
Enlarge Drawing PDF Version Single Site Pad Detail Photo of Board Other Kits
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Laminate 4-layer ENIG FR4 board for placement and daisy chain continuity testing after assembly. Top side of substrate has 10 sites for mounting flip chips with 88 bumps 5.08mm x 5.08mm. Bottom side of substrate has 10 mounting sites for 220 bumps 10.2mm x 15.23mm. Go to--> 904000 kit
Laminate Substrate:
Tetra-functional multilayer FR-4
3~8 micro-inch ENIG immersion Gold over electroless nickel
Local and Global Fiducial Marks
traces 4 mil lines and spaces
Top Side mounting FC88
Bottom Side mounting FC220
Green LPI Solder Mask
Fingers .150" (3.83mm) pitch
Board 3.5" x 5.5" (89mm x 140mm)
Board Thickness .031" (0.8mm)
4-tooling holes .125" (3.17mm)
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