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Wire Bondable Die With Daisy Chain |
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| Useful Links: Flip Chip Catalog Flip Chips Part Number System More Wire bondable Test Die Quartz Die For Underfill Experiments | |||||||||
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| Unbumped Die (Al Pads) with Daisy Chain and Passivation Openings for Wire Bonding | |||||||||
| Pads | Pad Matrix | Pitch | Die Size (mm) |
Passivation Opening Diameter |
Tray Qty | Metal Backing For Eutectic Soldering |
Mount with Die Attach Adhesives Order Number |
Ref | Quick View |
| 48 | 12x12 Perimeter |
18mil 457µm |
6.3mm | 100~150µm | 25pcs Waffle 2" |
FCN48D6.3A457M-DC | FCN48D6.3A457-DC | FBT250 |
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| 88 | 22x22 Perimeter |
8 mil 204µm |
5.08mm | 80~100µm | 36 Waffle 2" |
FCN88G5.08A204M-DC | FCN88G5.08A204-DC | PB08 |
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| 112 | 28x28 Perimeter |
6 mil 152µm |
5.08mm | 55~86µm | 36pcs Waffle 2" |
FCN112K5.08A152M-DC | FCN112K5.08A152-DC | PB06 |  |
| 176 | 44x44 Perimeter |
8mil 204µm |
10mm | 80~100µm | 49pcs Waffle 4" |
FCN176G10A204M-DC | FCN176G10A204-DC | PB08 x4 |
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| 220 | 44x66 Perimeter |
8mil 204µm |
10mm x 15mm |
107µm ø102µm |
20pcs Waffle 4" |
FCN220G10x15A204M-DC | FCN220G10x15A204-DC | PB08 x6 |
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| Geometries See 12 more wire bondable Test Die #1 | |||||||||
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| General Specifications: | |||||||||||||||||||
| Metal Composition: Al/Cu/Si (98/1/1) | |||||||||||||||||||
| Die thickness 24 mil (600~650µm). Thin die (back grinding) available on special order. | |||||||||||||||||||
| Metal Thickness: 8.9K Å (Pitch 152µm) 17K Å (Pitch 204~457µm) | |||||||||||||||||||
| Passivation Thickness: 8K Å (Pitch 152~204µm) 10K Å (Pitch 254~457µm) | |||||||||||||||||||
| Passivation Type: Nitride | |||||||||||||||||||
| Options and Accessories: | |||||||||||||||||||
| 5-inch wafers available for all items. | |||||||||||||||||||
| Tape and reel (T&R) packaging available special order. | |||||||||||||||||||
Geometries
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