BGA Solder Ball Alloys spheres BGA BALLS SOLDER SPHERES SOLDER BALLS , SOLDER PARTICLE , Weight of Solder Ball. Solder Ball Weight, Solder Ball Mass, Solder Ball Density , BGA REBALL , REBALL KIT , Leaded Solder Balls , Maximum Downward Pressure on BGA packages , BALL & BUMP , SOLDER BALL SAC305 , SOLDER BALLS SAC305 , SAC305 BALLS , SAC305 SOLDER BALLS , SAC305 Sn96.5 Ag3.0 Cu0.5 - - - SAC 305 Sn96.5/Ag3.0/Cu0.5 - - - SAC0.5 SAC 0.5MM SOLDER BALL SACQ , SOLDER BALLS SACQ , SACQ SOLDER BALLS, SACQ BALLS , SACQ Sn92.45% Ag4% Cu0.5% Ni0.05% Bi3% ( Sn92.45% Ag4% Cu 0.5% Ni 0.05% Bi 3% ) - - - SAC302 BALLS , SAC302 SOLDER BALLS , SAC302 Sn96.8 Ag3.0 Cu0.2 - - - SAC 302 Sn96.8/Ag3.0/Cu0.2 - - - SACN306 , SACN 306 , SAC396 Sn95.5 Ag3.9 Cu0.6 - - SAC 396 Sn95.5 Ag3.9 Cu0.6 - - SAC405 Sn95.5 Ag4.0 Cu0.5 - - - SAC 405 Sn95.5/Ag4.0/Cu0.5 - - - SAC387 Sn95.5 Ag3.8 Cu0.7 - - - SAC 387 Sn95.5/Ag3.8/Cu0.7 - - - SAC350 Sn96.5 Ag3.5 - - - SAC 350 Sn96.5/Ag3.5 - - - SAC266 Sn96.8 Ag2.6 Cu0.6 - - - SAC 266 Sn96.8/Ag2.6/Cu0.6 - - - SAC125 Sn98.3 Ag1.2 Cu0.5 - - - SAC 125 Sn98.3/Ag1.2/Cu0.5 - - - SAC105 Sn98.5 Ag1.0 Cu0.5 - - - SAC 105 Sn98.5/Ag1.0/Cu0.5 - - - SAC101 Sn98.9 Ag1.0 Cu0.1 - - - SAC 101 Sn98.9/Ag1.0/Cu0.1 - - - SACQ , SAC Q , SAC-Q - - - Sn80.8/Sb18/Ni1.2 - - - Sn80.8/Sb18/Ni1.2 - - - Sn98.3 Ag1.2 Cu0.5 - - - Sn98.3/Ag1.2/Cu0.5 - - - Sn98.9 Ag1.0 Cu0.5 - - - Sn98.9/Ag1.0/Cu0.5 - - - Sn63 Pb37 - - - Sn63/Pb37 - - - Sn62 Pb36 Ag2.0 - - - Sn62/Pb36/Ag2.0 - - - Sn10 Pb90 - - - Sn10/Pb90 - - - Pb90 Sn10 - - - Pb90/Sn10 - - - 710007 , 710011 , 710020 , 710025 , 710030 , 712025 , 712030 , 762010 , 762012 , 762014 , 762016 , 762018 , 762025 , 762030 , 763002 , 763004 , 763006 , 763008 , 763010 , 763012 , 763014 , 763016 , 763018 , 763020 , 763024 , 763025 , 763030 , 779012 , 795010 , 795012 , 795014 , 795016 , 795018 , 795020 , 796002 , 796003 , 796004 , 796005 , 796006 , 796008 , 796010 , 796012 , 796014 , 796016 , 796018 , 796020 , 796025 , 796030 , 797025 , 797030 , 798008 , 798018 , 799018 , 799025 , 799030 , .406MM SAC405 BALL ,.508MM SAC405 BALL , 0.25MM SAC405 BALL , 0.30MM SAC405 BALL , 0.35MM SAC405 BALL , 0.45MM SAC405 BALL , 12MIL SN10 , BALL 10MIL SAC305 , BALL 10MIL SN62 , BALL 10MIL SN63 , BALL 12MIL SAC105 , BALL 12MIL SAC305 , BALL 12MIL SN62 , BALL 12MIL SN63 , BALL 14MIL SAC305 , BALL 14MIL SN62 , BALL 14MIL SN63 , BALL 16MIL SAC305 , BALL 16MIL SN62 , BALL 16MIL SN63 , BALL 18MIL SAC105 , BALL 18MIL SAC125 , BALL 18MIL SAC305 , BALL 18MIL SN62 , BALL 18MIL SN63 , BALL 20MIL SAC305 , BALL 20MIL SN10 , BALL 20MIL SN63 , BALL 24MIL SAC305 , BALL 24MIL SN63 , BALL 25MIL AU-GE12 , BALL 25MIL SAC105 , BALL 25MIL SAC305 , BALL 25MIL SN10 , BALL 25MIL SN62 , BALL 25MIL SN63 , BALL 25MIL SN96 , BALL 2MIL SAC305 , BALL 2MIL SN63 , BALL 30MIL AU-GE12 , BALL 30MIL SAC105 , BALL 30MIL SAC305 , BALL 30MIL SN10 , BALL 30MIL SN62 , BALL 30MIL SN63 , BALL 30MIL SN96 , BALL 3MIL SAC305 , BALL 4MIL SAC305 , BALL 4MIL SN63 , BALL 5MIL SAC305 , BALL 6MIL SAC305 , BALL 6MIL SN63 , BALL 8MIL SAC305 , BALL 8MIL SN10 , BALL 8MIL SN63 , 0.10mm BALL , 0.15mm BALL , 0.20mm BALL , 0.25mm BALL , 0.30mm BALL , 0.35mm BALL , 0.40mm BALL , 0.45mm BALL , 0.50mm BALL , 0.61mm BALL , 0.63mm BALL , 0.635mm BALL , 0.75mm BALL , 0.76mm BALL ,

	BGA Solder Ball


BGA Devices • Ball Count Per BGA • Tolerance Elastomer Core Solder Ball • Ball Weight/Mass • Down Pressure (Force) per ball

BGA Solder Ball

Standard Lead Free Alloy RoHS (Pb Free)
Ref.	Composition	Solidus °C	Liquidus °C	Density gm/cc
SAC305	Sn96.5 Ag3.0 Cu0.5	217	220	7.4

Minimum Order 250K pcs


Special Lead Free Alloy RoHS (Pb Free)
Ref.	Alloy	Solidus °C	Liquidus °C	Density gm/cc
SAC101	Sn98.9 Ag1.0 Cu0.1	-	-	7.343
SAC105	Sn98.5 Ag1.0 Cu0.5	215	227	7.350
SAC125	Sn98.3 Ag1.2 Cu0.5	-	-	7.356
SAC125+Ni	Sn98.25 Ag1.2 Cu0.5 Ni0.05	-	-	7.356
SAC266	Sn96.8 Ag2.6 Cu0.6	-	-	7.403
SAC300	Sn96.95 Ag3.0 Cu0.05	-	-	7.406
SAC302	Sn96.8 Ag3.0 Cu0.2	217	220	-
SACN306	Sn96.3 Ag3.0 Cu0.6 Ni0.04	220	226	~7.4
SAC307	Sn96.3 Ag3.0 Cu0.7	-	-	-
-	Sn80.8 Sb18 Ni.2	-	-	-
SAC350	Sn96.45 Ag3.5 Cu0.05	-	-	7.422
SAC357	Sn95.8 Ag3.5 Cu0.7	218	217	7.4
SAC387	Sn95.5 Ag3.8 Cu0.7	-	-	7.442
SAC400	Sn95.95 Ag4.0 Cu0.05	-	-	7.438
SAC396	Sn95.5 Ag3.9 Cu0.6	217	218	7.4
SAC405	Sn95.5 Ag4.0 Cu0.5	217	225	7.445
Sn96	Sn96.5 Ag3.5	-	-	7.400
SACQ	Sn92.45 Ag4 Cu0.5 Bi3.0 Ni0.05	207	217	NA
Innolot	~Sn92.3 Ag3.8 Cu0.7 Bi2.0 Sb1.0 Ni0.2	206	218	7.4

Minimum Order 250K pcs

Ball Diameter
Ø Ball Dia (mm)	Ø Ball Dia (Mil)	Standard BGA Pitch	Alternative BGA Pitch	Ø Ball Diam Tolerance Pre-Reflow
0.10mm	4mil	-	-	±5µm
0.15mm	6mil	-	-	±10µm
0.20mm	8mil	0.3mm	-	±10µm
0.25mm	10mil	0.4mm	-	±10µm
0.30mm	12 mil	0.5mm	-	±10µm
0.35mm	14 mil	0.65 ~ 0.75mm	-	±10µm
0.40mm	16 mil	0.8mm	1.0mm	±10µm
0.45mm	18 mil	0.8mm	1.0mm	±10µm
0.50mm	20 mil	1.0mm	0.8mm	±10µm
0.61mm	24 mil	1.0mm	-	±15µm
0.63mm	25 mil	1.0mm	-	±15µm
0.76mm	30 mil	1.27 ~ 1.5mm	-	±15µm

Other Ball Diameters Avialable:

Ball Weight (Mass)
Ø Ball Dia (mm)	Ø Ball Dia (Mil)	Solder ball Volume cm³	Quantity Balls Per gm Sn63/Pb37	Quantity Balls Per gm SAC305
0.10mm	4mil	5.236*10^-7	227,000	258,000
0.15mm	6mil	1.767*10^-6	67,000	76,000
0.20mm	8mil	4.189*10^-6	28,000	32,000
0.25mm	10mil	8.181*10^-6	14,500	16,500
0.30mm	12 mil	1.414*10^-5	8,400	9,500
0.35mm	14 mil	2.245*10^-5	5,300	6,000
0.40mm	16 mil	3.351*10^-5	3,500	4,000
0.45mm	18 mil	4.771*10^-5	2,500	2,800
0.50mm	20 mil	6.545*10^-5	1,800	2,060
0.61mm	24 mil	1.188*10^-4	1,000	1,130
0.63mm	25 mil	1.309*10^-4	910	1,030
0.76mm	30 mil	2.230*10^-4	520	590

Above table shows the number of balls contained in 1 gram of weight (mass). The Mass (gm) of an individual solder ball is calculated by dividing the number of balls into the number 1.0 Example: 1/590 = 0.001695gm is the mass of a single SAC305 ball measuring Ø 0.76mm diameter Weights and measurements provided above are approximations and are not guaranteed to be accurate. Numbers are rounded or truncated for easy reference.

Maximum Mechanical Downward Pressure (Force) on Top of BGA
Ø Ball Dia (mm)	Ø Ball Dia (Mil)	Pitch Solder Ball Spacing	Max Pressure Per Ball Sn63/Pb37	Max Pressure Per Ball SAC305
0.25mm	10mil	0.5mm	3 g	7 g
0.40mm	16 mil	0.8mm	6 g	12 g
0.50mm	18 mil	0.92mm Hex Pattern	7 g	14 g
0.63mm	25 mil	1.0mm	8 g	16 g
0.76mm	30 mil	1.27mm	12 g	24 g

Maximum mechanical downward pressure (force) caused by heatsink mass mounted on top of BGA. PCB and BGA should be designed to prevent bending or flexing of the PCB and BGA substrate. Pressure is typically applied to a thermal pad to keep contact between the top of the BGA and underside of heatsink. The pressure should be limited to prevent the BGA from being destroyed by too much force on top of the package. Above data was extracted from recommendations provided by Intel (Altera) as of May 2020. Data provided above are approximations and are not guaranteed to be accurate. Numbers are rounded or truncated for easy reference.

Solder Ball Tolerance (Before Reflow)
Ø Ball Dia (mm)	Ø Ball Dia (Mil) REF	Dimensional Tolerance Before Reflow
0.10mm	4mil	±5um
0.125mm	5mil	±5um
0.15mm	6mil	±10um
0.20mm	8mil	±10um
0.25mm	10mil	±10um
0.30mm	12 mil	±10um
0.35mm	14 mil	±10um
0.40mm	16 mil	±10um
0.45mm	18 mil	±10um
0.50mm	20 mil	±10um
0.61mm	24 mil	±15um
0.63mm	25 mil	±15um
0.76mm	30 mil	±15um

Solder ball tolerance is applicable before use (before reflow). Solder ball tolerance after use (after relow) is not defined. Roundness of the ball is affected by the pad diameter, soldermask (SMD or NSMD) and downward pressure during reflow. Data provided above are approximations and are not guaranteed to be accurate.

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