BGA Solder Ball
 
BGA Devices    •      Ball Count Per BGA
Elastomer Core Solder Ball    •     Ball Weight/Mass    •     Down Pressure (Force) per ball

 
BGA Solder Ball

Standard Lead Free Alloy RoHS (Pb Free)
Ref. Composition Typical
Device Types
Standard
Order
Density
gm/cc
SAC305 Sn96.5 Ag3.0 Cu0.5 BGA Standard 7.4
Minimum Order 250K pcs
 
 
Special Lead Free Alloy RoHS (Pb Free)
Ref. Alloy Typical
Device Types
Available
Special Order
Density
gm/cc
SAC101 Sn98.9 Ag1.0 Cu0.1 None Yes 7.343
SAC105 Sn98.5 Ag1.0 Cu0.5 Wafer Level Yes 7.350
SAC125 Sn98.3 Ag1.2 Cu0.5 None Yes 7.356
SAC125+Ni Sn98.25 Ag1.2 Cu0.5 Ni0.05 None Ask 7.356
SAC266 Sn96.8 Ag2.6 Cu0.6 None Ask 7.403
SAC300 Sn96.95 Ag3.0 Cu0.05 None Ask 7.406
SAC307 Sn96.3 Ag3.0 Cu0.7 None Ask 7.417
- Sn80.8 Sb18 Ni.2 None Ask -
SAC350 Sn96.45 Ag3.5 Cu0.05 None Ask 7.422
SAC387 Sn95.5 Ag3.8 Cu0.7 None Ask 7.442
SAC400 Sn95.95 Ag4.0 Cu0.05 None Ask 7.438
SAC405 Sn95.5 Ag4.0 Cu0.5 BGA Yes 7.445
Sn96 Sn96.5 Ag3.5 CBGA Yes 7.400
SACQ Sn92.45% Ag4% Cu0.5% Ni0.05% Bi3% Wafer Level Yes NA
Innolot ~Sn Bal Ag3.3~4.7 Cu0.3~1.7 Bi2.0 Sb1.0 Ni0.2 Automotive Ask NA
Minimum Order 250K pcs
 
 
Non Lead Free Alloy
Ref. Composition Typical
Device Types
Available
Special Order
Density
gm/cc
Sn62 Sn62 Pb36 Ag2.0 BGA/CBGA Yes 8.44
Sn63 Sn63 Pb37 BGA Standard 8.4
Sn60 Sn60 Pb40 N/A No 8.5
Sn20 Sn20 Pb80 CCGA Column 10.2
Sn15 Sn15 Pb85 CCGA Column 10.5
Sn10 Sn10 Pb90 CBGA
CCGA
Ball
Column
10.7
Sn5 Sn5 Pb95 Flip Chip Ask 11.0
MOQ = Minimum Order 250Kpcs
 
 
Ball Diameter
Ø Ball Dia
(mm)
Ø Ball Dia
(Mil)
Standard
BGA Pitch
Alternative
BGA Pitch
Ø Ball Diam
Tolerance
Pre-Reflow
0.10mm 4mil - - ±5µm
0.15mm 6mil - - ±10µm
0.20mm 8mil 0.3mm - ±10µm
0.25mm 10mil 0.4mm - ±10µm
0.30mm 12 mil 0.5mm - ±10µm
0.35mm 14 mil 0.65 ~ 0.75mm - ±10µm
0.40mm 16 mil 0.8mm 1.0mm ±10µm
0.45mm 18 mil 0.8mm 1.0mm ±10µm
0.50mm 20 mil 1.0mm 0.8mm ±10µm
0.61mm 24 mil 1.0mm - ±15µm
0.63mm 25 mil 1.0mm - ±15µm
0.76mm 30 mil 1.27 ~ 1.5mm - ±15µm
Other Ball Diameters Avialable:
 
 
Ball Weight (Mass)
Ø Ball Dia
(mm)
Ø Ball Dia
(Mil)
Solder ball
Volume
cm3
Quantity Balls
Per gm
Sn63/Pb37
Quantity Balls
Per gm
SAC305
0.10mm 4mil 5.236*10-7 227,000 258,000
0.15mm 6mil 1.767*10-6 67,000 76,000
0.20mm 8mil 4.189*10-6 28,000 32,000
0.25mm 10mil 8.181*10-6 14,500 16,500
0.30mm 12 mil 1.414*10-5 8,400 9,500
0.35mm 14 mil 2.245*10-5 5,300 6,000
0.40mm 16 mil 3.351*10-5 3,500 4,000
0.45mm 18 mil 4.771*10-5 2,500 2,800
0.50mm 20 mil 6.545*10-5 1,800 2,060
0.61mm 24 mil 1.188*10-4 1,000 1,130
0.63mm 25 mil 1.309*10-4 910 1,030
0.76mm 30 mil 2.230*10-4 520 590
Above table shows the number of balls contained in 1 gram of weight (mass).
The Mass (gm) of an individual solder ball is calculated by dividing the number of balls into the number 1.0
Example: 1/590 = 0.001695gm is the mass of a single SAC305 ball measuring Ø 0.76mm diameter
Weights and measurements provided above are approximations and are not guaranteed to be accurate.
Numbers are rounded or truncated for easy reference.
 
 
Maximum Mechanical Downward Pressure (Force) on Top of BGA
Ø Ball Dia
(mm)
Ø Ball Dia
(Mil)
Pitch
Solder Ball
Spacing
Max Pressure
Per Ball
Sn63/Pb37
Max Pressure
Per Ball
SAC305
0.25mm 10mil 0.5mm 3 g 7 g
0.40mm 16 mil 0.8mm 6 g 12 g
0.50mm 18 mil 0.92mm
Hex Pattern
7 g 14 g
0.63mm 25 mil 1.0mm 8 g 16 g
0.76mm 30 mil 1.27mm 12 g 24 g
Maximum mechanical downward pressure (force) caused by heatsink mass mounted on top of BGA.
PCB and BGA should be designed to prevent bending or flexing of the PCB and BGA substrate.
Pressure is typically applied to a thermal pad to keep contact between the top of the BGA and underside of heatsink.
The pressure should be limited to prevent the BGA from being destroyed by too much force on top of the package.
Above data was extracted from recommendations provided by Intel (Altera) as of May 2020.
Data provided above are approximations and are not guaranteed to be accurate.
Numbers are rounded or truncated for easy reference.



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