|
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|
MIL-STD-883L 3.3.6 • Pull Stength: MIL-STD-883K TM2038
• Reflow Temperature • Cryo Questionnaire
• Column Questionnaire |
| TopLine offers a wide range solder columns to meet your needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20. We wind copper ribbon around the columns to increase reliability. After winding, the column is coated with Sn63/Pb37 hot solder. We can provide columns with a variety of diameters and lengths. A choice of different solder cores and copper ribbon thicknesses are available. Solder core materials from 0.20~0.89mm (8~35mils) and copper ribbon thickness from 0.0127~0.038mm (0.5 ~ 1.5mils) are readily available. We can provide custom size columns to meet your project requirements. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs. |
| |
| Copper Wrap Columns |
| TopLine offers columns with Tin-Lead as well as Lead Free solder cores. Contact TopLine to discuss your specific needs. |
| |
Why Columns? |
| Solder columns are more reliable that solder balls when connecting large size IC packages to PC Boards operating in harsh environments. Large CTE (Coefficient of Thermal Expansion) mismatch puts stress on the interconnections over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.7ppm/°C. The CTE of organic boards, such as FR4 is more than 17.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the ceramic IC and the board will break over time enduring thousands of temperature cycles. Solder columns are compliant and absorb CTE mismatch, thereby lengthening the life of the circuit. Road map solder columns for Quantum Computers. |
|
| | Plain Pb90/Sn10 Traditional Columns |
| Fig. |
Alloy |
Column
Ø Diameter
±0.025mm |
Column
Length
±0.050mm |
CCGA
Pitch |
Copper
Cu Ribbon |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 1 |
Pb90/Sn10
"U" Unplated |
Ø 0.20mm
(Ø 0.008") |
1.0mm
(0.040") |
0.50mm |
None |
CG9010U8x40 |
900840 |
 360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.27mm
(0.050") |
0.50mm |
None |
CG9010U10x50 |
901050 |
360 ° Model |
Ø 0.30mm
(Ø 0.012") |
1.50mm
(0.060") |
0.80mm |
None |
CG9010U12x60 |
901260 |
360 ° Model |
Ø 0.38mm
(Ø 0.015") |
2.21mm
(0.087") |
1.0mm |
None |
CG9010U15x87 |
901587 |
360 ° Model |
 |
Ø 0.51mm
(Ø 0.020") |
1.80mm
(0.070") |
1.0mm~
1.27mm |
None |
CG9010U20x70 |
902070 |
360 ° Model |
2.21mm
(0.087") |
1.0mm~
1.27mm |
None |
CG9010U20x87 |
902087 |
360 ° Model |
2.31mm
(0.091") |
1.0mm~
1.27mm |
None |
CG9010U20x91 |
902091 |
360 ° Model |
2.54mm
(0.100") |
1.0mm~
1.27mm |
None |
CG9010U20x100 |
902099 |
360 ° Model |
|
Ø 0.51mm
(Ø 0.022") |
1.80mm
(0.070") |
1.27mm |
None |
CG9010U22x70 |
922070 |
360 ° Model |
|
| |
| |
| Copper Wrapped Pb80/Sn20 Columns • Size Parameter |
| Fig. |
Alloy |
Column
Ø Diameter
±0.05mm |
Column
Length
±0.05mm |
Pitch
Application |
Solder
Core
ØDiameter |
Copper
Cu Ribbon
Thickness |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 2A |
Pb80/Sn20
"C" Plating |
Ø 0.30mm
(Ø 0.012") |
1.27mm
(0.050") |
Pitch 0.8~1.0mm
Plastic BGA/LGA
Pad Ø 0.40~0.45mm |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1 mil) |
CG8020C12x50 |
801250 |
360 ° Model |
1.52mm
(0.060") |
CG8020C12x60 |
801260 |
360 ° Model |
1.78mm
(0.070") |
CG8020C12x70 |
801270 |
360 ° Model |
2.21mm
(0.087") |
CG8020C12x87 |
801287 |
360 ° Model |
2.31mm
(0.091") |
CG8020C12x91 |
801291 |
360 ° Model |
|
Ø 0.38mm
(Ø 0.015") |
2.21mm
(0.087") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50mm |
Ø 0.30mm
(Ø 0.012") |
0.025mm
(1 mil) |
CG8020C15x87 |
801587 |
360 ° Model |
2.31mm
(0.091") |
CG8020C15x91 |
801591 |
360 ° Model |
2.41mm
(0.095") |
CG8020C15x95 |
801595 |
360 ° Model |
2.54mm
(0.100") |
CG8020C15x100 |
801599 |
360 ° Model |
|
Ø 0.40mm
(Ø 0.016") |
2.21mm
(0.087") |
Pitch 1.0mm
Ceramic CCGA
Pad Ø 0.70mm |
Ø 0.35mm
(Ø 0.0140") |
0.025mm
(1.0 mil) |
CG8020C16x87 |
801687 |
360 ° Model |
|
Ø 0.51mm
(Ø 0.020") |
2.21mm
(0.087") |
Pitch 1.0mm~
1.27mm
Ceramic CCGA
Pad Ø 0.80mm |
Ø 0.40mm
(Ø 0.0160") |
0.038mm
(1.5 mil) |
CG8020C20x87 |
802087 |
360 ° Model |
2.31mm
(0.091") |
CG8020C20x91 |
802091 |
360 ° Model |
2.36mm
(0.093") |
CG8020C20x93 |
802093 |
360 ° Model |
2.54mm
(0.100") |
CG8020C20x100 |
802099 |
360 ° Model |
|
Ø 0.56mm
(Ø 0.022") |
2.21mm
(0.087") |
Pitch 1.27mm
Ceramic CCGA
Pad Ø 0.86mm |
Ø 0.45mm
(Ø 0.0160") |
0.038mm
(1.5 mil) |
CG8020C22x87 |
802287 |
360 ° Model |
|
Note 1: Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
Note 2: Contact TopLine for other ØDiameter and Length available. |
| |
| |
| Copper Wrapped Pb90/Sn10 Columns NEW |
| Fig. |
Alloy |
Column
Ø Diameter
±0.05mm |
Column
Length
±0.05mm |
Pitch
Application |
Solder
Core
ØDiameter |
Copper
Cu Ribbon
Thickness |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 2B |
Pb90/Sn10
"C" Plating |
Ø 0.30mm
(Ø 0.012") |
2.31mm
(0.091") |
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1.0 mil) |
CG9010C12x91 |
911291 |
360 ° Model |
Ø 0.30mm
(Ø 0.012") |
2.54mm
(0.100") |
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1.0 mil) |
CG9010C12x100 |
911299 |
360 ° Model |
Ø 0.38mm
(Ø 0.015") |
2.31mm
(0.091") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm |
Ø 0.30mm
(Ø 0.012") |
0.025mm
(1.0 mil) |
CG9010C15x91 |
911591 |
360 ° Model |
Ø 0.38mm
(Ø 0.015") |
2.54mm
(0.100") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm |
Ø 0.30mm
(Ø 0.012") |
0.025mm
(1.0 mil) |
CG9010C15x100 |
911599 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
1.80mm
(0.063") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm |
Ø 0.40mm
(Ø 0.016") |
0.038mm
(1.5 mil) |
CG9010C20x70 |
912070 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
2.31mm
(0.091") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm |
Ø 0.40mm
(Ø 0.016") |
0.038mm
(1.5 mil) |
CG9010C20x91 |
912091 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
2.54mm
(0.100") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm |
Ø 0.40mm
(Ø 0.016") |
0.038mm
(1.5 mil) |
CG9010C20x100 |
912099 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
3.81mm
(0.150") |
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm |
Ø 0.40mm
(Ø 0.016") |
0.038mm
(1.5 mil) |
CG9010C20x150 |
912097 |
360 ° Model |
Ø 0.56mm
(Ø 0.022") |
1.80mm
(0.063") |
Pitch 1.27mm
Plastic BGA/LGA
Pad Ø 0.86mm |
Ø 0.45mm
(Ø 0.018") |
0.038mm
(1.5 mil) |
CG9010C22x70 |
912270 |
360 ° Model |
|
Note 1: Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
Note 2: Contact TopLine for other ØDiameter and Length available.
Note 3: Copper wrapped Pb90/Sn10 provides wider process window for secondary assembly to PWB board. |
| |
| |
| NASA Invented Micro-coil Spring |
| Fig. |
Alloy |
Spring
Ø Diameter
±0.025mm |
Free
Length
±0.050mm |
CCGA
Pitch |
Plating |
Wire
ØDia |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 3 |
Micro-Coil
BeCu
C17200
Alloy 25 |
Ø 0.40mm
(Ø 0.016") |
1.0mm
(0.040") |
1.0mm
Plastic BGA/LGA |
Sn60/Pb40 |
0.0635mm
(Ø 0.0025") |
MCS172P16x40 |
171640 |
360 ° Model |
Ø 0.40mm
(Ø 0.016") |
1.0mm
(0.040") |
1.0mm
Plastic BGA/LGA |
Lead Free
Au 10 µ-inch
(0.25µm) |
0.0635mm
(Ø 0.0025") |
MCS172G16x40 |
191640 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
1.27mm
(0.050") |
1.0~1.27mm
Standard
Ceramic CCGA |
Sn60/Pb40 |
0.086mm
(Ø 0.0034") |
MCS172P20x50 |
172050 |
360 ° Model |
Ø 0.51mm
(Ø 0.020") |
1.27mm
(0.050") |
1.0~1.27mm
Lead Free |
Lead Free
Au 10 µ-inch
(0.25µm)) |
0.086mm
(Ø 0.0034") |
MCS172G20x50 |
192050 |
360 ° Model |
|
| Note: Contact TopLine for ØDiameter and Length available. |
| |
| |
| Copper Column (Lead Free RoHS) |
| Fig. |
Alloy |
Column
Ø Diameter
±0.03mm |
Column
Length
±0.05mm |
Plating
Coating |
AWG
Nearest
Equivalent |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 4 |
Copper Alloy
OFE - 99.9%
G Plating
Ni-Gold Coated
Ni/Au
RoHS
| Ø 0.20mm
(Ø 0.008") |
0.50mm
(0.020") |
NiAu |
AWG 32 |
CU110G8x20A |
600820 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
0.63mm
(0.025") |
NiAu |
AWG 32 |
CU110G8x25A |
600825 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
0.80mm
(0.031") |
NiAu |
AWG 32 |
CU110G8x31A |
600831 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
1.00mm
(0.040") |
NiAu |
AWG 32 |
CU110G8x40A |
600840 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
1.27mm
(0.050") |
NiAu |
AWG 32 |
CU110G8x50A |
600850 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
1.5mm
(0.060") |
NiAu |
AWG 32 |
CU110G8x60A |
600860 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
1.6mm
(0.063") |
NiAu |
AWG 32 |
CU110G8x63A |
600863 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
1.9mm
(0.075") |
NiAu |
AWG 32 |
CU110G8x75A |
600875 |
360 ° Model |
Ø 0.20mm
(Ø 0.008") |
2.2mm
(0.087") |
NiAu |
AWG 32 |
CU110G8x87A |
600887 |
360 ° Model |
|
Ø 0.25mm
(Ø 0.010") |
0.50mm
(0.020") |
NiAu |
AWG 30 |
CU110G10x20A |
601025 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
0.63mm
(0.025") |
NiAu |
AWG 30 |
CU110G10x25A |
601025 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
0.80mm
(0.031") |
NiAu |
AWG 30 |
CU110G10x31A |
601031 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.00mm
(0.040") |
NiAu |
AWG 30 |
CU110G10x40A |
601040 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.27mm
(0.050") |
NiAu |
AWG 30 |
CU110G10x50A |
601050 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.5mm
(0.060") |
NiAu |
AWG 30 |
CU110G10x60A |
601060 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.6mm
(0.063") |
NiAu |
AWG 30 |
CU110G10x63A |
601063 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
1.9mm
(0.075") |
NiAu |
AWG 30 |
CU110G10x75A |
601075 |
360 ° Model |
Ø 0.25mm
(Ø 0.010") |
2.2mm
(0.087") |
NiAu |
AWG 30 |
CU110G10x87A |
601087 |
360 ° Model |
|
| Note: Contact TopLine for other ØDiameter (0.10~0.50mm) and Length (0.25~3.5mm) available. |
| Excellent thermal conductivity. Transfers heat from CCGA to ground layers in PCB. |
| |
| |
| Copper Braided Solder Columns U.S. PATENT
10,477,698
•
CN Patent
111,822,899 • More About |
| Fig. |
Alloy |
Column
Ø Diameter
±0.05mm |
Column
Length
±0.05mm |
Core
Material |
Solder
Core
Ø Diameter |
Copper
Cu
Ø Diameter |
Copper
Nbr
Strands |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
| Fig. 5 |
Copper
Braided Column
Lead Free
and Tin-Lead |
Ø 0.30mm
(Ø 0.012") |
2.21mm
(0.087") |
Lead Free |
Ø 0.20mm
(Ø 0.008") |
0.025mm
(1.0 mil) |
16X |
BC10H12x87A |
951287 |
360 ° Model |
| Pb80/Sn20 |
Ø 0.20mm
(Ø 0.008") |
0.025mm
(1.0 mil) |
16X |
BC8020B12x87A |
751287 |
| Pb90/Sn10 |
Ø 0.20mm
(Ø 0.008") |
0.025mm
(1.0 mil) |
16X |
BC9010B12x87A |
711287 |
|
Ø 0.35mm
(Ø 0.014") |
2.21mm
(0.087") |
Lead Free |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1.0 mil) |
16X |
BC10H14x87A |
951487 |
360 ° Model |
| Pb80/Sn20 |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1.0 mil) |
16X |
BC8020B14x87A |
751487 |
| Pb90/Sn10 |
Ø 0.25mm
(Ø 0.010") |
0.025mm
(1.0 mil) |
16X |
BC9010B14x87A |
711487 |
|
Ø 0.40mm
(Ø 0.016") |
2.21mm
(0.087") |
Lead Free |
Ø 0.25mm
(Ø 0.010") |
0.038mm
(1.5 mil) |
16X |
BC10H16x87B |
951687 |
360 ° Model |
| Pb80/Sn20 |
Ø 0.25mm
(Ø 0.010") |
0.038mm
(1.5 mil) |
16X |
BC8020B16x87B |
751687 |
| Pb90/Sn10 |
Ø 0.25mm
(Ø 0.010") |
0.038mm
(1.5 mil) |
16X |
BC9010B16x87B |
711687 |
|
Ø 0.45mm
(Ø 0.018") |
2.21mm
(0.087") |
Lead Free |
Ø 0.30mm
(Ø 0.012") |
0.038mm
(1.5 mil) |
16X |
BC10H18x87B |
951887 |
360 ° Model |
| Pb80/Sn20 |
Ø 0.30mm
(Ø 0.012") |
0.038mm
(1.5 mil) |
16X |
BC8020B18x87B |
751887 |
| Pb90/Sn10 |
Ø 0.30mm
(Ø 0.012") |
0.038mm
(1.5 mil) |
16X |
BC9010B18x87B |
711887 |
|
Ø 0.50mm
(Ø 0.020") |
2.21mm
(0.087") |
Lead Free |
Ø 0.35mm
(Ø 0.014") |
0.038mm
(1.5 mil) |
16X |
BC10H20x87B |
952087 |
360 ° Model |
| Pb80/Sn20 |
Ø 0.35mm
(Ø 0.014") |
0.038mm
(1.5 mil) |
16X |
BC8020B20x87B |
752087 |
| Pb90/Sn10 |
Ø 0.35mm
(Ø 0.014") |
0.038mm
(1.5 mil) |
16X |
BC9010B20x87B |
712087 |
|
| Note: Contact TopLine for other ØDiameter and Length available up to 3.8mm Long. |
Benefits of New Copper Braided Solder Column:
1. Non-collapsible, robust and compliant structure. Use for reducing stress caused by CTE mismatch.
2. New Lead Free Braided Columns available for COTS Eu-RoHS applications
3. The Exoskeleton Copper Sleeve acts as a heat pipe to conduct heat from underside of chip. Smaller size and lighter package.
4. Small diameter Braided Columns for fine-pitch devices. Smaller size and lighter package.
5. Available material sets: Tin-Lead Mil/Aerospace: Pb80/Sn20, Pb90/Sn10, Indium and RoHS: Lead Free for COTS applications
6. Columns for Quantum Computers made from Indium-Niobium Alloys.
7. Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
8. Road map solder columns for Quantum Computers.
|
| |
| |
| AWG Size Chart (Reference Only) |
AWG
Gauge |
Mil |
Inch |
Micron
μm |
Millimeter
mm |
| AWG 24 |
20 mil |
0.020" |
500um |
0.50mm |
| AWG 25 |
18 mil |
0.018" |
450um |
0.45mm |
| AWG 26 |
16 mil |
0.016" |
400um |
0.40mm |
| AWG 27 |
14 mil |
0.014" |
360um |
0.36mm |
| AWG 28 |
12.5 mil |
0.0125" |
320um |
0.32mm |
| AWG 30 |
10 mil |
0.010" |
250um |
0.25mm |
| AWG 32 |
8 mil |
0.008" |
200um |
0.20mm |
| AWG 34 |
6 mil |
0.006" |
150um |
0.15mm |
| AWG 36 |
5 mil |
0.005" |
125um |
0.125mm |
| AWG 38 |
4 mil |
0.004" |
100um |
0.10mm |
| AWG 40 |
3 mil |
0.003" |
80um |
0.08mm |
| AWG 41 |
2.8 mil |
0.0028" |
70um |
0.07mm |
| AWG 42 |
2.5 mil |
0.0025" |
60um |
0.06mm |
| AWG 44 |
2.0 mil |
0.0020" |
50um |
0.05mm |
| AWG 46 |
1.6 mil |
0.0016" |
40um |
0.04mm |
| AWG 47 |
1.4 mil |
0.0014" |
35um |
0.035mm |
| AWG 48 |
1.25 mil |
0.00125" |
32um |
0.032mm |
| AWG 49 |
1.1 mil |
0.0011" |
28um |
0.028mm |
| AWG 50 |
1.0 mil |
0.0010" |
25um |
0.025mm |
| AWG 51 |
0.88 mil |
0.00088" |
22um |
0.022mm |
| AWG 52 |
0.78 mil |
0.00078" |
20um |
0.020mm |
| AWG 53 |
0.70 mil |
0.00070" |
18um |
0.018mm |
| AWG 54 |
0.62 mil |
0.00062" |
16um |
0.016mm |
| AWG 55 |
0.55 mil |
0.00055" |
14um |
0.014mm |
| AWG 56 |
0.49 mil |
0.00049" |
12.5um |
0.0125mm |
|
| Note 1: Sizes listed in table are rounded (up or down) for simplicity and are not guaranteed for accuracy. |
| Note 2: Refer to ASTM standard B258 for accurate dimensions. |
| Note 3: AWG (American Wire Gauge) is predominantly for use in North America for electrically conducting wire. |
| |
| |
| |
| Solidworks® e-Drawings software to view rotatable:
Download |
| |
| |
| Outline Drawing |
| Fig. 1 |
|
Fig. 2 |
 |
|
 |
Pb90/Sn10
Solder Column
Click Photo |
|
Pb80/Sn20 Traditional
Pb85/Sn15 New
Pb90/Sn10 New
Solder Column with Cu Wrap
Click Photo to see Sn63/Pb37 coating over the column
Click Photo |
| |
| |
|
|
Column Part Number System
|
| CG |
8020 |
C |
20 |
X |
87 |
Option |
| Column Type |
Core Alloy |
Coating |
Ø Diameter
Mils |
Packaging |
Length
Mils |
Option |
CG = Solder Column
MCS = Micro Coil Spring
BC = Braided Column
CC = Copper Core Column
CU = Copper Pillar Column
|
Copper Wrap:
8020 = Pb80/Sn20
8515 = Pb85/Sn15
9010 = Pb90/Sn10
Braided Columns:
U.S. Patent 10,477,698
CN Patent 111,822,899
Tin-Lead SnPb
Braided Columns:
8020 = Pb80/Sn20
9010 = Pb90/Sn10
935 = Pb93.5/Sn5/Ag1.5
Lead Free (RoHS)
Braided Columns:
5 = Sn95/Sb5
8 = Sn91.5/Sb8.5
10 = Sn90/Sb10
Cryogenic Applications
Space & Quantum Computer
Indium Alloy
Braided Columns:
100 = Indium (In100)
97 = Indium/Silver (In97/Ag3)
90 = Indium/Silver (In90/Ag10)
70 = Indium/Lead (In70/Pb30)
172 = BeCu (C172N) Nb Braid
Metal Core:
4 = Au 99.99% (Gold)
101 = Cu OFHC (CDA101)
110 = Cu EFTEC-3 Soft (C14410)
194 = Cu EFTEC-194 Hard
Cu97.4/Fe2.4/Zn.13 (C194)
Micro-Coil Spring:
172 = BeCu (C172)
Cu98% Be1.8% Co+Ni0.2%
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Column Cu Wrap(CG)
C = Sn63/Pb37 (Tin-Lead)
Plain Column(CG)
U = Unplated - Bare
Micro-coil Spring (MCS)
P = Sn60/Pb40
G = Ni/Au (RoHS)
Cu Pillar/Column (CU)
G = NiAu (RoHS)
U = Unplated (RoHS)
P = Sn60/Pb40
Copper Core Column (CC)
A = Pb90/Sn10 Ribbon
Coat Sn63/Pb37
K = Sn90/Sb10 Ribbon (RoHS)
Coat Sn90/Ag3.5/Bi0.5/In6.0
Braided Column (BC)
Braided Tin-Lead
B = Sn63/Pb37 16*Cu
L = Sn63/Pb37 8*Cu
M = Pb80/Sn20 16*Cu
Braided Lead-Free (RoHS)
H = SAC+ 16*Cu
J = SAC+ 8*Cu
Braided Cryogenic
N = In97/Ag3
Q = In100
T = In52/Sn48
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Solder Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm
Micro Coil Spring
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm
Copper Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
9 = 0.23mm
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
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Standard:
X = Jar
Special:
J = JEDEC Tray
T = 4" Tray
W = 2" Tray
E = Tape & Reel
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Solder Column
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
100 = 2.54mm
138 = 3.51mm
150 = 3.81mm
Micro Coil Spring
25 = 0.65mm
30 = 0.75mm
33 = 0.85mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
Copper Columns
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
73 = 1.85mm
87 = 2.21mm
Other Length Available
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Blank=Standard
A to Z = Custom
Braided Columns
C172 Soft
A= 1.0mil
B= 1.5mil
C= 2.0mil
C172 Hard
D= 1.0mil
E= 1.5mil
F= 2.0mil
Cu-PCC
G= 1.5mil
H= 2.0mil
Au Gold
J= 1.5mil
K= 2.0mil
Nb Niobium
M= 1.0mil
N= 1.5mil
R= 2.0mil
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Column DP# Order Number
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| 8 |
20 |
87 |
0 |
| Column Type |
Ø Diameter
Mils |
Length
Mils |
Package
Quantity |
Pb80/Sn20 Solder Column (CG):
8 = Cu Wrap Ribbon (C)
Pb90/Sn10 Solder Column (CG):
9 = Plain Column (U)
0 = Cu Wrap Ribbon (C)
Braided Column (BC) 16X:
U.S. Patent 10,477,698
CN Patent 111,822,899
4 = Cu Braid + Pb80/Sn20 Solder (B)
5 = Cu Braid + Lead Free Solder (H)
7 = Cu Braid + Pb90/Sn10 Solder (B)
Micro-Coil Spring (MCS):
1 = Be-Cu C17200 Plated Sn60/Pb40 (P)
2 = Be-Cu C17200 Plated Ni/Au Gold (G) RoHS
Copper Core Columns (CC):
3 = Cu Core Columns
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Code • Diameter • Pitch
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 1.0mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)
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Code • Length
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
99 = 2.54mm
95 = 2.41mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm
Other Lengths Available
WIP
00 = 8"
12 = 12"
14 = 14"
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Code • Qty
0 = Jar 100pcs
1 = Jar 1Kpcs
2 = Jar 5Kpcs
3 = Jar 10Kpcs
7 = Reel 2500pcs
8 = Tray
9 = Bulk
WIP
0 = PLAIN
1 = WRAP
8 = DIP
9 = WAVE
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Column Drawing Number
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| 80 |
20 |
87 |
| Column Type and Plating |
Ø Diameter
Mils |
Length
Mils |
TIN-LEAD
COPPER WRAP COLUMN (CG)
80 = Pb80/Sn20 (CG8020C)
85 = Pb85/Sn15 (CG8515C)
91 = Pb90/Sn10 (CG9010C)
TIN-LEAD
Plain Solder Column (CG)
90 = Pb90/Sn10 Unplated (CG9010U)
Micro Coil Spring (MCS)
17 = BeCu + Sn60/Pb40 (MCS172P) Tin-Lead
19 = BeCu + Ni/Au RoHS (MCS172G) Lead Free
Cu Columns:
60 = C14410 (EFTEC-3) + NiAu (CU110G)
62 = C101 OFHC + NiAu (CU101G)
64 = C101 OFHC Unplated Bare (CU101U)
65 = C194 (EFTEC-194) + NiAu (CU194G)
66 = C101 OFHC + SnPb(CU101P)
Copper Core Column (CC)
U.S. Patent 10,937,752
CN Patent 114055006 B
Copper Core Solder Column (CC)
Tin-Lead
34 = Cu Core + Pb90/Sn10 (CC9010A)
36 = Cu Core + Pb90/Sn10 + Braid (CC9010B)
Lead Free (RoHS):
33 = Cu Core + Sn90Sb10 (CC10K)
35 = Cu Core + Sn90Sb10 + Braid (CC10H)
Copper Braided Column (BC)
U.S. Patent 10,477,698
CN Patent 111,822,899
Braided Column Lead Free (RoHS) BC
94 = Sn90/Sb10 - 8*Cu (BC10J)
95 = Sn90/Sb10 - 16*Cu (BC10H)
96 = Sn95/Sb5 - 8*Cu (BC5J)
97 = Sn95/Sb5 - 16*Cu (BC5H)
98 = Sn91.5/Sb8.5 - 16*Cu (BC8H)
Braided Column Tin-Lead (BC)
70 = In70/Pb30 - 16*Cu (BC70N)
71 = Pb90/Sn10 - 16*Cu (BC9010B)
72 = Pb90/Sn10 32*Cu (BC9010D)
73 = Pb90/Sn10 - 8*Cu (BC9010L)
74 = Pb80/Sn20 - 8*Cu (BC8020L)
75 = Pb80/Sn20 - 16*Cu (BC8020B)
76 = Pb93.5/Sn5/Ag1.5 HMP - 16*Cu (BC935M)
78 = TBA
79 = TBA
Cryogenic Braided Column (BC)
10 = In100 16*Cu (BC100T)
11 = In90/Ag10 16*Cu (BC90N)
12 = C172 16*Nb (BC172N)
13 = In97/Ag3 16*Cu (BC97T)
70 = In70/Pb30 - 16*Cu (BC70N)
Application Specific (ASIC)
89 = Customer Specific Assigned number
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Diameter
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 0.8mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
27 = Ø0.70mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)
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Length
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm
Other Lengths Available
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| ECCN: EAR99 Export Administration Regulations (EAR) |
| HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS |
| HS Code: 8311.30.3000 Lead-Tin Solders |
| ITAR: Solder columns and dummy daisy chain CCGA are not
restricted. |
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