WLP / WL-CSP
Wafer Level Package
 
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WLP Wafer Level Package
Copper Pillar Design
 
0.3mm pitch WLP - Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size □ Tape
& Reel
Tray Qty
4" Waffle Pack
Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.3mm 0.6mm
Call 484
2"-Tray
WLP4T.3C-DC022D   360 ° Model   360 ° Daisy Chain
16 4x4 0.3mm 1.2mm
W=8mm
P=4mm
400
2"-Tray
WLP16T.3C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.3mm 1.8mm
W=8mm
P=4mm
100
2"-Tray
WLP36T.3C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.3mm 2.4mm
W=12mm
P=8mm
100
2"-Tray
WLP64T.3C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.3mm 3.0mm
W=12mm
P=8mm
256 WLP100T.3C-DC108D   360 ° Model   360 ° Daisy Chain
144 12x12 0.3mm 3.6mm
W=12mm
P=8mm
196 WLP144T.3C-DC127D   360 ° Model   360 ° Daisy Chain
196 14x14 0.3mm 4.2mm
W=12mm
P=8mm
49p 2"-Tray
196p 4"-Tray
WLP196T.3C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.3mm 4.8mm
W=12mm
P=8mm
144 WLP256T.3C-DC168D   360 ° Model   360 ° Daisy Chain
264 17x17
6-row
0.3mm 6mm
W=16mm
P=12mm
121 WLP264T.3C-DC173D   360 ° Model   360 ° Daisy Chain
400 20x20 0.3mm 6mm
W=16mm
P=12mm
121 WLP400T.3C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.3mm 7.8mm
W=16mm
P=12mm
72 WLP676T.3C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.3mm 9.0mm
- 49 WLP900T.3C-DC307D   360 ° Model   360 ° Daisy Chain
1600 40x40 0.3mm 12.0mm
- 36 WLP1600T.3C-DC407D   360 ° Model   360 ° Daisy Chain
2500 50x50 0.3mm 15.0mm
- 25 WLP2500T.3C-DC507D   360 ° Model   360 ° Daisy Chain
6400 80x80 0.3mm 24.0mm
- 9 WLP6400T.3C-DC807D   360 ° Model   360 ° Daisy Chain
Pitch = 0.3mm    Ball diameter 0.20mm    Cu Pad diameter 0.15mm
Other ball count available.   More sizes available
Seated Height (including balls) 0.57mm (+/- 0.03mm)
Download Solidworks® e-Drawings software to view rotatable:    Download
 
 
 
0.35mm pitch WLP - Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size □ Tape
& Reel
Tray Qty
4" Waffle Pack
Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.35mm 0.7mm
Call 400
2"-Tray
WLP4T.35C-DC022D   360 ° Model   360 ° Daisy Chain
16 4x4 0.35mm 1.4mm
W=8mm
P=4mm
100
2"-Tray
WLP16T.35C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.35mm 2.1mm
W=8mm
P=4mm
100
2"-Tray
WLP36T.35C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.35mm 2.8mm
W=12mm
P=8mm
100
2"-Tray
WLP64T.35C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.35mm 3.5mm
W=12mm
P=8mm
256 WLP100T.35C-DC108D   360 ° Model   360 ° Daisy Chain
144 12x12 0.35mm 4.2mm
W=12mm
P=8mm
196 WLP144T.35C-DC127D   360 ° Model   360 ° Daisy Chain
196 14x14 0.35mm 4.9mm
W=12mm
P=8mm
144 WLP196T.35C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.35mm 5.6mm
W=16mm
P=8mm
121 WLP256T.35C-DC168D   360 ° Model   360 ° Daisy Chain
400 20x20 0.35mm 7.0mm
W=16mm
P=12mm
81 WLP400T.35C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.35mm 9.1mm
W=24mm
P=12mm
49 WLP676T.35C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.35mm 10.5mm
- 36 WLP900T.35C-DC307D   360 ° Model   360 ° Daisy Chain
1600 40x40 0.35mm 14.0mm
- 25 WLP1600T.35C-DC407D   360 ° Model   360 ° Daisy Chain
2500 50x50 0.35mm 17.5mm
- 16 WLP2500T.35C-DC507D   360 ° Model   360 ° Daisy Chain
Pitch = 0.35mm    Ball diameter 0.225mm    Cu Pad diameter 0.21mm
Other ball count available.   More sizes available
Seated Height (including balls) 0.54mm (+/- 0.03mm)
Download Solidworks® e-Drawings software to view rotatable:    Download
 
 
 
0.4mm pitch WLP Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size
Tape
& Reel
Tray Qty
4" Waffle Pack
Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.4mm 0.8mm
W=8mm
P=4mm
100
2"-Tray
WLP4T.4C-DC022D   360 ° Model   360 ° Daisy Chain
16 4x4 0.4mm 1.6mm
W=8mm
P=4mm
100p 2"-Tray
289p 4"-Tray
WLP16T.4C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.4mm 2.4mm
W=12mm
P=8mm
100p 2"-Tray
529p 4"-Tray
WLP36T.4C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.4mm 3.2mm
W=12mm
P=8mm
256 WLP64T.4C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.4mm 4mm
W=12mm
P=8mm
196 WLP100T.4C-DC108D   360 ° Model   360 ° Daisy Chain
144 12x12 0.4mm 4.8mm
W=12mm
P=8mm
144 WLP144T.4C-DC127D   360 ° Model   360 ° Daisy Chain
144 13x13
4-Row
0.4mm 6mm
W=16mm
P=12mm
121 WLP144T.4C-DC133D   360 ° Model   360 ° Daisy Chain
196 14x14 0.4mm 5.6mm
W=12mm
P=8mm
121 WLP196T.4C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.4mm 6.4mm
W=16mm
P=12mm
121 WLP256T.4C-DC168D   360 ° Model   360 ° Daisy Chain
400 20x20 0.4mm 8mm
W=16mm
P=12mm
72 WLP400T.4C-DC208D   360 ° Model   360 ° Daisy Chain
676 26x26 0.4mm 10.4mm
- 49 WLP676T.4C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.4mm 12mm
- 36 WLP900T.4C-DC307D   360 ° Model   360 ° Daisy Chain
1600 40x40 0.4mm 16mm
- 16 WLP1600T.4C-DC407D   360 ° Model   360 ° Daisy Chain
1936 44x44 0.4mm 17.6mm
- 16 WLP1936T.4C-DC447D   360 ° Model   360 ° Daisy Chain
2116 46x46 0.4mm 18.4mm
- 16 WLP2116T.4C-DC467D   360 ° Model   360 ° Daisy Chain
2500 50x50 0.4mm 20mm
- 9 WLP2500T.4C-DC507D   360 ° Model   360 ° Daisy Chain
Pitch = 0.4mm    Ball diameter 0.25mm    Cu Pad diameter 0.20mm
More Sizes available
Seated Height (including balls) 0.61mm (+/- 0.03mm)
 
Download Solidworks® e-Drawings software to view rotatable:    Download
 
 
 
0.5mm pitch WLP - Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size □ Tape
& Reel
Tray Qty
4" Waffle Pack
Outline Drawing
SnAgCu SAC305
Lead Free - RoHS
360° Rotatable
Solidworks
Model
360° Rotatable
Daisy Chain
Model
4 2x2 0.5mm 1.0mm
W=8mm
P=4mm
100
2"-Tray
WLP4T.5C-DC022D   360 ° Model   360 ° Daisy Chain
6 2x3 0.5mm 1.0x1.5mm
W=8mm
P=2mm
call WLP6T.5C-DC023D - -
8 2x4 0.5mm 1.0x2.0mm
W=8mm
P=4mm
204
2"-Tray
WLP8T.5C-DC024D   360 ° Model   360 ° Daisy Chain
16 4x4 0.5mm 2.0mm
W=8mm
P=4mm
529 WLP16T.5C-DC048D   360 ° Model   360 ° Daisy Chain
36 6x6 0.5mm 3.0mm
W=12mm
P=8mm
256 WLP36T.5C-DC067D   360 ° Model   360 ° Daisy Chain
64 8x8 0.5mm 4.0mm
W=12mm
P=8mm
196 WLP64T.5C-DC088D   360 ° Model   360 ° Daisy Chain
100 10x10 0.5mm 5.0mm
W=12mm
P=8mm
144 WLP100T.5C-DC108D   360 ° Model   360 ° Daisy Chain
112 11x11
4-Row
0.5mm 6.0mm
W=16mm
P=12mm
121 WLP112T.5C-DC113D   360 ° Model   360 ° Daisy Chain
144 12x12 0.5mm 6.0mm
W=16mm
P=12mm
121 WLP144T.5C-DC127D   360 ° Model   360 ° Daisy Chain
196 14x14 0.5mm 7.0mm
W=16mm
P=12mm
81 WLP196T.5C-DC148D   360 ° Model   360 ° Daisy Chain
256 16x16 0.5mm 8.0mm
W=16mm
P=12mm
72 WLP256T.5C-DC168D   360 ° Model   360 ° Daisy Chain
400 20x20 0.5mm 10mm
- 49 WLP400T.5C-DC208D   360 ° Model   360 ° Daisy Chain
484 22x22 0.5mm 11mm
- 36 WLP484T.5C-DC228D   360 ° Model   360 ° Daisy Chain
676 26x26 0.5mm 13mm
- 25 WLP676T.5C-DC260D   360 ° Model   360 ° Daisy Chain
900 30x30 0.5mm 15mm
- 25 WLP900T.5C-DC307D   360 ° Model   360 ° Daisy Chain
1600 40x40 0.5mm 20mm
- 9 WLP1600T.5C-DC407D   360 ° Model   360 ° Daisy Chain
2500 50x50 0.5mm 25mm
- 9 WLP2500T.5C-DC507D   360 ° Model   360 ° Daisy Chain
Pitch = 0.5mm    Ball diameter 0.30mm    Cu Pad Diameter 0.25mm
More Sizes available
Seated Height (including balls) 0.64mm (+/- 0.03mm)
 
Ball Alloy:
Standard Ball type C = SAC305 (Sn96.5/Ag3.0/Cu0.5)    Example: WLP400T.3C-DC208
 
Download Solidworks® e-Drawings software to view rotatable:    Download
 
 
 
WLP - Ball Information - Before Reflow
      Spec Pitch 0.3mm Pitch 0.35mm Pitch 0.4mm Pitch 0.5mm    
      Ø Cu Pad 0.15mm 0.21mm 0.20mm 0.25mm
   
      Ø Solder Ball 0.20mm 0.225mm 0.25mm 0.30mm
   
 
WLP - Ball Information - After Reflow
      Spec Pitch 0.3mm Pitch 0.35mm Pitch 0.4mm Pitch 0.5mm    
      Ball Width 0.20mm 0.22mm 0.26mm 0.31mm
   
      Ball Height 0.17mm 0.18mm 0.21mm 0.24mm
   
 
eWLP Pad Size - Embedded Die in PCB
      Spec Pitch 0.3mm Pitch 0.35mm Pitch 0.4mm Pitch 0.5mm    
      Ø Cu Pad 0.15mm 0.21mm 0.20mm 0.25mm
   
      Flatness
Tolerance
+/-20µm +/-20µm +/-20µm +/-20µm    
      Backgrind
With Extra
Fine-Polish
#2000
Grit
#2000
Grit
#2000
Grit
#2000
Grit
   
 
All WLP devices are rated JEDEC Moisture Sensitivity Level MSL-1
Width of Daisy Chain tracing between ball pads is 20µm
Material of RDL is Low-K Cu 99% pure
Passivation: Polyimide 4um thick
Encapsulation: Epoxy resin structure 50um thick
 
 
WLP Cross Section
Copper Pillar Design.
 
 
WLP Encapsulation Material Properties
 
 
WLP Drawing Numbering System
    5         4         127         0    
Series Pitch Daisy Chain
Ball Matrix
Packaging
5 = WLP With Ball Balls (400um Thick) Standard

2 = WLP Cu Pillar + SnAg Cap
Without Epoxy around Cu Pillar
(Si=200um T)

3 = WLP Cu Pillar + SnAg Cap
Without Epoxy around Cu Pillar
(Si=360um T)

6 = eWLP Without Balls (200um Thick)
50um Cu Post Embedded Application

Special:
7 = eWLP Without Balls (360um Thick)
50 Cu Post Embedded Application

8 = eWLP Without Balls (200um Thick)
10 Cu Post Embedded Application
2 = 0.2mm (M)
3 = 0.3mm (A)
7 = 0.35mm (Y)
4 = 0.4mm (F)
5 = 0.5mm (P)

(Laser Marking Code)
Row/Column Matrix
First 2-digits

Daisy Chain Pattern
3rd digit

999 Unsawn Wafer
Tray:
0 = 4-inch Waffle Pack (T)
8 = 2-inch Waffle Pack (W)


Carrier Tape:
1 = T&R Reel (E7A) Ball Down
2 = Cut Tape - (E)

Wafer Format:
3 = Sawn Wafer UV Tape & Ring (Full)
4 = Sawn Wafer UV Tape & Ring (Partial)
5 = Unsawn Wafer, Clam Shell, Without Ring

 
 
 
WLP Part Numbering System
    WLP         196         T         .4         C         -  DC148         D    
Series Nbr Balls Package Code Pitch Ball Alloy Daisy Chain
Pattern
Die
Si
WLP = With Ball Balls

eWLP = Without Balls
Embedded Application
4 ~ 2500 T = 4-inch Waffle Tray
W = 2-inch Waffle Tray

E = Tape cut without leader
E7A = T&R 7-inch Reel
E13A = T&R 13-inch Reel

X = Unsawn Wafer
Clam Shell-Box

U = Sawn Wafer
UV Tape - Wafer Ring
2 = 0.2mm (M)
3 = 0.3mm (A)
7 = 0.35mm (Y)
4 = 0.4mm (F)
5 = 0.5mm (P)

(Laser marking code)
C=SAC305
Sn96.5/Ag3.0/Cu0.5
Pitch 0.3~0.5mm

P= Cu Pillar with
SnAg Cap Option
Pitch 0.2mm



Blank= Cu Pillar
Without Solder
eWLP
Row/Column Matrix
With Daisy Chain
Pattern
Thickness (WLP Pad Down):
D = 400µm

Backgrind eWLP (Pad Down):
D2= 200µm Thick
50um Cu Post

D3= 360µm Thick
50um Cu Post

Backgrind eWLP (Pad Up):
U1 = 120µm Pad up
(Cu Pillar + SAC CAP Without Epoxy)

U2= 200µm Thick
50um Cu Post

Not Recommended:
251µm ~ 359µm
 
 
 
 
 
        
0.3mm Outline Dwg  •   0.4mm Outline Dwg  •   0.5mm Outline Dwg  •   Complete WLP Library
WLP Marking  •  Tray  •   Daisy Chain  •   WLP Part Nbr System  •   More BGA  •   eWLP Embedded Die  •   More Products  
 
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000
Email: sales@topline.tv



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