Join CCGA Packaging Group CCGA Library Technical Papers, Presentations and References Column Grid Array   Catalog   •   Video   •   CCGA Packages   •   CCGA Column   •   Micro-Coil Spring  •   CCGA PWB   •   Attachment Tools     Technical Papers Ref Title Company Author Subject Nbr Pages File Size Download File Year Pub. 1 THERMAL CYCLING RELIABILITY ASSESSMENT OF A CERAMIC COLUMN GRID ARRAY PACKAGE FOR SPACE APPLICATIONS NASA JPL Jet Propulsion Laboratory Rajeshumi Ramesham, Ph.D. Assembled daisy chain CN1752 , inspected boards nondestructively, and then subjected them to thermal cycling to assess reliability in thermal environments from +125°C to -40°C 11 1Mb PDF 2016 2 CCGA Column Attachment TopLine Corporation Martin Hart CCGA Column Attachment for Absorbing Large CTE Mismatch 7 1Mb PDF 2015 3 Solder Columns Space Parts Working Group TopLine Corporation Martin Hart Solder Columns for CCGA Substrates 15 1Mb PDF 2014 4 Reliability of CGA/LGA/HDI Package Board/Assembly NASA JPL Jet Propulsion Laboratory Reza Ghaffarian, Ph.D. Test data for CGA1752, CGA1272 and CGA1517 packages. 1.0mm pitch. Plain Columns, Copper Wrap Columns and Micro-coil Spring. Visual, SEM, and thermal cycle evaluations to determine integrity of chip capacitors on package. 44 5Mb PDF 2013 5 Microcoil Spring interconnects for Ceramic Grid Array Integrated Circuits NASA - Marshal Space Flight Center Mark Strickland Jimmy Hester J.F. Blanche T.S. Nash Novel micro-coil spring interconnect for Ceramic Grid Array - CCGA to replace solder balls and traditional solder columns. 24 4Mb PDF 2011 6 Study of Ceramic Column Grid Array Components for Space Systems Northop Grumman Jonathan Fleisher Walter Willing Paper addresses using CCGA in high reliability space systems and issues of thermal mismatch between ceramic substrate and traditional PWB. 6 1Mb PDF 2011 7 Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware NASA Goddard Space Flight Center GSFC-STD-6001 Mounting of CCGA onto PCB to provide uniform engineering and technical requirements for processes, procedures, practices, and methods that have been endorsed as standard for NASA programs 21 1Mb PDF 2011 8 Reliability of High I/O High Density CCGA Interconnect Electronc Packages under Extreme Thermal Environments. NASA JPL Jet Propulsion Laboratory Rajeshumi Ramesham, Ph.D. CCGA1152 and CCGA1272 packages paper provides experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. 15 2Mb PDF 2011 9 Reliability of CCGA Under Extreme Temperature for Space Applcations NASA JPL Jet Propulsion Laboratory Rajeshumi Ramesham, Ph.D. Mounting of 8 Daisy Chain CCGA717 packages on PCB and evaluation under temperature cycling from -185°C to +125°C for space applcations 9 4Mb PDF 2010 10 Thermal Performance of Micro-Springs in Electronic Systems NASA Marshall Space Flight Center Allison Copus Reviewed by Jeff Brown Internship Report using 3D modeling Pro-Engineer & thermal simulation IcePro and IcePak to model comparision of Micro-coil Springs to solder balls in vacuum conditions and to characterize their thermal performance. 7 1Mb PDF 2009 11 Thermal Cycle Reliability Failure Mechanisms CCGA and PBGA With and Without Corner Staking NASA JPL Jet Propulsion Laboratory Reza Ghaffarian, Ph.D. Comparing Plastic Ball grid array (PBGA) to CCGA560 ceramic column grid array, inspection, thermal cycle solder joint, stake. Revision of 2006 paper 12 1Mb PDF 2008 12 Column Grid Array Rework For High Reliability NASA JPL Jet Propulsion Laboratory Atul Mehta & Charles Bodie Questions and challenges: Is the reliability of the PWB adversely affected by rework. How many times can rework the same board without destroying a pad or degrading lifetime? 11 6Mb PDF 2008 13 Solder Column Qualification for Ceramic Column Grid Array (CCGA) Aeroflex Author not cited The test vehicle used in this study was a 472 pin daisy chain CCGA package. Revision of 2006 paper 16 2Mb PDF 2008 14 Atmel CCGA625 Mounting Evaluation SAAB Stanley Mattsson Mounting and evaluation of CCGA625 daisy chain on PCB 31 8Mb PDF 2007 15 CCGA packages for space applications NASA JPL Jet Propulsion Laboratory Reza Ghaffarian, Ph.D. Commercial-off-the-shelf (COTS) CCGA560 and CCGA717 area array packaging technologies reliability study Space Shuttle and Mars Rover missions. 19 3Mb PDF 2006 16 Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity Analysis NASA JPL Jet Propulsion Laboratory Reza Ghaffarian, Amaneh Tasooji, Antonio Rinaldi Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies. 8 1Mb PDF 2005 17 Comparison of X-Ray Inspection Systems of BGA/CCGA Quality Assurance and Crack Detection NASA JPL Jet Propulsion Laboratory Reza Ghaffarian, D. Mih Using X-Ray as an inspection tool for detecting defects and cracks in CCGA 7 2Mb PDF 2005 18 Reliability Testing and Data Analysis of an 1657 CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards) Agilent Technologies Author not cited Comparision of CCGA1657 Pb90/Sn10 using Lead Free Solder Paste and various PC Board Finish 25 .5Mb PDF 2004 19 JEDEC Standard MO-158D JEDEC JEDEC JC-11 Committee Square CCGA Outlines 8 .2Mb PDF 2002 20 JEDEC Standard MO-159B JEDEC JEDEC JC-11 Committee Rectangular CCGA Outlines 6 .3Mb PDF 1999 21 Solder Column CCMD Test Report on Serial Thermal Cycle, Shook, and Vibration Tests Raychem - Improved temperature life cylces using copper wrapped solder columns on ceramic LCC periemter array 28 12Mb PDF 1987 Video Ref Title Company Language Subject Minutes File Year Pub. 1 CCGA Column Attachment TopLine Corporation English Attach Solder Columns using Pin-Pack loading system. 2m 2015 2 CCGA Column Lapping & Planarization TopLine Corporation English How to lap & polish columns and planarize into coplanarity. 3m 2015 3 C7-PRINTER Benchtop manual solder paste printer TopLine Corporation English How to print SnPb or SAC305 solder paste on LGA substrates by hand. 2m 2015 3 Vibration Damping Attenuate Vibration in PWB Boards TopLine Corporation English PID (Particle Impact Damper) NASA technology dampens vibration, extends life and increase reliability. 2m 2016 Quick Reference Ref Title Company Language Subject Minutes File Year Pub. 1 DNP Distance from Neutral Point TopLine Corporation English How to calculate DNP Distance from Neutral Point. 1m PDF 2015 2 Stress-Strain Equation TopLine Corporation English How to calculate stress on ceramic CCGA. 1m PDF 2015 3 IBM Pb90Sn10 Column Types IBM English Pictorial two types of Columns produced by IBM CAST Column versus WIRE Columns 200Kb PDF 1999 Mil-Spec and Industry Standards/Guidelines Ref Title Source Language Subject File Size File Type Year Pub. 1 CCGA Solder Column Allowable Voids and other standards USA MIL-STD-883J w/Change 5 Section 3.3.6 English Conformance criteria for Ball/Column Grid Array Leads voids and other attributes of solder columns. 200Kb PDF 2015 2 CCGA Solder Column Package Destructive Lead Pull Test USA MIL-STD-883K w/Change 2 TM2038 English Method for measuring capability of solder column on CCGA package to withstand an axial force. 200Kb PDF 2013 3 Assessing and Strengthening the Manufacturing and Defense Insustrial Base and Supply Chain Resiliency USA Department of Defense IBAS English This report outlines current risks in the manufacturing and defense industrial base and provides a set of comprehensive actions to mitigate identified risks. Provides detailed analyses and in-depth understanding of the increasingly global, commercial, and financially complex industrial supply chain essential to our national defense. 6Mb PDF 2018 Industry & Market Ref Title Source Language Subject File Size File Type Year Pub. 1 Robust FPGA Supply Chain Assures Defense Industry Preparedness Military Embedded Magazine June 2021 English In the world of defense-grade FPGA devices, solder column attachment is the weakest link in the assembly process. Today, 90% of America’s FPGA device makers rely on a single subcontractor to attach solder columns, creating a potential supply chain vulnerability. The problem can be solved by engaging multiple subcontractors already established throughout North America. Device makers just need to qualify these alternative subcontractors in order to assure sustainability and resiliency of the defense-grade FPGA supply. 1Mb PDF HTML 2021 2 Does FPGA Industry Face Peril? MEPTEC REPORT English The entire supply chain relies on an uninterrupted supply of solder columns, the last step in the manufacture of aerospace and defense grade LGA packaged FPGA components. 1Mb HTML 2021 3 FPGA Issues and Concerns: A Real Danger and a Call to Action Printed Circuit Design & Fab Circuits Assembly Magazine August 2020 English The reality of a brittle supply chain could mean harsh consequences for failure to delivery of defense-grade FPGA supply. 1Mb PDF HTML 2021 4 Solder Columns for Quantum Computers and Cryogenic Applications US Tech Magazine July 2024 English Some applications, including quantum computers, perform better at cryogenic temperatures, below the superconductivity point. This is because electrical resistance drops to zero when certain materials become superconductive, allowing current to flow without energy loss. 1Mb PDF HTML 2024 TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv Home