Enlarge: Top Assembled
Each side has 0.5mm, 0.75mm and 0.8mm pads
Board Size 4"x5.5" (10x14cm) 0.5mm Pads
• 0.75mm Pads
• 0.8mm Pads |
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TopLine Universal CSP Kit Placement Kit. Includes BGA (CSP) with 0.5mm, 0.75mm and 0.8mm pitch . The bottom side has same patterns as the top side.
Board Features:
Choice of Final finish:
• Immersion Tin (Sn)
• ENIG (Ni/Au)Gold
• OSP Copper
• Immersion Silver
• HASL SnPb
LPI Solder Mask - PSR4000 AUS5
FR4 Tg=170°C
Size - 4"x5.5" (10x14cm)
Thickness 0.062" (1.6mm)
2-Layer Board
RoHS Compliant
Tooling Holes .125" (3.17mm)
IPC Fiducials - 0.062" (1.57mm)
Enlarge:
Bare Board (Top)
0.5mm
• 0.75mm
• 0.8mm
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