PID Particle Impact Damper (P.I.D.)attenuates vibration in PWB card assemblies. Extends hardware life and reliability. COTS solution. Suitable for hardening heritage hardware in the field. Simple board level component for new designs. Technology invented at NASA Marshall Space Flight Center. Vibration Attenuation. PID Particle Dampers reduce fundamental mode frequency vibration. Vibration ABSORBER. Particle Damper, Performance in Vibration Environment, Damping, Resonance, Attenuation, Mitigation of Vibration Response, Response Estimate, Response Verification , vibroacoustics ,random vibration , pyroshock , Random Vibration Loads, Vibration Mitigation, particle damping, particle , Mitigation Vibration , particle impact damping , vibration engineering , vibration.engineering , Particle damper , partical damping , partical vibration damper , vibration dampers , PID DAMPER , DAMPER PID , 714530 EL SQ45, FL1.0SQ14X4.0A

	Vibration Attenuation PID Damper Inspired by Gravity^® Patent US9521753 B1

PPT: English • 2 Minute Video

Part Order Numbers • Catalog • NASA Technology Transfer • FAQ

Attenuate harmful PCB vibration with Particle Impact Damper PID components.

Inspired by Vibration^®

Call to Order 1-800-776-9888 • Catalog • Watch 2 minute video

Problem: Harsh vibration at fundamental frequency f_o causes premature component failure and damage to Printed Circuit Boards (PCB) assemblies.

Solution: Surface mount a PID (Particle Impact Damper) on your PCB assembly. The PID component extends hardware life. It is a lighter, simpler solution, reducing the need for redundant systems. After vibration hardening, old hardware is ready for new missions in new operating environments.

How: The PID is housed in a sealed container that is filled to 90% with tungsten (Wolfram) balls. The counterbalance impact of tungsten balls in the PID dampens fundamental frequency f_o mode vibrations in the PCB assembly. This maximizes energy transfer to the PID which dampens vibration. The weight of the tungsten inside the PID is approximately 10% the mass of the PCB assembly.

Where: Place the PID component near the geometric center (anti-node) of the PCB. The damping effect attenuates vibration and increases board assembly reliability. The PID may be located on either side of the board.

Alternatives: The PID may be attached to an optional interposer bridge to straddle existing high density components on the board.

Fun facts: Tungsten (W) is environmentally friendly. Tungsten's properties include high density and extreme tensile strength. The PID can fully function at extreme temperatures without derating.

Vibration at the fundamental frequency f_o causes bending, fatigue and cracks in the PCB assembly. Excessive vibration from external excitations lead to catastrophic failure. NASA invented PID technology to reduce vibration and increase reliability in circuit board assemblies.

PID are commercially available COTS components. Mounting methods include: standard surface mount soldering, BGA, screw mounting and epoxy mounting with permanent adhesives. Engineering development kits are available.


PID Simulation • Card Simulation Schematic	Particle Damper Single Degree of Freedom PID technology works without batteries or electrical power. The motion of the tungsten balls in the sealed PID housing removes vibratory energy from non-linear vibroacoustic environments such as PCB card assemblies. Losses and damping occur during impacts between the tungsten balls and the walls. The PID straightens the PCB at the central lobe and attenuates vibration by pushing and pulling the PCB in the opposite direction after the tungsten balls overcome gravity. *PID* is also suitable for tuned beam fixtures. Schematic of PID and System M = Mass of Card Assembly K = Stiffness of Card at fo C= Inherent Damping of Card m_p = Mass Tungsten Balls in PID	Inspired by Gravity^® Simulation of Particle Impact Damper




Weibull Failure Analysis #1 A destructive life test was performed on NASA's Marshall Space Flight Center printed circuit card assemblies 4" x 7" (10 x 18cm) 0.090-inch (2.3mm) thick. Four 21mm x 21mm daisy-chained 400-I/O CCGA column grid array components were mounted on each card. One card was left undamped. A *PID* damper was epoxy mounted at the center of the second card. The cards were mounted side by side onto a vibration table and subjected to excessive vibrations. 19 channels on the undamped boards (without *PID) failed within 12 minutes. By comparison, 19 channels on the damped boards (with PID*) survived 5 hours (306 minutes) before ultimately failing. See YouTube Video.



Weibull Failure Analysis #2 Comparison was made between assemblies of two different card thickness: 0.070-inch (1.78mm) versus 0.090-inch (2.3mm). Card size 4" x 7" (10 x 18cm). 8 assemblies total. 4 assemblies of each thickness. Four 21mm x 21mm daisy-chained 400-I/O CCGA column grid array components were mounted on each card. 2 cards of each thickness were left undamped. A *PID* particle impact damper was epoxy mounted at the center of the other cards. Cards of same thickness were mounted side by side onto a vibration table and subjected to excessive vibrations. A channel failure was defined as a total increase in resistance greater than 1000 Ohms connected through 100 I/O columns during vibration testing. The time for each failure was recorded. A Weibull analysis of channel failures for damped and undamped boards of two thicknesses was recorded. In all cases, damped assemblies with *PID* survived longer. The damped thinner boards (0.070-inch) with *PID* survived longer than the undamped thicker board (0.090 inch) without *PID*. See NASA study Demonstrating Effect Particle Impact Damper


Acceleration measured during Weibull Failure Analysis #2 Comparison of undamped and damped assembly.	Strain Spectral Densities measured during Weibull Failure Analysis #2 Comparison of undamped and damped assembly.


Outline Drawing (PDF)
TYPICAL PID OUTLINE Example layout of PID as a development kit. The housing consists of a cylindrical canister. The threaded PID housing is screwed onto the flange mounted near the geometric center of the board. A small plugged hole at the top of the canister allows tungsten balls to be added or removed. The payload of tungsten balls is determined while observing vibration damping (attenuation). A final design can be fabricated for volume production after optimizing the system.


Tungsten Balls	Property of Tungsten Tungsten (W) is an environmentally friendly substance of high density and tensile strength that can fully function at extremely low and very high temperatures. Atomic Number 74 Density 19.3g/cc (@20°C) Linear CTE 4.3 ppm/deg;C Poisson's Ratio 0.284 Melting Point 3400°C Tensile Strength 700~3400 MPa @25°C Weights and Measures: Size: Ø2.0mm Weight 0.07405 gm each 13,500 balls per kg Size: Ø0.079" Weight 0.00016315 lbs each 6131 per lbs


Part Numbering System
F	A	1.0	SQ	13x4.0	Rev
Series	Mounting on PCB	Tungsten Payload Grams	Exterior Shape	Size (mm) Max	Version/Option
Series • Description STANDARD PID (Filled) F = FR4 Case Other: A = Aluminum Case Empty (Tunable) PID E = FR4 Single Layer K = Engineering Kit Hardware & Accessory B = Bridge	Code • Type STANDARD: A = Adhesive Glue/Epoxy OTHER: S = Screw	Weight • Grams − Empty 0.1 = 0.1 gm 0.5 = 0.5 gm 0.9 = 0.9 gm 1.0 = 1.0 gm 2.5 = 2.5 gm 5.0 = 5.0 gm 10 = 10 gm 25 = 25 gm 50 = 50 gm 100 = 100 gm 200 = 200 gm 400 = 400 gm 500 = 500 gm 999 = 999 gm Other Mass Available	Code • Shape SQ = Square R = Rectangular C = Cylindrical T = Toroidal Z = Custom	SQUARE X/Y • Height 13 x 4.0 19 x 4.5 25 x 5.0 35 x 6.5 45 x 10 Other Sizes Available Rectangle X • Y • Z 13 x 20 x 4.0 19 x 25 x 4.5 25 x 32 x 5.0 32 x 50 x 10 Other Sizes Available	Option-Rev Code • Version A • 01 B • 02 C • 03 Z • 26 - - - - BA • 27 BB • 28 BC • 29 BZ • 52 - - - - CA • 53 CB • 54 CC • 55 CZ • 77 - - - - DA • 78 DB • 79 DC • 80 DU • 99


Filled Drawing Number System
1	3	591	1
Series	Mount Style	Mass (gm) 9 = Decimal Point	Option Code
Code • Item Description STANDARD: 1 = PID Filled & Sealed OTHER: 2 = TBA 3 = TBA 4 = TBA	Code • Description STANDARD: 3 = Adhesive (FA) OTHER: 2 = Screw (FS) 9 = Custom	Code • Weight 001~008 = Accessory — — — 908 = 0.08 gm 912 = 0.12 gm 948 = 0.48 gm 962 = 0.62 gm 993 = 0.93 gm — — — 190 = 1.0 gm 197 = 1.7 gm 295 = 2.5 gm 591 = 5.1 gm 792 = 7.2 gm — — — 010 = 10 gm 017 = 17 gm 024 = 24 gm 030 = 30 gm 052 = 52 gm — — — 100 = 100 gm 150 = 150 gm 200 = 200 gm Code 9 = Decimal Other Mass Available	Filled/Sealed Code • Option 1 = Option A 2 = Option B 3 = Option C Other Options Available


Empty Drawing Number System
7	3	35	01
Series	Mount Style	Package Type	Option Code
Code • Item Description 5 = Engineering Development Kit 6 = Interposer Bridge 7 = Empty Cavity Package 9 = Hardware & Accessories	Code • Description 2 = Screw 3 = Adhesive 9 = Custom 0 = Outline DWG	Code • Size 07 = 7mm 08 = 8mm 09 = 9mm 10 = 10mm 13 = 13mm 15 = 15mm 17 = 17mm 23 = 23mm 25 = 25mm 27 = 27mm 35 = 35mm 37 = 37.5mm 40 = 40mm 42 = 42.5mm 45 = 45mm 47 = 47.5mm 50 = 50mm 52 = 52.5mm 55 = 55mm 60 = 60mm More Sizes Available	Code • Option 01 = Option A 02 = Option B 03 = Option C 04 = Option D 05 = Option E 06 = Option F 07 = Option G 08 = Option H 10 = Option J 11 = Option K 12 = Option L 13 = Option M 14 = Option N 16 = Option P 17 = Option Q 18 = Option R 19 = Option S 20 = Option T 21 = Option U 22 = Option V 23 = Option W 24 = Option X 25 = Option Y 26 = Option Z	Code • Option 27 = Option BA 28 = Option BB 29 = Option BC 30 = Option BD 31 = Option BE 32 = Option BF 33 = Option BG 34 = Option BH 36 = Option BJ 37 = Option BK 38 = Option BL 39 = Option BM 40 = Option BN 42 = Option BP 43 = Option BQ 44 = Option BR 45 = Option BS 46 = Option BT 47 = Option BU 48 = Option BV 49 = Option BW 50 = Option BX 51 = Option BY 52 = Option BZ	Code • Option 53 = Option CA 54 = Option CB 55 = Option CC 56 = Option CD 57 = Option CE 58 = Option CF 59 = Option CG 60 = Option CH 62 = Option CJ 63 = Option CK 64 = Option CL 65 = Option CM 66 = Option CN 68 = Option CP 69 = Option CQ 70 = Option CR 71 = Option CS 72 = Option CT 73 = Option CU 74 = Option CV 75 = Option CW 76 = Option CX 77 = Option CY 78 = Option CZ	Code • Option 79 = Option DA 80 = Option DB 81 = Option DC 82 = Option DD 83 = Option DE 84 = Option DF 85 = Option DG 86 = Option DH 88 = Option DJ 89 = Option DK 90 = Option DL 91 = Option DM 92 = Option DN 94 = Option DP 95 = Option DQ 96 = Option DR 97 = Option DS 98 = Option DT 99 = Option DU Other Options Available

ECCN: EAR99 Export Administration Regulations
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
ITAR: Not Restricted.

Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models. For PC • MAC Version

TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000
Email: sales@topline.tv

©2022 TopLine. All Rights Reserved.

Home