902000 Kit

Flip Chip Kit
FC88 204µm (8 mils) Pitch
K&S PB08-200x200 (old FTC PB8 2x2)


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Laminate 4-layer ENIG FR4 board for placement and daisy chain continuity testing after assembly. Top side of substrate has 10 sites for mounting flip chips with 88 bumps 5.08mm x 5.08mm. Bottom side of substrate has 10 mounting sites for 220 bumps 10.2mm x 15.23mm. Go to--> 904000 kit


Laminate Substrate:

  • Tetra-functional multilayer FR-4
  • 3~8 micro-inch ENIG immersion Gold over electroless nickel
  • Local and Global Fiducial Marks
  • traces 4 mil lines and spaces
  • Top Side mounting FC88
  • Bottom Side mounting FC220
  • Green LPI Solder Mask
  • Fingers .150" (3.83mm) pitch
  • Board 3.5" x 5.5" (89mm x 140mm)
  • Board Thickness .031" (0.8mm)
  • 4-tooling holes .125" (3.17mm)


    • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    902000
    Eutectic SnPb    		 Kit Order Number
    902002
    Eutectic SnPb    		 Kit Order Number
    902900
    Lead Free    		 Kit Order Number
    902901
    Lead Free
    Laminate FR4 Board
    Ni-Au ENIG    		 1 1 1 1
    Flip Chip FC88
    Eutectic SnPb Bumps    		 36 pcs 10 pcs - -
    Flip Chip FC88
    SAC Lead Free Bumps    		 - - 36 pcs 10 pcs

    Optional Accessories
    Parts Placement Data ASCII File - Order Number 902004
    Solder Paste Artwork, Gerber File, Order Number 902005
    Spare Board Only, Order Number 902001


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