Enlarge: Bare Board
Board Size 4"x5.5" (10x14cm) Click for bottom view
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TopLine Mixed Technology 2 Kit. Top side has daisy chain BGA, QFP, SOIC, SOJ, SOT23, PLCC, SMT chips and throughhole components. Test points for checking continuity after mounting daisy chain BGA169 to verify correct assembly with a simple ohm-meter.
Board Features:
Choice of Final finish:
• Immersion Tin (Sn)
• ENIG (Ni/Au)Gold
• OSP Copper
• Immersion Silver
• HASL SnPb
LPI Solder Mask - PSR4000 AUS5
FR4 Tg=170°C
Size - 4"x5.5" (10x14cm)
Thickness 0.062" (1.6mm)
2-Layer Board
Lead Free RoHS Version
Plated Throughholes (PTH)
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
Enlarge:
Top (Shown After Assembly)
Click for bottom view
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