PST Silicon Thermal Test Die with heater. PST HEATER DIE , GM Components Holding , GMCH, Delco, Delphi Kokomo Semiconductor PST series of Thermal Test Die is used to determine thermal characteristics of a package, such as thermal resistance Junction to Case (T jc) or Junction to Ambient (T ja). These Thermal Test Die incorporate a heating element and typically, two independent methods for on-die temperature monitoring. Resistive heating in the PST1 is accomplished by driving a current through a doped silicon well between a pair of bus bars, labeled Rs and Rf. The 4 R labeled pads accommodate Kelvin connections, if desired. At the top and bottom of the die are a pair of pads, labeled D in the diagram, which connect a serial five-diode temperature sense network. A four-pad layout allows Kelvin connections, if desired. A second temperature monitoring circuit uses a bridge network by connecting the "V" at the top of the die and the "G" at the bottom of the die with one sense pin "S" at the top of the die and the other sense pin "S" at the bottom of the die. WIRE BONDABLE WAFER, Wafer Shippers, THERMAL TEST BOARD , PST1, PST1-02 , PST01 , PST2, PST2-03 , PST02, PST3 , P3T5-U7.8 , PST3-02 , PST03, PST4, PST4-02 , PST04, PST5, PST5-03 , PST05 , PST6, PST6-02 , PST06 , PSTW1, PSTW1-02 , PSTW01 , PSTW2, PSTW2-03 , PSTW02, PSTW3, PSTW3-02 , PSTW03, PSTW4, PSTW4-02 , PSTW04, PSTW5, PSTW5-03 , PSTW05 , PSTW6, PSTW6-02 , PSTW06, PST1-G2.5A , PST1-B2.5A , PST2-G3.8A , PST2-N3.8A , PST2-C3.8A , PST3-B5A , PST4-G6.3A , PST5-U7.8A , PST6-D10A , PST1-G2.5A-P , PST1-B2.5A-P , PST2-G3.8A-P , PST2-N3.8A-P , PST2-C3.8A-P , PST3-B5A-P , PST4-G6.3A-P , PST5-U7.8A-P , PST6-D10A-P , PST1-G2.5A-W , PST1-B2.5A-W , PST2-G3.8A-W , PST2-N3.8A-W , PST2-C3.8A-W , PST3-B5A-W , PST4-G6.3A-W , PST5-U7.8A-W , PST6-D10A-W , PST1-G2.5A-BG200-W , PST1-B2.5A-BG200-W , PST2-G3.8A-BG200-W , PST2-N3.8A-BG200-W , PST2-C3.8A-BG200-W , PST3-B5A-BG200-W , PST4-G6.3A-BG200-W , PST5-U7.8A-BG200-W , PST6-D10A-BG200-W , PST1-G2.5A-BG250-W , PST1-B2.5A-BG250-W , PST2-G3.8A-BG250-W , PST2-N3.8A-BG250-W , PST2-C3.8A-BG250-W , PST3-B5A-BG250-W , PST4-G6.3A-BG250-W , PST5-U7.8A-BG250-W , PST6-D10A-BG250-W , PSTW1-G2.5A , PSTW1-B2.5A , PSTW2-G3.8A , PSTW2-N3.8A , PSTW2-C3.8A , PSTW3-B5A , PSTW4-G6.3A , PSTW5-U7.8A , PSTW6-D10A , 115200 , 125101 , 125150 , 125200 , 125202 , 125210 , 125230 , 135220 , 143555 , 145201 , 148877 , 150140 , 150879 , 155221 , 160505 , 163250 , 163456 , 164455 , 165223 , 168877 , 169022 , 170158 , 170778 , 178242 , 180005 , 180101 , 181444 , 182219 , 182555 , 182784 , 183390 , 183861 , 184630 , 184866 , 186094 , 189912 , 800456 ,

		PST Thermal Die Wire Bondable



Daisy Chain Test Die Flip Chips Bumped Die Cu Pillar Die Dummy Wafers

Thermal Test Die
Wire Bondable Pads

GM Application Sheet • 3X Die Stack • Other Reference JEDEC JESD51-4

PST Series - Thermal Test Die with Resistive Heaters

Nbr
Pads

Features

Pitch

Die Size
(mm)

Die
Thickness

Waffle Tray
Qty

5" Wafer
(125mm)
Die Qty

Bondable
Pad

Single Die
Part Number

Unsawn Wafer
Part Number

Photo

Schematic

Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor

X=230µm
Y=230µm

2.5mm
100 mil

100~635µm
4~25 mil

100 Die
2" Tray

1600 Die
5" Wafer

ø102µm
4.0 mil

PST1-G2.5A

PSTW1-G2.5A

□122µm
4.8 mil

PST1-B2.5A

PSTW1-B2.5A

Heating Elements
2x Resistive Heaters

Temperature Sense
5x Serial Diode Sensor

X=460µm
Y=690µm

3.81mm
150 mil

100~635µm
4~25 mil

64 Die
2" Tray

700 Die
5" Wafer

ø100µm
4.0 mil

PST2-G3.8A

PSTW2-G3.8A

Ø127µm
5.5 mil

PST2-N3.8A

PSTW2-N3.8A

□150µm
5.9 mil

PST2-C3.8A

PSTW2-C3.8A

Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor

X=231µm
Y=231µm

5.08mm
200 mil

100~635µm
4~25 mil

36 Die
2" Tray

340 Die
5" Wafer

□120µm
4.7 mil

PST3-B5A

PSTW3-B5A

Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner

X=381µm
Y=508µm

6.35mm
250 mil

100~635µm
4~25 mil

25 Die
2" Tray

236 Die
5" Wafer

Ø100µm
4.0 mil

PST4-G6.3A

PSTW4-G6.3A

Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner

X=381µm
Y=508µm

7.8mm
306 mil

100~635µm
4~25 mil

64 Die
4" Tray

146 Die
5" Wafer

Ø182µm
7.2 mil

PST5-U7.8A

PSTW5-U7.8A

Heating Elements
2x Resistive Heaters

Temperature Sense
Kelvin-Diode-Resistor
5x Serial Diode Sensor
Center & each corner

X=381µm
Y=508µm

10mm
400 mil

100~635µm
4~25 mil

49 Die
4" Tray

80 Die
5" Wafer

□183µm
7.2 mil

PST6-D10A

PSTW6-D10A

Note 1: Standard Die thickness 635um (25MIL)

Note 2: Thinning available: 500um (20MIL), 430um (17MIL), 360um (14MIL), 250um (10MIL), 200um (8MIL), 150um (6MIL), 100um (4MIL)

Note 3: JEDEC Moisture Sensitivity Level MSL-1.

Note 4: Applications: Use PST series test die to heat semicoductor packages and measure changes in temperatures, Θ_JC and Θ_JA. A four pad layout (V-S-S-G) allows Kelvin connections. A temperature monitoring circuit uses a bridge network. Chips include serial five-diode temperature sense network. Power up to 2.5W per die.

Note 5: Stack Die: Multiple die can be thinned to 127um (5mils) and stacked in offset pryamid fashion for easy wire bonding. Use 0.038mm (1.5mil) thick non-conductive die attach material between PST-2 to PST-4 and PST-4 to PST-6. Use electrically conductive die attach material between PST-6 and the substrate.

Note 6: Resistive Heaters: All die have dual resistive heaters connection Rs to Rf. Typically powered 0 to 3.5V at 160mA (0.5W).
Multiple die can be run in parallel to increase heat source. Customers may determine maximum power rating by experimentation. 500mA current limiting power source is recommended for safety. Maximum power rating is not stated.

Note 7: Voltage Sense: 5.0~15V input (with a controlled current supply) may be applied across the bridge diodes and resistors at pads V to G and/or across D to D. Voltage sensing (output) is measured from pads V to S and pads S to G. Daisy chain pads are optionally used only for monintoring continuity with an ohm meter (near zero ohms).

Note 8: Temperature Sense Network: All PST series die have serial five-diodes to sense temperature.

Note 9: Temperature Change: Temperature can be monitored by measuring the forward voltage across the diodes. Forward voltage will drop approximately 2mV for each degree °C rise above ambient temperature (25°C). Probe between pad "V" and pad "S" on the die. See map of pads to located V and S on the dies.

Note 10: Meets JEDEC specification EIA/JESD51-4.

Wafer Box Cassette

(Closed) Wafer Shipper (Open)

Rotatable Model

Test Die Part Numbering System
PST	1	-	G	2.5	A	-	BG250	W
Thermal Die	PST Series		Pad Size	Die Size (mm)	Pad		Backgrind Option	Packaging Options
PST = Single Die PSTW = Wafer 5"	1 ~ 6		B = □120µm - 4.7 mil C = □150µm - 6.0 mil D = □183µm - 7.2 mil G = Ø100µm - 4.0 mil N = Ø127µm - 5.0 mil U = Ø182µm - 7.1 mil	2.5 - 100 mil (PST1) 3.8 - 150 mil (PST2) 5 = - 200 mil (PST3) 6.3 - 250 mil (PST4) 7.8 - 307 mil (PST5) 10 - 400 mil (PST6) Other sizes available	Wire-Bond A = Al98%/Si1%/Cu1% Ball E = Sn63/PB37 C = SAC305		Thickness Example: BG200 = 200µm = 8mil BG250 = 250µm = 10mil Blank = 635µm = 25mil	Single Die: W = 2" Waffle Pack P = 4" Waffle Pack Unsawn Wafer: C = Cassette J = Jar/Clam Shell

Al98%/Si1%/Cu1% Pads

Drawing Numbering System
1	2	5	2	0	0
PST Bonding/Ball	PST Series / Die Size	Packaging	Thickness	Bond Pad Size	Variation
1 = PST Series Wire Bond Pads 2 = PST Series With Solder Balls Or Bumps	1 = PST1 (2.5mm - 100 mil) 2 = PST2 (3.81mm - 150 mil) 3 = PST3 (5.08mm - 200 mil) 4 = PST4 (6.35mm - 250 mil) 5 = PST5 (7.8mm - 307 mil) 6 = PST6 (10mm - 400 mil)	Single Die: 0 = 4" Waffle Tray (P) 5 = 2" Waffle Tray (W) Unsawn Wafer Format: 7 = Clam Shell, Cassette, etc	0 = 635um (25mil) 1 = 250um (10mil) 2 = 200um (8mil) 3~9 = Other	PST1 0 = Ø102µm 2 = SQ122µm PST2 0 = Ø100µm 1 = Ø127µm 3 = SQ150µm PST3 2 = SQ120µm PST4 0 = Ø100µm PST5 4 = Ø182µm PST6 5 = SQ183µm	0 = Standard 1~9 = Other


Bonding Wire • Test Die

Home