907000 Kit

Flip Chip Kit
FC96 457µm (18 mils) Pitch
K&S PB18-500x500 (old FTC FTB500)

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Laminate 4-layer FR4 board for placement and daisy chain continuity testing after assembly. Top side of substrate has 10 mounting sites for 48 bumps 6.3mm x 6.3mm. Bottom side of substrate has 10 mounting sites for 96 bumps 12.7mm x 12.7mm Go to--> 909000 kit

Laminate Substrate:

  • Multi-functional multilayer FR-4
  • Tg = 180°C
  • Plating immersion gold over electroless nickel
  • Local and Global Fiducial Marks
  • traces 8 mil lines and spaces
  • Top Side mounting FC48
  • Bottom Side mounting FC96
  • Green LPI Solder Mask
  • Fingers .150" (3.83mm) pitch
  • Board 3.5" x 5.5" (89mm x 140mm)
  • Board Thickness .062" (1.6mm)
  • 4-tooling holes .125" (3.17mm)

  • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    Laminate FR4 Board 1
    Flip Chip FC96 9

    Optional Accessories
    Parts Placement Data ASCII File - Order Number 907004
    Solder Paste Artwork, Gerber File, Order Number 907005
    Spare Board Only, Order Number 907001

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