eWLP Embedded Die Daisy Chain For PCB core   eWLP Marking  •  Tray Pin 1  •  Care & Handling  •  Daisy Chain  •  eWLP Part Nbr System  •  More Products  •  WLP with Ball  •  Embedded Jumper Resistor Round Pads Example Marking eWLP Square Pads     0.2mm pitch eWLP - Wafer Level Package Pads I/O Pad Matrix Pitch Size SQ Tape & Reel Tray Qty 2" Waffle Pack Die Thickness Outline Drawing Cu Post 360° SolidWorks 64 8x8 0.2mm 2.0mm W=8mm P=4mm 100 200um 360um eWLP64W.2-DC088D2 eWLP64W.2-DC088D3 256 16x16 0.2mm 4.0mm W=12mm P=8mm 49 200um 360um eWLP256W.2-DC168D2 eWLP256W.2-DC168D3 576 24x24 0.2mm 6.0mm W=16mm P=12mm 25 200um 360um eWLP576W.2-DC248D2 eWLP576W.2-DC248D3 1024 32x32 0.2mm 8.0mm W=16mm P=12mm 64 4" Tray 200um 360um eWLP1024T.2-DC328D2 eWLP1024T.2-DC328D3 1600 40x40 0.2mm 10mm W=24mm P=16mm 49 4" Tray 200um 360um eWLP1600T.2-DC407D2 eWLP1600T.2-DC407D3 2304 48x48 0.2mm 12mm W=24mm P=16mm 36 4" Tray 200um 360um eWLP2304T.2-DC487D2 eWLP2304T.2-DC487D3 3136 56x56 0.2mm 14mm W=24mm P=24mm 25 4" Tray 200um 360um eWLP3136T.2-DC567D2 eWLP3136T.2-DC567D3 Round Pad 4096 64x64 0.2mm 16mm Call 16 4" Tray 280um 360um eWLP4096T.2-DC647U2 eWLP4096T.2-DC647U3 Pitch = 0.2mm   •   Cu Pad diameter 0.10mm   •   Die Thickness: 200µm and 360µm Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray   0.3mm pitch eWLP - Wafer Level Package Pads I/O Pad Matrix Pitch Size SQ Tape & Reel Tray Qty 2" Waffle Pack Die Thickness Outline Drawing Cu Post 360° SolidWorks 4 2x2 0.3mm 0.56mm W=8mm P=2mm 400 200um 360um eWLP4T.3-DC022D2 eWLP4T.3-DC022D3 16 4x4 0.3mm 1.16mm W=8mm P=4mm 400 200um 360um eWLP16T.3-DC048D2 eWLP16T.3-DC048D3 36 6x6 0.3mm 1.76mm W=8mm P=4mm 225 200um 360um eWLP36T.3-DC067D2 eWLP36T.3-DC067D3 64 8x8 0.3mm 2.36mm W=12mm P=8mm 100 200um 360um eWLP64T.3-DC088D2 eWLP64T.3-DC088D3 100 10x10 0.3mm 2.96mm W=12mm P=8mm 100 200um 360um eWLP100T.3-DC108D2 eWLP100T.3-DC108D3 144 12x12 0.3mm 3.56mm W=12mm P=8mm 100 200um 360um eWLP144T.3-DC127D2 eWLP144T.3-DC127D3 196 14x14 0.3mm 4.16mm W=12mm P=8mm 49 200um 360um 200um 200um eWLP196T.3-DC148D2 eWLP196T.3-DC148D3 eWLP196T.3-DC148D2Q eWLP196T.3-DC148U2Q Round Pad Square pad 2500 50x50 0.3mm 15mm W=24mm P=24mm 25 200um 200um eWLP2500T.3-DC508D2Q eWLP2500T.3-DC508U2Q Pitch = 0.3mm   •   Cu Pad diameter 0.15mm   •   Die Thickness: 200µm and 360µm Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray   0.4mm pitch eWLP Wafer Level Package Balls I/O Ball Matrix Pitch Size SQ Tape & Reel Tray Qty 2" Waffle Pack Die Thickness Outline Drawing Cu Post 4 2x2 0.4mm 0.76mm W=8mm P=4mm 625 200um 360um eWLP4T.4-DC022D2 eWLP4T.4-DC022D3 16 4x4 0.4mm 1.56mm W=8mm P=4mm 100 200um 360um eWLP16T.4-DC048D2 eWLP16T.4-DC048D3 36 6x6 0.4mm 2.36mm W=12mm P=8mm 100 200um 360um eWLP36T.4-DC067D2 eWLP36T.4-DC067D3 64 8x8 0.4mm 3.16mm W=12mm P=8mm 100 200um 360um eWLP64T.4-DC088D2 eWLP64T.4-DC088D3 100 10x10 0.4mm 3.96mm W=12mm P=8mm 49 200um 360um eWLP100T.4-DC108D2 eWLP100T.4-DC108D3 144 12x12 0.4mm 4.76mm W=12mm P=8mm 64 200um 360um eWLP144T.4-DC127D2 eWLP144T.4-DC127D3 196 14x14 0.4mm 5.56mm W=12mm P=8mm 36 200um 360um 200um 200um eWLP196T.4-DC148D2 eWLP196T.4-DC148D3 eWLP196W.4-DC148D2Q eWLP196W.4-DC148U2Q 256 16x16 0.4mm 6.36mm W=16mm P=12mm 25 200um 200um 200um eWLP256T.4-DC168D2 eWLP256T.4-DC148D2Q eWLP256T.4-DC148U2Q Round Pad Square pad Pitch = 0.4mm   •   Cu Pad diameter 0.20mm   •   Die Thickness: 200µm and 360µm Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray   0.5mm pitch eWLP Wafer Level Package Balls I/O Ball Matrix Pitch Size SQ Tape & Reel Tray Qty 4" Waffle Pack Die Thickness Outline Drawing Cu Post 100 10x10 0.5mm 5.0mm W=12mm P=8mm 144 200um 400um eWLP100T.5-DC108D2 eWLP100T.5-DC108U4 Round Pad 144 12x12 0.5mm 6.0mm W=12mm P=8mm 121 200um 400um eWLP144T.5-DC127D2 eWLP144T.5-DC127U4 Round Pad 196 14x14 0.5mm 7.0mm W=16mm P=12mm 81 200um 400um eWLP196T.5-DC148D2 eWLP196T.5-DC148U4 Round Pad 256 16x16 0.5mm 8.0mm W=16mm P=12mm 64 200um 360um 400um eWLP256T.5-DC168D2 eWLP256T.5-DC168D3 eWLP256T.5-DC168U4 Pitch = 0.5mm   •   Cu Pad diameter 0.25mm   •   Die Thickness: 200µm and 400µm Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray   Download Solidworks® e-Drawings software to view rotatable:   Download   eWLP Pad Size - Embedded Die in PCB     Spec Pitch 0.2mm Pitch 0.3mm Pitch 0.35mm Pitch 0.4mm Pitch 0.5mm         Ø Cu Pad 0.10mm 0.15mm 0.20mm 0.20mm 0.25mm         Flatness Tolerance +/-20µm +/-20µm +/-20µm +/-20µm +/-20µm         Backgrind With Extra Fine-Polish #2000 Grit #2000 Grit #2000 Grit #2000 Grit #2000 Grit       All eWLP devices are rated JEDEC Moisture Sensitivity Level MSL-1 Width of Daisy Chain tracing between Cu pads is 20µm Material of RDL is Low-K Cu 99% pure Passivation: Polyimide 4um thick Encapsulation: Epoxy resin structure 50um thick     eWLP Cross Section Copper Pillar Design.     eWLP Drawing Numbering System     6         4         127         0     Series Pitch Daisy Chain Pattern Packaging For Embedded Die Applications With Encapsulation: 6 = eWLP Without Balls Die 200um thick Round Cu Pad 7 = eWLP Without Balls Die 360~400um thick Round Cu Pad 1 = eWLP Without Balls Die 200um thick Square Cu Pad 2 = 0.2mm (M) 3 = 0.3mm (A) 7 = 0.35mm (Y) 4 = 0.4mm (F) 5 = 0.5mm (P) (Laser Marking Code) Row-Column Matrix 999 Unsawn Wafer Waffle Pack Tray: 0 = 4-inch Tray (T) Pad Down 7 = 2-inch Tray (W) Pad Up (Special) 8 = 2-inch Tray (W) Pad Down 9 = 4-inch Tray (T) Pad Up (Special) Carrier Tape: 1 = T&R Reel (E7A) Pad Down 2 = Cut Tape - (E) Pad Down Wafer Format: 3 = Sawn Wafer UV Tape & Ring (Full) 4 = Sawn Wafer UV Tape & Ring (Partial) 5 = Unsawn Wafer Unassigned: 6 = To Be Assigned       eWLP Part Numbering System     eWLP         144         T         .4         -         DC127         D2     Series Nbr Pads Package Code Pitch Pad Alloy Daisy Chain Pattern Die Thickness and Pad Up/Down in Package eWLP = Without Balls Embedded Application Under Development eSWLP = Cu Metal Shielded Version Without Balls Embedded Application 4 ~ 2500 Greater I/O Available T = 4-inch Waffle Tray W = 2-inch Waffle Tray E = Tape Reel (T&R) X = Unsawn Wafer U = Sawn Wafer UV Tape & Ring 2 = 0.2mm (M) .3 = 0.3mm (A) .35 = 0.35mm (Y) .4 = 0.4mm (F) .5 = 0.5mm (P) (Laser Marking Code) Blank= Cu Pad Without Solder Balls Matrix Pattern Pad Down: D2= 200µm Thick Cu Pad D2Q= 200µm Thick Cu Pad Square Pin 1 Pad D3= 360µm Thick Cu Pad D4= 400µm Thick Cu Pad Pad Up: U2= 200µm Thick Cu Pad U2Q= 200µm Thick Cu Pad Square Pin 1 Pad U3= 360µm Thick Cu Pad Not Recommended: 251µm ~ 359µm Thick   eWLP Round Pads   Top Marking Example   eWLP Square Pads     eWLP Encapsulation Material Properties TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv ©2022 TopLine. All Rights Reserved. Home