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Column
Attachment

2 Minute Video
Fig.1
Pb90/Sn10
Plain Column

Click Photo
Fig.2
Pb80/Sn20
Column with Cu wrap

Click Photo 1 • 2 • 3
Fig.3
NASA Invented
Micro Coil Spring

Click for details
Fig.4
Electroplated
Copper Column

Click for details
 
About Columns
TopLine offers a wide range solder columns to meet your needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20. We wind copper ribbon around the columns to increase reliability. After winding, the column is coated with Sn63/Pb37 hot solder. We can provide columns with a variety of diameters and lengths using different solder cores and copper ribbon thicknesses. We stock solder core materials from 0.20~0.89mm (8~35mils) and copper ribbon thickness from 0.025~0.10mm (1 to 4mils). We can provide custom size columns to meet your project requirements. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs.
 
Copper Wrap Columns
TopLine offers copper wrapped columns with Pb80/Sn20 as well as Pb90/Sn10 solder cores. Pb90/Sn10 has a wider process window during secondary reflow to the PC Board (PWB-Card). The liquidus/solidus temperature range of Pb80/Sn20 is more difficult to attach to PC boards. The liquidus/solidus temperature of Pb90/Sn10 is more forgiving during secondary operations while soldering and reworking.
 
Why Columns?
Solder columns are 10x more reliable that solder balls when attaching large size ceramic IC packages to FR4 or polyimide PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.5ppm/°C. The CTE of organic boards, such as Polyimide or FR4 is roughly 16.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the ceramic IC and the mother board will break over time enduring thousands of temperature cycles. Solder columns are flexible and absorb CTE mismatch, thereby lengthening the life of the circuit.
 
Plain Pb90/Sn10 Traditional Columns
Fig. Alloy Column
Ø  Diameter
±0.025mm
Column
Length
±0.050mm
CCGA
Pitch
Solder
Core
ØDia
Copper
Cu Ribbon
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 1
Pb90/Sn10
"U" Unplated
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
1.0mm~
1.27mm
Ø 0.51mm
(Ø 0.020")
None CG9010U20x87 902087   360 ° Model
2.31mm
(0.091")
1.0mm~
1.27mm
Ø 0.51mm
(Ø 0.020")
None CG9010U20x91 902091   360 ° Model
2.41mm
(0.095")
1.0mm~
1.27mm
Ø 0.51mm
(Ø 0.020")
None CG9010U20x95 902095   360 ° Model
2.54mm
(0.100")
1.0mm~
1.27mm
Ø 0.51mm
(Ø 0.020")
None CG9010U20x100 902099   360 ° Model
3.81mm
(0.150")
1.0mm~
1.27mm
Ø 0.51mm
(Ø 0.020")
None CG9010U20x150 902097   360 ° Model
Ø 0.55mm
(Ø 0.022")
2.21mm
(0.087")
1.27mm Ø 0.55mm
(Ø 0.022")
None CG9010U22x87 902287   360 ° Model
Ø 0.20~0.89mm
(Ø 0.008"~0.035")
All 0.50~
1.27mm
Ø 0.20~0.89mm
(Ø 0.080~0.020")
None CG9010 Series 900001   360 ° Model
_______________________
Note 1: Contact TopLine for other ØDiameter and Length available, including Copper Wrap Pb90/Sn10 columns.
Note 2: Pb90/Sn10 columns are RoHS compliant based on an exemption for high melting temperature solder.
 
 
Copper Wrapped Pb80/Sn20 Columns
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb80/Sn20
"C" Plating
Ø 0.30mm
(Ø 0.012")
1.27mm
(0.050")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.45~0.51mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1 mil)
CG8020C12x50 801250   360 ° Model
1.52mm
(0.060")
CG8020C12x60 801260   360 ° Model
1.78mm
(0.070")
CG8020C12x70 801270   360 ° Model
2.21mm
(0.087")
CG8020C12x87 801287   360 ° Model
2.31mm
(0.091")
CG8020C12x91 801291   360 ° Model
2.41mm
(0.095")
CG8020C12x95 801295   360 ° Model
2.54mm
(0.100")
CG8020C12x100 801299   360 ° Model
3.81mm
(0.150")
CG8020C12x150 801297   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.21mm
(0.087")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.53~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1 mil)
CG8020C15x87 801587   360 ° Model
2.31mm
(0.091")
CG8020C15x91 801591   360 ° Model
2.41mm
(0.095")
CG8020C15x95 801595   360 ° Model
2.54mm
(0.100")
CG8020C15x100 801599   360 ° Model
3.81mm
(0.150")
CG8020C15x150 801597   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
Pitch 1.0mm~
1.27mm

Ceramic CCGA
Pad Ø 0.70~0.80mm
Ø 0.38mm
(Ø 0.0150")
0.050mm
(2 mil)
CG8020C20x87 802087   360 ° Model
2.31mm
(0.091")
CG8020C20x91 802091   360 ° Model
2.41mm
(0.095")
CG8020C20x95 802095   360 ° Model
2.54mm
(0.100")
CG8020C20x100 802099   360 ° Model
3.81mm
(0.150")
CG8020C20x150 802097   360 ° Model
Ø 0.56mm
(Ø 0.022")
2.21mm
(0.087")
Pitch 1.27mm

Ceramic CCGA
Pad Ø 0.86mm
Ø 0.40mm
(Ø 0.0160")
0.050mm
(2 mil)
CG8020C22x87 802287   360 ° Model
2.31mm
(0.091")
CG8020C22x91 802291   360 ° Model
2.41mm
(0.095")
CG8020C22x95 802295   360 ° Model
2.54mm
(0.100")
CG8020C22x100 802299   360 ° Model
Ø 0.889mm
(Ø 0.035")
2.54mm
(0.100")
Pitch 1.5mm

Ceramic CCGA
Pad Ø 1.27mm
Ø 0.76mm
(Ø 0.0300")
0.050mm
(2 mil)
CG8020C35x100 803599   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
NASA Invented Micro-coil Spring
Fig. Alloy Spring
Ø Diameter
±0.025mm
Free
Length
±0.050mm
CCGA
Pitch
Plating Wire
ØDia
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 3
Micro-Coil
BeCu
C17200
Alloy 25
Ø 0.406mm
(Ø 0.016")
1.0mm
(0.040")
1.0mm
Plastic BGA/LGA
Sn60/Pb40 0.0635mm
(Ø 0.0025")
MCS172P16x40 171640   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Standard
Ceramic CCGA
Sn60/Pb40 0.086mm
(Ø 0.0034")
MCS172P20x50 172050   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Lead Free
Ni 30~60 µ-inch
(0.76~1.5µm)
__________
Au 10 µ-inch
(0.25µm)
0.086mm
(Ø 0.0034")
MCS172G20x50 192050   360 ° Model
Note: Contact TopLine for ØDiameter and Length available.
 
 
Copper Wrapped Pb85/Sn15 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb85/Sn15
"C" Plating
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.45~0.51mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG8515C12x91 851291   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.53~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG8515C15x91 851591   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.70~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG8515C20x91 852091   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
Copper Wrapped Pb90/Sn10 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb90/Sn10
"C" Plating
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.45~0.51mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG9010C12x91 911291   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.53~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG9010C15x91 911591   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x91 912091   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
Electroplated Copper over Solder-Core Columns (Improved Electrical and Thermal Resistance) Under Development
Fig. Alloy Column
Ø Diameter
±0.05mm
Column
Length
±0.10mm
CCGA
Pitch
Solder
Core
ØDia
Cu
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
360° Rotatable
Solidworks
Section View
Fig. 4 Pb90/Sn10
"E" Series
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
1.0mm Ø 0.38mm
(Ø 0.0150")
0.051mm
(2 mils)
CG9010E20x87 942087   360 ° Model
2.31mm
(0.100")
Ø 0.38mm
(Ø 0.0150")
0.051mm
(2mils)
CG9010E20x91 942091   360 ° Model
2.41mm
(0.100")
Ø 0.38mm
(Ø 0.0150")
0.051mm
(2mils)
CG9010E20x95 942095   360 ° Model
2.54mm
(0.100")
Ø 0.38mm
(Ø 0.0150")
0.051mm
(2mils)
CG9010E20x100 942099   360 ° Model
3.81mm
(0.150")
Ø 0.38mm
(Ø 0.0150")
0.051mm
(2mils)
CG9010E20x150 942097   360 ° Model  Section View
Note: Contact TopLine for other ØDiameter and Length available.
 
 
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 
Outline Drawing
Fig. 1   Fig. 2
 
Pb90/Sn10
Solder Column


Click Photo
  Pb80/Sn20 Traditional
Pb85/Sn15 New
Pb90/Sn10 New
Solder Column with Cu Wrap

Click Photo to see Sn63/Pb37 coating over the column
Click Photo
 
 
 
Column Part Number System
 
    CG         8020         C         20         X         91         Option    
Column Type Alloy Plating Ø Diameter
Mils
Packaging Length
Mils
  Option
CG = Solder Column

MCS = Micro Coil Spring


CU = Copper (Cu) Column
8020
Pb80/Sn20

8515
Pb85/Sn15

9010
Pb90/Sn10

172
BeCu Micro-coil
C17200 - Alloy 25


101
Copper Alloy
CDA101 OFE
Solder Columns
C = Cu Ribbon Wrap
E = Cu Electro Plated
U = Unplated - Bare


Micro-coil Spring
P = Plated Sn60/Pb40
G = Plated Ni/Au (RoHS)


Cu Column
P = Plated Sn60Pb40
T = Plated Sn100


Under Development
Braided Column
B = Cu (Full Load)
D = Cu (Diamond Load)
Solder Column
8 = 0.20mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm


Micro Coil Spring
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm


Copper Column
5 = 0.13mm
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
10 = 0.25mm
X = Bulk in Jar Solder Column
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
95 = 2.41mm
100 = 2.54mm
110 = 2.80mm
145 = 3.70mm
150 = 3.81mm

Micro Coil Spring
20 = 0.50mm
25 = 0.65mm
30 = 0.75mm
33 = 0.85mm
35 = 0.90mm
40 = 1.00mm
43 = 1.10mm
50 = 1.27mm

Copper Columns
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
87 = 2.21mm
  Blank=Standard

Custom available
 
 
Column DP# Order Number
 
    8         20         91         0    
Column Type Ø Diameter
Mils
Length
Mils
Package
Quantity
Pb80/Sn20 Solder Column:
8 = Cu Wrap + Sn63/Pb37 (C)


Pb85/Sn15 Solder Column:
5 = Cu Wrap + Sn63/Pb37 (C)


Pb90/Sn10 Solder Column:
9 = Unplated Plain Column (U)
0 = Cu Wrap Ribbon + Sn63/Pb37 (C)
4 = Cu Plated + Sn60/Pb40 (E)


Micro-Coil Spring:
1 =   Be-Cu C17200  Plated Sn60/Pb40 (P)
2 =   Be-Cu C17200  Plated Ni/Au Gold (G)


Copper (Cu) Columns:
3 = Cu Column Plated Sn60/Pb40 (P)

Columns Under Development:
6 = unassigned
7 = Braided Column + Sn63/Pb37 (B)
Code • Diameter • Pitch
06 = 0.15mm (P 0.4mm)
08 = 0.20mm (P 0.5mm)
09 = 0.23mm (P 0.5mm)
10 = 0.25mm (P 0.65mm)
11 = 0.28mm (P 0.65mm)
12 = 0.30mm (P 0.8mm)
13 = 0.33mm (P 0.8mm)
14 = 0.35mm (P 0.8mm)
15 = 0.38mm (P 1.0mm)
16 = 0.40mm (P 1.0mm)
17 = 0.43mm (P 1.0mm)
18 = 0.45mm (P 1.0mm)
20 = 0.50mm (P 1.0mm)
22 = 0.56mm (P 1.27mm)
35 = 0.89mm (P ≥1.5mm)

Code   •  Length
20 = 0.50mm
25 = 0.65mm
30 = 0.75mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
95 = 2.41mm
96 = 3.70mm
97 = 3.81mm
98 = 2.80mm
99 = 2.54mm
Code   •  Qty
0 = 100pcs
1 = 1Kpcs
2 = 5Kpcs
3 = 10Kpcs
4 = 25Kpcs
5 = 50Kpcs
6 = 100Kpcs
7 = 250Kpcs
8 = Future
9 = Bulk
 
 
Column Drawing Number
 
    80         20         91    
Column Type and Plating Ø Diameter
Mils
Length
Mils
Pb80/Sn20 Solder Column
80 = Cu Wrap + Sn63/Pb37 (C)


Pb85/Sn15 Solder Column
85 = Cu Wrap + Sn63/Pb37 (C)


Pb90/Sn10 Solder Column
90 = Plain Unplated (U)
91 = Cu Wrapped + Sn63/Pb37 (C)
94 = Cu Plated + Sn60/Pb40 (E)


Micro Coil Spring MCS172
17 = Electroplated Sn60/Pb40 (P)
19 = Ni/Au (G) RoHS



Copper (Cu) Column:
30 = Cu + Sn60/Pb40
33 = Cu + NiAu (G) RoHS
36 = Cu + Ag (V) RoHS
39 = Cu + NiPdAu (F) RoHS



Under Development
Braided Column:
70 = Cu Braid over Pb80/Sn20
75 = Cu Braid over Pb85/Sn15
79 = Cu Briad over Pb90/Sn10


Solder Column
08 = 0.20mm (P 0.5mm)
09 = 0.23mm (P 0.5mm)
10 = 0.25mm (P 0.65mm)
11 = 0.28mm (P 0.65mm)
12 = 0.30mm (P 0.8mm)
13 = 0.33mm (P 0.8mm)
14 = 0.35mm (P 0.8mm)
15 = 0.38mm (P 0.8mm)
16 = 0.40mm (P 1.0mm)
17 = 0.43mm (P 1.0mm)
18 = 0.45mm (P 1.0mm)
20 = 0.50mm (P 1.0mm)
22 = 0.56mm (P 1.27mm)
35 = 0.89mm (P ≥1.5mm)



Micro Coil Spring
16 = 0.40mm (Pitch 1.0mm PBGA)
20 = 0.50mm (Pitch 1.0~1.27mm)


Copper (Cu) Column:
04 = 0.10mm (Pitch 0.4mm PBGA)
05 = 0.13mm (Pitch 0.5mm PBGA)
06 = 0.15mm (Pitch 0.5mm PBGA)
07 = 0.18mm (Pitch 0.65mm PBGA)
08 = 0.20mm (Pitch 0.8mm PBGA)
10 = 0.25mm (Pitch 1.0mm PBGA)
Solder Column
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
95 = 2.41mm
96 = 3.70mm
97 = 3.81mm
98 = 2.80mm
99 = 2.54mm



Micro Coil Spring
40 = 1.00mm
50 = 1.27mm


Copper (Cu) Column:
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
87 = 2.20mm
 
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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For PC   •   MAC Version
 



TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

©2016 TopLine. All Rights Reserved.

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