Enlarge: Bare Board
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Board Size 4"x5.5" (10x14cm) Same pattern repeated on bottom side.
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TopLine Rotational Placement Kit. Each side has pads for TSOP(I), SOIC and chip Resistors. Components are place radially around a center focal point, spaced on 22.5° angles.
Board Features:
Choice of Final finish:
• Immersion Tin (Sn)
• ENIG (Ni/Au)Gold
• OSP Copper
• Immersion Silver
• HASL SnPb
LPI Solder Mask - PSR4000 AUS5
FR4 Tg=170°C
Size - 4"x5.5" (10x14cm)
Thickness 0.062" (1.6mm)
2-Layer Board
Lead Free RoHS Version
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
Enlarge:
Top (Shown After Assembly)
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