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Wire Bondable Patterned Die |
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| Test Die | ||
| Daisy Chain & Isolated Pads | ||
| Experimental use in Lab | ||
| Variety of Applications | ||
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| Test Die Part Numbering System | ||||||
| TD | 48 | - | 4mm | - | BG250 | DC## |
| Die Type | Number Pads | - | Size in millimeter | - | Back Grinding Thickness µm |
Circuit Pattern |
| TD=Test Die Singulated |
1 = Fully Aluminized 16, 32, 64 , etc pads |
- | Size 1.0x1.0mm 2.5x2.5mm 4 x4mm 8 x8mm 12 x 12mm etc. |
- | BG250=250µm | DC## = Daisy Chain ISO = Isolated Pads GP = Ground Plane FULL = Fully metalized |
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| Variety of options and packaging are available. Tell us your application. | ||||||
| Die Ordering Information | |||||
| Nbr Pads Die Size |
Daisy Chain Circuit |
Isolated Pads | Ground Plane Dual Circuit |
Fully Metalized | Qty in Waffle Pack |
| 16L 1.0x1.0mm |
TD16-1mm-BG250-DC## | TD16-1mm-BG250-ISO | TD16-1mm-BG250-GP | TD16-1mm-BG250-FULL | 100 |
| 32L 2.5x2.5mm |
TD32-2.5mm-BG250-DC## | TD32-2.5mm-BG250-ISO | TD32-2.5mm-BG250-GP | TD32-2.5mm-BG250-FULL | 100 |
| 48L 4.0x4.0mm |
TD48-4mm-BG250-DC## | TD48-4mm-BG250-ISO | TD48-4mm-BG250-GP | TD48-4mm-BG250-FULL | 64 |
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| Back grinding available other thicknesses. Variety of options and packaging are available. Tell us your application. | |||||
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Related Links: Wafer Dummy Die Flip Chip |
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TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: sales@topline.tv • Home |
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