BGA & WLP
Ball Grid Array
 
Pitch: 0.3mm   0.4mm   0.5mm   0.8mm   1.0mm   1.27mm   1.5mm

WLP-CSP   uBGA   SBGA   CBGA   CCGA   CLGA   CLGA Spec   LGA   Flip Chips

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BGA and CSP Test and Burn-in
Sockets


0.3mm pitch WLP - Wafer Level Package
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
4 2x2 0.3mm 0.6mm
Si Call - WLP4T.3C-DC022D   360 ° Model
16 4x4 0.3mm 1.2mm
Si Call - WLP16T.3C-DC048D   360 ° Model
36 6x6 0.3mm 1.8mm
Si Call - WLP36T.3C-DC067D   360 ° Model
64 8x8 0.3mm 2.4mm
Si Call - WLP64T.3C-DC088D   360 ° Model
100 10x10 0.3mm 3.0mm
Si 256 - WLP100T.3C-DC108D   360 ° Model
144 12x12 0.3mm 3.6mm
Si 196 - WLP144T.3C-DC127D   360 ° Model
196 14x14 0.3mm 4.2mm
Si 196 - WLP196T.3C-DC148D   360 ° Model
256 16x16 0.3mm 4.8mm
Si 144 - WLP256T.3C-DC168D   360 ° Model
264 17x17
6-row
0.3mm 6mm
Si 121 - WLP264T.3C-DC173D   360 ° Model
400 20x20 0.3mm 6mm
Si 121 - WLP400T.3C-DC208D   360 ° Model
676 26x26 0.3mm 7.8mm
Si 64 - WLP676T.3C-DC260D   360 ° Model
900 30x30 0.3mm 9.0mm
Si 49 - WLP900T.3C-DC307D   360 ° Model
1600 40x40 0.3mm 12.0mm
Si 36 - WLP1600T.3C-DC307D   360 ° Model
SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: WLP400T.3C-DC208
WLP series silicon wafer level substrate. 0.20mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 

0.4mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
4 2x2 0.4mm 0.8mm
Si Call - WLP4T.4C-DC022D   360 ° Model
16 4x4 0.4mm 1.6mm
Si Call - WLP16T.4C-DC048D   360 ° Model
36 6x6 0.4mm 2.4mm
Si Call - WLP36T.4C-DC067D   360 ° Model
64 8x8 0.4mm 3.2mm
Si 256 - WLP64T.4C-DC088D   360 ° Model
97 10x10 0.4mm 5mm
BT 624 - BGA97T.4C-DC107D   360 ° Model
100 10x10 0.4mm 4mm
Si 196 - WLP100T.4C-DC108D   360 ° Model
144 12x12 0.4mm 4.8mm
Si 144 - WLP144T.4C-DC127D   360 ° Model
144 13x13
4-Row
0.4mm 6mm
Si 121 - WLP144T.4C-DC133D   360 ° Model
196 14x14 0.4mm 5.6mm
Si 121 - WLP196T.4C-DC148D   360 ° Model
256 16x16 0.4mm 6.4mm
Si 81 - WLP256T.4C-DC168D   360 ° Model
300 20x20
5-Row
0.4mm 10mm
BT 240 BGA300T.4-DC205D BGA300T.4C-DC205D   360 ° Model
360 23x23
5-Row
0.4mm 10mm
BT 250 BGA360T.4-DC235D BGA360T.4C-DC235D   360 ° Model
400 20x20 0.4mm 8mm
Si 64 - WLP400T.4C-DC208D   360 ° Model
400 20x20 0.4mm 10mm
BT 240 BGA400T.4-DC209D BGA400T.4C-DC209D   360 ° Model
432 31x31
4-Row
0.4mm 13mm
BT 160 - BGA432T.4C-DC313D   360 ° Model
456 25x25
6-Row
0.4mm 12mm
BT 189 BGA456T.4-DC255D BGA456T.4C-DC255D   360 ° Model
625 25x25 0.4mm 12mm
BT 189 BGA625T.4-DC259D BGA625T.4C-DC259D   360 ° Model
644 30x30
7-Row
0.4mm 15mm
BT 126 BGA644T.4-DC305D BGA644T.4C-DC305D   360 ° Model
676 26x26 0.4mm 10.4mm
Si 49 - WLP676T.4C-DC260D   360 ° Model
900 30x30 0.4mm 12mm
Si 36 - WLP900T.4C-DC307D   360 ° Model
900 30x30 0.4mm 15mm
BT 126 BGA900T.4-DC309D BGA900T.4C-DC309D   360 ° Model
2025 45x45 0.4mm 21mm
BT 60 LBGA2025T.4-DC459D LBGA2025T.4C-DC459D   360 ° Model
3600 60x60 0.4mm 27mm
BT 40 LBGA3600T.4-DC609D LBGA3600T.4C-DC609D   360 ° Model
6400 80x80 0.4mm 35mm
BT 24 LBGA6400T.4-DC809D LBGA6400T.4C-DC809D
10,000 100x100 0.4mm 42.5mm
BT 12 LBGA10000T.4-BUS-D LBGA10000T.4C-BUS-D   360 ° Model
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: LBGA2025T.5C-DC459
Dummy Die: Add  "D" to end of part number.     Example: LBGA2025T.4-DC459D
WLP series silicon wafer level substrate. 0.26mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 

0.5mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
4 2x2 0.5mm 1.0mm
Si Call - WLP4T.5C-DC022D   360 ° Model
6 2x3 0.5mm 1.5 x 1.0mm Si Reel CSP6E7A.5-DC023 CSP6E7A.5C-DC023
16 4x4 0.5mm 2mm
Si Reel - WLP16E.5C-DC048D   360 ° Model
36 6x6 0.5mm 3mm
Si Reel - WLP36E.5C-DC067D   360 ° Model
56 10x10
2-Row
0.5mm 6mm BT 608 CSP56T.5-DC102 CSP56T.5C-DC102
64 8x8 0.5mm 4mm
Si 196 - WLP64T.5C-DC088D   360 ° Model
64 9x9 0.5mm 5mm
BT 490/624 - BGA64T.5C-9x9-D   360 ° Model
84 10x10
3-Row
0.5mm 6mm BT 608 CSP84T.5-DC104 CSP84T.5C-DC104
84 12x12
3-Row
0.5mm 7mm BT 476 CSP84T.5-DC123 CSP84T.5C-DC123
96 14x14
2-Row
0.5mm 8mm Pi
FR4
348 fBGA96T.5-DC144
LBGA96T.5-ISO
fBGA96T.5C-DC144
LBGA96T.5C-ISO
  360 ° Model
100 10x10 0.5mm 5mm
Si 144 - WLP100T.5C-DC108D   360 ° Model
108 12x12
3-Row
0.5mm 7mm BT 476 CSP108T.5-DC124 CSP108T.5C-DC124   360 ° Model
112 11x11
4-Row
0.5mm 6mm
Si 121 - WLP112T.5C-DC113D
132 14x14
3-Row
0.5mm 8mm BT 360 CSP132T.5-DC145 CSP132T.5C-DC145
144 12x12 0.5mm 6mm
Si 121 - WLP144T.5C-DC127D   360 ° Model
196 14x14 0.5mm 7mm
Si 81 - WLP196T.5C-DC148D   360 ° Model
228 22x22
3-Row
0.5mm 12mm FR4 189 LBGA228T.5-DC222B LBGA228T.5C-DC222B   360 ° Model
256 16x16 0.5mm 8mm
Si 64 - WLP256T.5C-DC168D   360 ° Model
288 22x22
4-Row
0.5mm 12mm FR4 189 LBGA288T.5-DC221 LBGA288T.5C-DC221   360 ° Model
400 20x20 0.5mm 10mm
Si 49 - WLP400T.5C-DC208D   360 ° Model
400 20x20 0.5mm 12mm
BT 189/198 BGA400T.5-DC209 BGA400T.5C-DC209   360 ° Model
484 22x22 0.5mm 12mm FR4 189 LBGA484T.5-DC229B LBGA484T.5C-DC229B   360 ° Model
625 25x25 0.5mm 15mm
BT 126 BGA625T.5-DC259 BGA625T.5C-DC259   360 ° Model
676 26x26 0.5mm 13mm
Si 36 - WLP676T.5C-DC260D   360 ° Model
676 26x26 0.5mm 15mm FR4 126 LBGA676T.5-DC269D LBGA676T.5C-DC269D   360 ° Model
900 30x30 0.5mm 15mm
Si 25 - WLP900T.5C-DC307D   360 ° Model
900 30x30 0.5mm 17mm
BT 90 BGA900T.5-DC309 BGA900T.5C-DC309   360 ° Model
2025 45x45 0.5mm 25mm BT 44 LBGA2025T.5-DC459D LBGA2025T.5C-DC459D   360 ° Model
2025 45x45 0.5mm 25mm FR4 44 LBGA2025T.5-BUS LBGA2025T.5C-BUS   360 ° Model
3600 60x60 0.5mm 33mm FR4 24 LBGA3600T.5-DC609D LBGA3600T.5C-DC609D   360 ° Model
6400 80x80 0.5mm 42.5mm FR4 12 LBGA6400T.5-DC809 LBGA6400T.5C-DC809
10,000 100x100 0.5mm 52.5mm FR4 10 LBGA10000T.5-BUS LBGA10000T.5C-BUS   360 ° Model
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: CSP56T.5C-DC102
Dummy Die: Add  "D" to end of part number.     Example: CSP56T.5-DC102D
WLP series silicon wafer level substrate. 0.31mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 
0.65mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
4 2x2 0.65mm 1.0 x 0.5mm
Si Reel CSP4E7A.65-DC022 -
336 20x20
6-Row
0.65mm 14mm
Pi 119 BGA336T.65-D -
336 20x20
6-Row
0.65mm 15mm
FR4 126 BGA336T.65-DC203 BGA336T.65C-DC203   360 ° Model
400 20x20
Full
0.65mm 15mm
BT 126 BGA400T.65-DC209D BGA400T.65C-DC209D   360 ° Model
625 25x25
Full
0.65mm 17mm
BT 90 LBGA625T.65-DC259D LBGA625T.65C-DC259D   360 ° Model
2025 45x45
Full
0.65mm 32.5mm
BT 24 LBGA2025T.65-DC459D LBGA2025T.65C-DC459D   360 ° Model
3600 60x60
Full
0.65mm 42.5mm
FR4 12 LBGA3600T.65-DC609D LBGA3600T.65C-DC609D   360 ° Model
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: LBGA2025T.65C-DC459
Dummy Die: Add  "D" to end of part number.     Example: LBGA2025T.65-DC459D
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings viewer for rotatable models: PC Version  •  Mac Version
 
 
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0.75mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
46 6x8
Full
0.75mm 6 x 7mm BT 160 BGA46T.75-DC24 BGA46T.75C-DC24   360 ° Model
48 6x8
Full
0.75mm 6 x 7mm BT 480 BGA48T.75-6x8B BGA48T.75C-6x8B   360 ° Model
48 6x8
Full
0.75mm 6 x 7mm BT 480 BGA48T.75-DC688D BGA48T.75C-DC688D   360 ° Model
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: BGA46T.75C-DC24
Dummy Die: Add  "D" to end of part number.     Example: BGA46T.75-DC24D
 
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0.8mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
36 6x6
Full
0.8mm 6 x 6mm BT 608 BGA36T.8-DC069 BGA36T.8C-DC069
48 6x8
Full
0.8mm 8 x 9mm FR4 297 LBGA48T.8-DC689 LBGA48T.8C-DC689
48 6x8
Full
0.8mm 8mm BT 80 BGA48T.8-DIE-6x8 -
49 7x7
Full
0.8mm 7mm BT 476
429
BGA49T.8-DC077
BGA49T.8-D
-
49 7x7
Full
0.8mm 6mm BT 429 - BGA49T.8C-DC077
BGA49T.8C-ISO
60 6x10
Depopulated
0.8mm 8x10mm BT 290 LBGA60T.8-DC610 LBGA60T.8C-DC610   360 ° Model
64 8x8
Full
0.8mm 8mm BT 319 BGA64T.8-DC089D BGA64T.8C-DC089D   360 ° Model
81 9x9
Full
0.8mm 8mm BT 360 BGA81T.8-DC099 BGA81T.8C-DC099
84 6x15
DDR2
0.8mm 8x14mm FR4 228 LBGA84T.8-DC656 LBGA84T.8C-DC656
84 6x15
DDR2
0.8mm 10x12.5mm FR4 136 BGA84T.8-DC654D BGA84T.8C-DC654D   360 ° Model
84 6x15
DDR2
0.8mm 12x12.5mm FR4 180 BGA84T.8-DC655 BGA84T.8C-DC655   360 ° Model
100 10x10
Full
0.8mm 10mm BT 250 BGA100T.8-DC109 BGA100T.8C-DC109   360 ° Model
100 11x11
4-Row
0.8mm 10mm BT 184 BGA100T.8-11x11 -
112 11x11
4-Row
0.8mm 10mm FR4 250 LBGA112T.8-DC114 LBGA112T.8C-DC114
144 12x12
Full
0.8mm 12mm FR4 189
198
BGA144T.8-DC128 BGA144T.8C-DC128   360 ° Model
144 13x13
4-Row
0.8mm 12mm FR4 189
198
LBGA144T.8-DC134 LBGA144T.8C-DC134
208 17x17
4-Row
0.8mm 15mm BT 126 BGA208T.8-DC170 BGA208T.8C-DC170
280 19x19
5-Row
0.8mm 17mm FR4 90 LBGA280T.8-DC195 LBGA280T.8C-DC195
361 19x19
Full
0.8mm 16mm FR4 119 BGA361T.8-DC199 BGA361T.8C-DC199   360 ° Model
532 26x26
7-Row
0.8mm 23mm BT 60 BGA532T.8-DC266D BGA532T.8C-DC266D   360 ° Model
532 26x26
7-Row
0.8mm 23mm FR4 60 LBGA532T.8-DC266D LBGA532T.8C-DC266D   360 ° Model
676 26x26
Full
0.8mm 23mm BT 60 BGA676T.8-DC269D BGA676T.8C-DC269D   360 ° Model
676 26x26
Full
0.8mm 23mm FR4 60 LBGA676T.8-DC269 LBGA676T.8C-DC269   360 ° Model
900 30x30
Full
0.8mm 27mm FR4 40 BGA900T.8-DC309D BGA900T.8C-DC309D   360 ° Model
900 30x30
Full
0.8mm 27mm FR4 40 LBGA900T.8-DC309D LBGA900T.8C-DC309D   360 ° Model
1225 35x35
Full
0.8mm 31mm BT 27 LBGA1225T.8-DC359D LBGA1225T.8C-DC359D   360 ° Model
1444 38x38
Full
0.8mm 32.5mm FR4 24 LBGA1444T.8-DC389 LBGA1444T.8C-DC389
1600 40x40
Full
0.8mm 35mm FR4 21 LBGA1600T.8-DC409 LBGA1600T.8C-DC409
2025 45x45
Full
0.8mm 40mm BT 21 LBGA2025T.8-DC459D LBGA2025T.8C-DC459D   360 ° Model
2500 50x50
Full
0.8mm 42.5mm FR4 12 LBGA2500T.8-DC509 LBGA2500T.8C-DC509
3600 60x60
Full
0.8mm 50mm FR4 10 LBGA3600T.8-DC609D LBGA3600T.8C-DC609D   360 ° Model
4624 68x68
Full
0.8mm 56mm FR4 10 LBGA4624T.8-DC688D LBGA4624T.8C-DC688D   360 ° Model
For SnAgCu Lead Free solder balls, add  "C" after the pitch.   Example:BGA100T.8C-DC109
Dummy Die: Add  "D" to end of part number.     Example: BGA100T.8-DC109D
Depopulated "perimeter" row versions are available instead of "full" array.
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1.0mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
81 9x9
Full
1.0mm 10mm BT 184 BGA81T1.0-ISO BGA81T1.0C-ISO
100 10x10
Full
1.0mm 11mm FR4 176 BGA100T1.0-DC109D BGA100T1.0C-DC109D   360 ° Model
144 12x12
Full
1.0mm 13mm BT 160 BGA144T1.0-D
LBGA144T1.0-DC128
LBGA144T1.0C-DC128
160 14x14
4-Row
1.0mm 15mm BT 126 BGA160T1.0-DC147BD BGA160T1.0C-DC147BD
169 13x13
Full
1.0mm 13.4mm FR4 152 LBGA169T1.0-BUS LBGA169T1.0C-BUS   360 ° Model
172 14x14
5-Row
1.0mm 15mm BT 126 BGA172T1.0-DC143 BGA172T1.0C-DC143   360 ° Model
192 16x16
4-Row
1.0mm 17mm BT 90 BGA192T1.0-DC160A BGA192T1.0C-DC160A
196 14x14
Full
1.0mm 15mm BT 126 BGA196T1.0-DC149B BGA196T1.0C-DC149B   360 ° Model
208 16x16
4-Row
4x4 center
1.0mm 17mm BT 90 BGA208T1.0-DC164A BGA208T1.0C-DC164A
256 16x16
Full
1.0mm 17mm BT 90 BGA256T1.0-DC169D BGA256T1.0C-DC169D   360 ° Model
256 16x16
Full
1.0mm 17mm BT 90 LBGA256T1.0-ISO LBGA256T1.0C-ISO
288 22x22
4-Row
1.0mm 23mm BT 60 BGA288T1.0-DC221 BGA288T1.0C-DC221
324 22x22
4-Row
6x6 center
1.0mm 23mm BT
FR4
60 BGA324T1.0-DC224D
LBGA324T1.0-ISO
BGA324T1.0C-DC224D
LBGA324T1.0C-ISO
Model-DC224
Model-ISO
384
(388)
26x26
4-Row
6x6 center
1.0mm 27mm FR4 40 LBGA384T1.0-DC261 LBGA384T1.0C-DC261
388
26x26
4-Row
6x6 center
1.0mm 27mm FR4 40 BGA388T1.0-DC264
BGA388T1.0-D
BGA388T1.0C-DC264
400 20x20
Full
1.0mm 21mm FR4 60 LBGA400T1.0-DC209 LBGA400T1.0C-DC209
484 22x22
Full
1.0mm 23mm FR4 60 LBGA484T1.0-DC229A LBGA484T1.0C-DC229A   360 ° Model
484 22x22
Full
1.0mm 22mm FR4 60 LBGA484T1.0-BUS LBGA484T1.0C-BUS   360 ° Model
625 25x25
Full
1.0mm 27mm FR4 40 SBGA625T1.0-DC259D SBGA625T1.0C-DC259D   360 ° Model
672 26x26
Full
1.0mm 27mm FR4 40 LBGA672T1.0-DC268 LBGA672T1.0C-DC268
676
26x26
Full
1.0mm 27mm BT 40 BGA676T1.0-DC269BD BGA676T1.0C-DC269BD   360 ° Model
900 30x30
Full
1.0mm 31mm FR4 27 LBGA900T1.0-BUS-D
LBGA900T1.0-DC309
LBGA900T1.0C-BUS-D
LBGA900T1.0C-DC309
  360 ° Model
928 39x39
7-Row
1.0mm 40mm FR4 21 SBGA928T1.0-DC394D SBGA928T1.0C-DC394D   360 ° Model
1024 32x32
Full
1.0mm 32mm FR4 24 LBGA1024T1.0-BUS-D LBGA1024T1.0C-BUS-D   360 ° Model
1152 34x34
Full
1.0mm 35mm FR4 24 FC1152T1.0-DC344D
Dome Heat Spreader
FCG1152T1.0C-DC344D
Dome Heat Spreader
  360 ° Model
1152 34x34
Full
1.0mm 35mm FR4 24 FF1152T1.0-DC344D
Flat Heat Spreader
FFG1152T1.0C-DC344D
Flat Heat Spreader
  360 ° Model
1156 34x34
Full
1.0mm 35mm BT 24 BGA1156T1.0-DC349 BGA1156T1.0C-DC349
1156 34x34
Full
1.0mm 34mm FR4 34 LBGA1156T1.0-BUS LBGA1156T1.0C-BUS   360 ° Model
1517 39x39
Full
1.0mm 39mm FR4 12 LBGA1517T1.0-BUS-D LBGA1517T1.0C-BUS-D   360 ° Model
1600 40x40
Full
1.0mm 42.5mm FR4 12 BGA1600T1.0-DC409D
LBGA1600T1.0-DC409
BGA1600T1.0C-DC409D
LBGA1600T1.0C-DC409
1696 42x42
Full
1.0mm 42.5mm FR4 12 SBGA1696T1.0-DC424D SBGA1696T1.0C-DC424D   360 ° Model
1704 42x42
Full
1.0mm 42.5mm FR4 12 SBGA1704T1.0-DC425D SBGA1704T1.0C-DC425D
1752 42x42
Full
1.0mm 42.5mm FR4 12 SBGA1752T1.0-DC427D SBGA1752T1.0C-DC427D   360 ° Model
1759
1760
42x42
Full
1.0mm 42.5mm FR4 12 LBGA1759T1.0-BUS-D
LBGA1760T1.0-BUS-D
LBGA1759T1.0C-BUS-D
LBGA1760T1.0C-BUS-D
  360 ° Model
1760 42x42
Full
1.0mm 45mm FR4 12 SBGA1760T1.0-DC428D SBGA1760T1.0C-DC428D   360 ° Model
1924
1925
1926
1927
1928
1929
1930
44x44
Full
1.0mm 45mm FR4 12 SBGA1924T1.0-DC443D SBGA1924T1.0C-DC443D   360 °Model
1936 44x44
Full
1.0mm 45mm FR4 12 LBGA1936T1.0-DC449D LBGA1936T1.0C-DC449D   360 ° Model
1936 44x44
Full
1.0mm 45mm FR4 12 SBGA1936T1.0-DC449D SBGA1936T1.0C-DC449D   360 ° Model
2104 46x46
Full
1.0mm 47.5mm FR4 10 SBGA2104T1.0-DC467D SBGA2104T1.0C-DC467D   360 ° Model
2377 49x49
Full
1.0mm 50mm FR4 10 SBGA2377T1.0-DC497D SBGA2377T1.0C-DC497D   360 ° Model
2397 49x49
Full
1.0mm 48.9mm FR4 10 LBGA2397T1.0-BUS LBGA2397T1.0C-BUS   360 ° Model
2488 50x50
Full
1.0mm 52.5mm FR4 10 SBGA2488T1.0-DC507D SBGA2488T1.0C-DC507D   360 ° Model
2500 50x50
Full
1.0mm 50mm FR4 10 LBGA2500T1.0-BUS LBGA2500T1.0C-BUS   360 ° Model
2500 50x50
Full
1.0mm 52.5mm FR4 10 LBGA2500T1.0-DC508D LBGA2500T1.0C-DC508D   360 ° Model
2577 51x51
Full
1.0mm 52.5mm FR4 10 SBGA2577T1.0-DC517D SBGA2577T1.0C-DC517D   360 ° Model
2892 54x54
Full
1.0mm 55mm FR4 8 SBGA2892T1.0-DC547D SBGA2892T1.0C-DC547D   360 ° Model
3600 60x60
Full
1.0mm 59.5mm FR4 8 LBGA3600T1.0-BUS LBGA3600T1.0C-BUS   360 ° Model
10,000 100x100
Full
1.0mm 114mm FR4 4 LBGA10000T1.0-BUS LBGA10000T1.0C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch. Example: BGA256T1.0C-DC169A
Dummy Die: Add  "D" to end of part number.     Example: BGA256T1.0-DC169AD
Depopulated "perimeter" row versions are available instead of "full" array.
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1.27mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
119 7x17
Full
1.27mm 14 x 22mm BT 84 BGA119T1.27-D -
208 17x17
4-Row
1.27mm 23mm BT 60 BGA208T1.27-DC170
BGA208T1.27-DC171
BGA208T1.27C-DC170
BGA208T1.27C-DC171
217 17x17
4-Row
3x3 center
1.27mm 23mm BT 60 BGA217T1.27-DC172
BGA217T1.27-DC174
BGA217T1.27C-DC172
BGA217T1.27C-DC174
256 20x20
4-Row
1.27mm 27mm BT 40 BGA256T1.27-DC200 BGA256T1.27C-DC200
256 16x16
Full
1.27mm 21mm FR4 40 LBGA256T1.27-DC61 LBGA256T1.27C-DC61   360 ° Model
272 20x20
4-Row
4x4 center
1.27mm 27mm BT 40 BGA272T1.27-DC202D BGA272T1.27C-DC202D   360 ° Model
313 25x25
Staggered
1.27mm 35mm BT 24 BGA313T1.27 BGA313T1.27C
352 26x26
4-Row
1.27mm 35mm BT 24 BGA352T1.27-DC70 BGA352T1.27C-DC70
357 19x19
Full
1.27mm 25mm FR4 44 LBGA357T1.27-DC73 LBGA357T1.27C-DC73
388 26x26
4-Row
6x6 center
1.27mm 35mm BT 24 BGA388T1.27-DC72
BGA388T1.27-DC265
BGA388T1.27C-DC72
BGA388T1.27C-DC265
1225 35x35
Full
1.27mm 45mm FR4 12 LBGA1225T1.27-DC359 LBGA1225T1.27C-DC359   360 ° Model
6,400 80x80
Full
1.27mm 114mm FR4 4 - LBGA6400T1.27F-BUS
LBGA6400T1.27C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch. Example: BGA256T1.27C-DC200
Dummy Die: Add  "D" to end of part number.     Example: BGA256T1.27-DC200D
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SBGA - Thermally Enhanced 1.0mm and 1.27mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
256 20x20
4-Row
1.27mm 27mm BT 40 SBGA256T1.27-DC200 SBGA256T1.27C-DC200
304 23x23
4-Row
1.27mm 31mm BT 27 SBGA304T1.27-DC230 SBGA304T1.27C-DC230
352 26x26
4-Row
1.27mm 35mm BT 24 SBGA352T1.27-DC70 SBGA352T1.27C-DC70
432 31x31
4-Row
1.27mm 40mm BT 24 SBGA432T1.27-DC314 SBGA432T1.27C-DC314
480 29x29
5-Row
1.27mm 37.5mm BT 21 SBGA480T1.27-ISO SBGA480T1.27C-ISO
560 33x33
5-Row
1.27mm 42.5mm BT 12 SBGA560T1.27-DC87 SBGA560T1.27C-DC87
600 35x35
5-Row
1.27mm 45mm BT 12 SBGA600T1.27-D
SBGA600T1.27-DC355
SBGA600T1.27C-DC355
1517 39x39
Full
1.0mm 40mm BT 21 SBGA1517T1.0-D SBGA1517T1.0C-DC397D
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: SBGA256T1.27C-DC200
Dummy Die: Add  "D" to end of part number.     Example: SBGA256T1.27-DC200D
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PBGA - 1.5mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
169 13x13
Full
1.5mm 23mm BT 60 BGA169T1.5-DC10D BGA169T1.5C-DC10D   360 ° Model
225 15x15
Full
1.5mm 27mm BT 40 BGA225T1.5-DC15 BGA225T1.5C-DC15
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: BGA169T1.5C-DC10
Dummy Die: Add  "D" to end of part number.     Example: BGA169T1.5-DC10D
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CBGA - Ceramic Ball Grid    Standard=Sn10=Hi Temp,     L=Sn62=Low Temp,    C=Sn96.5/Ag3.0/Cu0.5
Balls Ball Matrix Pitch Size (mm) Tray Qty Bare Substrate
Without Balls
For CCGA
Hi-Temp SnPb
Low-Temp SnPb
Lead Free
Pb-Free (RoHS)
121 11x11
Full
1.27mm 15mm 119/126 CLGA121T1.27A-DC5
Pt-Ag95
CBGA121T1.27-DC5
Sn10/Pb90

CBGA121T1.27L-DC5
Sn62/Pb36/Ag2.0
CBGA121T1.27C-DC5
Sn96.5/Ag3.0/Cu0.5
196 14x14
Full
1.27mm 18.5mm 84 CLGA196T1.27A-DC11
Pt/Ag95
CBGA196T1.27-DC11
Sn10/Pb90

CBGA196T1.27L-DC11
Sn62/Pb36/Ag2.0
CBGA196T1.27C-DC11
Sn96.5/Ag3.0/Cu0.5
256 16x16
Full
1.27mm 21mm 60 CLGA256T1.27A-DC61
Pt/Ag95
CBGA256T1.27-DC61
Sn10/Pb90

CBGA256T1.27L-DC61
Sn62/Pb36/Ag2.0
CBGA256T1.27C-DC61
Sn96.5/Ag3.0/Cu0.5
304 16x19
Full
1.27mm 21 x 25 55 CLGA304T1.27A-DC63
Pt/Ag95
CBGA304T1.27-DC63
Sn10/Pb90

CBGA304T1.27L-DC63
Sn62/Pb36/Ag2.0
CBGA304T1.27C-DC63
Sn96.5/Ag3.0/Cu0.5
361 19x19
Full
1.27mm 25mm 44 CLGA361T1.27A-DC71
Pt/Ag95
CBGA361T1.27-DC71
Sn10/Pb90

CBGA361T1.27L-DC71
Sn62/Pb36/Ag2.0
CBGA361T1.27C-DC71
Sn96.5/Ag3.0/Cu0.5
  360 ° Model
Without Die


  360 ° Model
With Die
400 20x20
Full
1.27mm 27mm 40 CLGA400T1.27A-DC21
Pt/Ag95
CBGA400T1.27-DC21
Sn10/Pb90

CBGA400T1.27L-DC21
Sn62/Pb36/Ag2.0
CBGA400T1.27C-DC21
Sn96.5/Ag3.0/Cu0.5
625 25x25
Full
1.27mm 32.5mm 24 CLGA625T1.27A-DC81
Pt/Ag95
CBGA625T1.27-DC81
Sn10/Pb90
CBGA625T1.27C-DC81
Sn96.5/Ag3.0/Cu0.5
1089 33x33
Full
1.27mm 42.5mm 12 CLGA1089T1.27A-DC339
Pt/Ag95
CBGA1089T1.27-DC339
Sn10/Pb90
CBGA1089T1.27C-DC339
Sn96.5/Ag3.0/Cu0.5
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: CBGA256T1.27C-DC61
Dummy Die: Add  "D" to end of part number.     Example: CBGA256T1.27-DC61D
CBGA Substrate: 1.0mm (40mils) thick. Composition 96% Alumina, 4% Talc, 1600°C. Fired   CTE 6.7 x 10-6/°C
Large Size CBGA Delamination CTE mismatch warning.
CBGA ceramic substrate pad is thick film Ag95/Pt5.
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Notes About Substrates
BT Versus FR4
Flex Polyimide Versus BT

Download our dummy components catalog in PDF format.

        
 
 
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