NASA granted an exclusive license to TopLine Corporation
under U.S. Patent Application Serial No. 13/800,692 entitled Interconnect Device and Assemblies Made Therewith.
Micro-coil springs are a novel interconnect for CCGA IC packages that operate in harsh environments.
Micro-coil springs absorbed extreme shock of up to 50,000g in tests using daisy chain test vehicles.
Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics.
20 x 50mils
0.50 x 1.27mm