B-24
SIR TEST Board

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Board Size 4" x 6" (101.6 x 151.6mm)
Bottom side is bare.   •   Seated in optional connector.

  

Board Features:

  • Bare Copper 1/2-Oz.
  • Solder Mask - None
  • FR4 Tg=175°C
  • Size - 4"x6.0" (101.6 x 151.6mm)
  • Thickness 0.059" (1.5mm)
  • Single Layer Board
  • Fingers 0.100" Pitch (2.54mm)
  • Ni-Au Connector Fingers
  • Tooling Holes .080" (2.0mm) 3-Places
  • Fiducials 0.040" (1.0mm) 3-Places
    •
    B-24 Surface Insulation Resistance (S.I.R.) test board.
    IPC test method IPC-TM-2.6.6.3
    Order
    Qty    		 Order Number
    B-24 Board
    1 each Order # 900024
    Bare Cu Board
    Electroplated Gold Fingers
    1 each Order # 900924
    Final Finish ENIG Board
    ENIG Gold Fingers
    1 each Order # 900824 Rev-D
    OSP Cu Board
    Fingers without Gold
     
     
    IPC-A-24 and IPC-B-24 test board artwork and
    electronic data is available from IPC.
     
     
    Kit Order Number System
    900 0 24
    Board Plating (Final Finish) Series
    Size 4"x6.0"
    (101.6 x 151.6mm)

    Thick: 0.059" (1.5mm)    		 0 = Bare Cu (Electroplated Gold Fingers)

    8 = OSP Cu (No Gold)

    9 = 100% ENIG (Immersion Gold)    		 24 = B-24
     
    Edge Connector (Not Included)
    Item Specification
    Order Nbr DWG 172532
    3D Solidworks Model Model 172532
    Positions 32X
    Pitch 0.10" (2.54mm)
    Board Thick 0.059~0.062" (1.50~1.57mm)
    Edges Double
    Connector
    Vertical Mouting    		 Plated Thru-Hole
    64X (Ø 1.0mm - .040" Holes)
    on PCB Card
     
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