B-25A
SIR TEST Board

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Board Size 4" x 4.5" (10 x 14cm)
Bottom side is bare.

  

Board Features:

  • Final finish:
        • Bare Copper
        • Immersion Silver
        • ENIG Ni-Au
        • Other Available
  • Copper Thickness - 1-Oz.
  • Solder Mask - None
  • FR4 Tg=175°C
  • Size - 4"x4.5" (10x11.4cm)
  • Thickness 0.062" (1.6mm)
  • Single Layer Board
  • Connector Fingers 0.156" Pitch (4.0mm)
  • Pattern Line Spacing:
        • Coupon-C 0.025"
        • Coupon-D 0.0125"
        • Coupon-E 0.020"
        • Coupon-F 0.020"
    •  
    How to Order B-25A Boards
    Order
    Qty    		 Order Number Coupons
    PCB/PWB Finish    		 Fingers
    PCB/PWB Finish    		 RoHS
    Pb-Free
    1 each Order# 900025 Bare Copper (Cu) Board Electroplated Gold (Au)
    30 micro-inch    		 RoHS
    1 each Order# 900125 Electroplated Gold (Au)
    30 micro-inch    		 Electroplated Gold (Au)
    30 micro-inch    		 RoHS
    1 each Order# 900325 Tin-Lead HASL (SnPb) Tin-Lead HASL (SnPb) -
    1 each Order# 900425 Bare Copper Cu (Not OSP) Bare Copper Cu (Not OSP) RoHS
    1 each Order# 900625 Immersion Silver (Ag) Immersion Silver (Ag) RoHS
    1 each Order# 900725 Immersion Tin (Sn) Immersion Tin (Sn) RoHS
    1 each Order# 900825 HASL Tin (Sn) HASL Tin (Sn) RoHS
    1 each Order# 900925 ENIG Gold
    (Au) 5 micro-inch    		 ENIG Gold
    (Au) 5 micro-inch    		 RoHS
    Ask for other plating/finish combinations.
     
     
    IPC-B-25A test board artwork and
    electronic data is available from IPC.
     
     
    Kit Order Number System
    900 0 25
    Board Plating Series
    Size 4"x4.5"
    (10x11.4cm)    		 0 = Bare Cu (Electroplated Gold Fingers)
    Original Version

    1 = Hard Gold (Au)
    3 = HASL Tin-Lead (SnPb)
    4 = Bare Cu (No Gold)
    5 = To be assigned
    6 = Immersion Silver (Ag)
    7 = Immersion Tin (Sn)
    8 = HASL Tin (Sn)
    9 = ENIG (Flash Gold)    		 25 = B-25A
     
    Edge Connector (Not Included)
    Item Specification
    Order Nbr Solderable Eyelet
    DIP Dual Row 0.20" (5.08mm) Center
    DIP Dual Row 0.14" (3.56mm) Center
    Positions 22
    Pitch 0.156" (3.96mm)
    Board Thick 0.059~0.062" (1.50~1.57mm)
    Edges Double
    Connector
    Vertical Mouting    		 Plated Thru-Hole
    44X (Ø 1.3mm - .051" Holes)
    Dual Row Spaced on PCB Card:
    0.200" (5.08mm)or 0.140 (3.56mm)
     
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