909000 Kit

Flip Chip Kit
FC48 457µm (18 mils) Pitch
K&S PB18-250x250 (old FTC FTB250)


PDF Version  •   Single Site 		 



Laminate 4-layer FR4 board for placement and daisy chain continuity testing after assembly. Top side of substrate has 10 mounting sites for 48 bumps 6.3mm x 6.3mm. Bottom side of substrate has 10 mounting sites for 96 bumps 12.7mm x 12.7mm Go to--> 907000 kit


Laminate Substrate:

  • Tetra-functional multilayer FR-4
  • Tg = 180°C
  • Plating immersion gold over electroless nickel
  • Local and Global Fiducial Marks
  • traces 8 mil lines and spaces
  • Top Side mounting FC48
  • Bottom Side mounting FC96
  • Green LPI Solder Mask
  • Fingers .150" (3.83mm) pitch
  • Board 3.5" x 5.5" (89mm x 140mm)
  • Board Thickness .062" (1.6mm)
  • 4-tooling holes .125" (3.17mm)


    • Manual Assembly or Machine Run
    Kit Contents Kit Order Number
    909000
    Eutectic SnPb    		 Kit Order Number
    909002
    Eutectic SnPb    		 Kit Order Number
    909900
    Lead Free    		 Kit Order Number
    909901
    Lead Free
    Laminate FR4 Board
    Ni-Au ENIG    		 1 1 1 1
    Flip Chip FC48
    Eutectic SnPb Bumps    		 25 pcs 10 pcs - -
    Flip Chip FC48
    SAC Lead Free Bumps    		 - - 25 pcs 10 pcs


    Back To Kits    Back To Products    PDF Kit Catalog   TopLine Home