Flip Chips
With Daisy Chain
 
Useful Links:  Practice PC Boards     Part Number System     More Wire bondable Test Die      Quartz Die For Underfill Experiments
 
Example Full Array
With Daisy Chain
Example Perimeter
With Daisy Chain
 
Flip Chips with Daisy Chain (Eutectic and SAC Bumps)
Bumps Bump Matrix Pitch Die Size
(mm)
Bump
Height
UBM
øDia
Tray Qty Eutectic
Sn63/Pb37
Order Number
Lead Free
SAC - Sn/Ag/Cu
Order Number
Ref Quick View
88 22x22
Perimeter
204µm 5.08mm 107µm ø102µm 36
Waffle 2"
FC88G5.08E204-DC FC88G5.08C204-DC PB08
112 28x28
Perimeter
152.5µm 5.08mm 85µm ø88µm 36pcs
Waffle 2"
FC112K5.08E152-DC FC112K5.08C152-DC PB06
176 44x44
Perimeter
204µm 10.2mm 107µm ø102µm 49pcs
Waffle 4"
FC176G10E204-DC FC176G10C204-DC PB08
x4
220 44x66
Perimeter
204µm 10mm x
15mm
107µm ø102µm 20pcs
Waffle 4"
FC220G10x15E204-DC FC220G10x15C204-DC PB08
x6
317 18x18
Full Array
254µm 5.08mm 125µm ø102µm 36pcs
Waffle 2"
FC317G5.08E254-DC FC317G5.08C254-DC FA10
484 22x22
Full Array
200µm 5.0mm 74µm ø102µm 36pcs
Waffle 2"
- FC484G5C200-DC -
569 24x24
Full Array
204µm 5.08mm 89µm ø102µm 36pcs
Waffle 2"
FC569G5.08E204-DC FC569G5.08C204-DC FA08
1268 36x36
Full Array
254µm 10.2mm 125µm ø102µm 49pcs
Waffle 4"
FC1268G10E254-DC FC1268G10C254-DC FA10
x4
1936 44x44
Full Array
200µm 10mm 74µm ø102µm 49pcs
Waffle 4"
- FC1936G10C200-DC FC484
x4
2904 44x66
Full Array
200µm 10x15mm 74µm ø102µm 24pcs
Waffle 4"
- FC2904G10x15C200-DC FC484
x6
3844 62x62
Full Array
150µm 10mm 65µm ø65µm 49pcs
Waffle 4"
- FC3844G10C150-DC FC3844
4356 66x66
Full Array
200µm 15mm 74µm ø102µm 16pcs
Waffle 4"
- FC4356G15C200-DC FC484
x9
7744 88x88
Full Array
200µm 20mm 74µm ø102µm 9pcs
Waffle 4"
- FC7744G20C200-DC FC484
x16
 
General Specifications:
Die thickness: Standard 24 mil (600~650µm).
Thin die (back grinding) to 8mils (200µm) available on special order.
6mils (150µm) available on "as-is" basis with yield loss.
 
UBM Al/NiV/Cu: Total Thickness: 16K Å  Al= 4K Å / NiV= 4K Å / Cu= 8K Å
Metal Thickness: 8.9K Å   (Pitch 152µm)    17K Å   (Pitch 204~457µm)
Passivation Thickness: 8K Å   (Pitch 152~204µm)    10K Å   (Pitch 254~457µm)
 
Standard Passivation Type: Nitride
 
Optional Polyimide Passivation provides:
Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination.
 
 
 
Flip Chips (Copper Pillar with SnAg Solder Cap)
Bumps Bump Matrix Pitch Die Size
(mm)
Bump
Height
øDia Packaging Copper Pillar
Lead Free
Solder Cap
Sn/Ag
Order Number
Ref Quick View
245,000 ~495x495
Full Array
40µm 20x20mm 30µm 20µm Gel-Pak 4pcs
-----
4" Waffle Pack 9pcs
----
12" Cassette or Ring
with 148 die
FC245K20C40-I FC250K
157,609 397x397
Full Array
50µm 20x20mm 23µm 25µm Gel-Pak 4pcs
-----
4" Waffle Pack 9pcs
----
8" Cassette or Ring
with 52 die
FC157K20C50-I FC157K
39,601 199x199
Full Array
100µm 20x20mm 37µm ø50µm Gel-Pak 4pcs
-----
4" Waffle Pack 9pcs
----
8" Cassette or Ring
with 52 die
FC39K20C100-I FC39K
4096 64x64
64@2mm Die
200µm 16x16mm 100µm ø100µm Gel-Pak 4pcs
-----
4" Waffle Pack 16pcs
----
8" Cassette or Ring
with 88 die
WLP4096T.2C-DC647D WLP64
1600 40x40
256@2mm Die
200µm 10x10mm 100µm ø100µm 4" Waffle Pack 49pcs
----
8" Cassette or Ring
with 256 die
WLP1600T.2C-DC407D WLP64
64 8x8
7020@2mm Die
200µm 2x2mm 100µm ø100µm 4" Waffle Pack Ask pcs
----
8" Cassette or Ring
with 7020 die
WLP64T.2C-DC888D WLP64
 
 
Packaging Options
Quartz die available with and without bumps (without daisy chain)
5-inch wafers available for all items.
Tape and reel (T&R) packaging available special order.
 

Wafer Box Cassette

(Closed) Wafer Shipper (Open)
Rotatable Model Rotatable Model
 
 
Geometries  •   UBM  •   Bumps  •   Eutectic Properties
 
 
 
 


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