| QFN CTE (Coefficient of Thermal Expansion) |
| Material |
Brand-Moldel |
Attributes |
CTE |
Other |
Molding
Compound |
Sumitomo Bakelite
EME-G700H |
Dk 4.1
Dielectric Constant tan εr
Df 0.005
Dissipation Factor δ
Tg 125°C
Thermal Conductivity
0.96W/m • °C
Pb Free • Br Free • Sb Free
UL-94 V-0 Class |
α1 = 7x10-6/°C
α2 = 30x10-6/°C |
Young's Modulus
32GPa
Poisson's Ratio
0.28@ 25°C
0.34 @125°C |
Lead Frame
Base Alloy |
Olin C194 K65
Also Known As:
ASTM Mat'l Nbr
C194000 |
Cu97.45/Fe2.4/Zn.12/P.3
Also Known As:
CuFe2P |
16.7x10-6/°C
@25°C
17.5x10-6/°C
@ 250°C |
Young's Modulus
125GPa
Poisson's Ratio
0.33 |
Surface Treatment
Lead Frame |
Pre-plated
NiPdAu |
Thickness:
Ni 0.50~2.0µm
Pd 0.02~0.15µm
Au 0.003~0.015µm |
Ni 13x10-6/°C
Pd 12x10-6/°C
Au 12x10-6/°C
@ 25°C |
- |
Surface Treatment
Lead Frame |
Post-plated
Matte Tin
Sn100 |
Thickness:
7~15 µm |
23x10-6/°C
@ 25°C |
- |
Die Attach
Adhesive |
Ablebond 84-3 |
Non-Conductive
Tg 125°C
|
40x10-6/°C
<@85°C
100x10-6/°C
>@ 85°C |
- |
Silicon Die
Chip |
Si |
Thickness:
0.22mm
(9mils) |
2.6x10-6/°C |
- |
Gold Bonding
Wire |
Au |
Diameter:
25μm
(1.0 mil) |
14.2x10-6/°C |
- |
| Information is for reference only and is not guaranteed for accuracy. |
