconductor and LED markets.
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2016 |
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NASA transfers technology to TopLine to manufacture and commercialize Vibration attenuation PID Particle Impact Dampers .
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2017 |
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TopLine receives patent in the field of CCGA - Column Grid Array.
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2018 |
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TopLine delivers one-million copper wrapped solder columns for CCGA - Column Grid Array packages.
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2019 |
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TopLine quadruples production space at California plant to ramp production of solder columns for CCGA - Column Grid Array packages.
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2020 |
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TopLine increses strategic relationship with Tanaka to distribute fine bonding wire to Universities and microelectronic assembly labs in North America and Europe.
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2022 |
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TopLine attains 15 patents in the fields of Column Grid Arrays and Vibration Dampers.
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