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COPPER (Cu) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
Copper
CDA101
OFHC-101
1083°C 1083°C 8.94 115 GPa 60 μΩ m 400 W/m-°K 17ppm/°C 221 MPa
Copper
CDA14410

Cu99.9 Sn0.1~0.2
EFTEC-3
1083°C 1083°C 8.94 120 GPa 60 μΩ m 360 W/m-°K 17.3ppm/°C 255 MPa
Copper
C194
CuFe2P
EFTEC-194W

Cu97.4/Fe2.4/Zn0.13/P0.04
1088°C 1088°C 8.80 121 GPa 65 μΩ m 260 W/m-°K 17.4ppm/°C 221 MPa
Beryllium Copper
C172

Hard Temper TD05
Alloy 25
Cu98/Be1.8/Co0.2
865°C 980°C 8.30 131 GPa 23 μΩ m @20°
105 W/m-°K
----
@200°
130W/m-°K
17.8ppm/°C 560 MPa
 
 
LEAD (Pb) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
 High Lead
Pb95/Sn5
Solder

UNS L54320
308°C 312°C 11.0 20 GPa 8.8 36 W/m-°K 28.7ppm/°C 28.5 MPa
Pb93.5/Sn5/Ag1.5
Solder

HMP
296°C 301°C 10.8 19.5 GPa 8.7 36 W/m-°K 28.7ppm/°C 29.6 MPa
Pb90/Sn10
Solder

UNS L54520
275°C 302°C 10.7 19 GPa 8.2 36 W/m-°K 27.9ppm/°C 30 MPa
Pb85/Sn15
Solder
226°C 290°C 10.5 19.5 GPa 8.5 36.5 W/m-°K 27.0ppm/°C 32 MPa
Pb80/Sn20
Solder

UNS L54711
183°C 280°C 10.2 20 GPa 8.7 37 W/m-°K 26.5ppm/°C 33 MPa
Pb75/Sn25
Solder

 
183°C 271°C 9.96 20.5 GPa 9.0 38 W/m-°K 26.2ppm/°C 33.5 MPa
Pb70/Sn30
Solder

UNS L54280
183°C 257°C 9.7 21 GPa 9.3 41 W/m-°K 26.0ppm/°C 34 MPa
 
Eutectic and Near Eutectic
Sn60/Pb40
Solder
183°C 186°C 8.5 30 GPa 11.5 50 W/m-°K 23.9ppm/°C 52 MPa
Sn63/Pb37
Solder
183°C 183°C 8.4 30 GPa 11.9 51 W/m-°K 24.0ppm/°C 52 MPa
Sn62/Pb36/Ag2
Solder
179°C 179°C 8.44 23 GPa 11.5 49 W/m-°K 27.0ppm/°C xx MPa
 
 
LEAD FREE (Pb-Free) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
Lead Free (Tin-Sn)
Sn96.5/Ag3.0/Cu0.5
SAC305
217°C 218°C 7.4 51 Gpa 16.6 59 W/m-°K 21.0ppm/°C 50 Mpa
Sn96.5/Ag3.5
Sn96
221°C 221°C 7.5 51 Gpa 0.0000104 ohm-cm
Electrical Resistivity
59 W/m-°K 21.6ppm/°C 32 Mpa
Sn99.9/Cu.7/Ni.05/Ge.009
SN100C
227°C 227°C 7.4 __ Gpa _____ ohm-cm
Electrical Resistivity
59 W/m-°K 21.6ppm/°C __ Mpa
Sn96.5/Cu3.0/Ni0.5
SCN305
228°C 394°C 7.3 ~48 Gpa ~13.0 ~50W/m-°K 22.0ppm/°C 40~60 MPa
Sn90/Sb10 245°C 266°C 7.24 ~50 Gpa 0.0000161 ohm-cm
Electrical Resistivity
49 W/m-°K 27.0ppm/°C 42 MPa
Sn91.5/Sb8.5 235°C 243°C 7.3 - 0.0000145 ohm-cm
Electrical Resistivity
58 W/m-°K 27.0ppm/°C 41 MPa
Sn95/Sb5
UNS L13950
236°C 240°C 7.25 48 Gpa 0.0000145 ohm-cm
Electrical Resistivity
57 W/m-°K 27.0ppm/°C 41 MPa
Sn96.5/Cu.8/Ag.7/Bi2 208°C 215°C __ __ Gpa __ __ W/m-°K __ppm/°C __ MPa
Sn90/Ag3.5/Bi0.5/In6.0 202°C 210°C 7.4 53 Gpa 15.1 51.2 W/m-°K 25.5ppm/°C 47 MPa
Sn62/Bi37/0.5Cu/1.0Sb
Tin-Bismuth
139°C 174°C 8.1 47 GPa 5.9 30 W/m-°C 22.0ppm/°C 99 MPa
 
Lead Free (Non-Tin)
Au80-Sn20
Eutectic Solder
280°C 280°C 14.7 68 GPa 16.4 57 W/m-°K 16.0ppm/°C 275 MPa
Ag100
Silver
960°C 960°C 10.5 71 Gpa 6 x 105Ohm*m 418 W/m-°K 20.6ppm/°C 125 Mpa
Flux Designation System
Notes:
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.

Liquidus is the lowest temperature which an alloy is completely liquid.
Solidus is the highest temperature at which an alloy is completely solid.

Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)

Data is for information only and is not guaranteed for accuracy.

Reference:Wikipedia Young's Modulus
Conversion: GPa to PSI
 
 
 
INDIUM (In) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•C-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
 Indium Alloy
In100 157°C 157°C 7.31 1.7 psi x 106 19.2 83 W/m-°C 30.9ppm/°C 386 psi
In97/Ag3 143°C 143°C 7.38 2.1 psi x 106 26.1 84 W/m-°C 38.0ppm/°C 1200 psi
In95/Bi5 125°C 150°C 7.40 - - - - -
In90/Ag10 143°C 237°C 7.54 2.5 psi x 106 18.2 71 W/m-°C 27.0ppm/°C 1600 psi
In80/Pb15/Ag5 149°C 154°C 7.50 1.9 psi x 106 15.8 53 W/m-°C 22.0ppm/°C 3370 psi
In75/Pb25 156°C 165°C __ - __ __ W/m-°C __.0ppm/°C __ psi
In70/Pb30 165°C 175°C 8.19 - 8.8 38 W/m-°C 28.0ppm/°C 3450 psi
In60/Pb40 173°C 181°C 8.52 - 7.0 29 W/m-°C 27.0ppm/°C 4150 psi
In50/Pb50 184°C 210°C 8.58 1.5 psi x 106 6.0 22 W/m-°C 27.0ppm/°C 4670 psi
In50/Sn50 118°C 125°C 7.29 3.5 psi x 106 9.0 41 W/m-°C 14.0ppm/°C 3100 psi
In52/Sn48 118°C 118°C 7.30 3.5 psi x 106 9.0 40 W/m-°C 24.0ppm/°C UTS 11900 psi
UTS 82 MPa
In40/Pb60 197°C 231°C 9.29 - 5.2 19 W/m-°C 26.0ppm/°C 5000 psi
In25/Pb75 235°C 267°C 9.97 2.2 psi x 106 4.6 18 W/m-°C 29.0ppm/°C 5120 psi
In20/Pb80 260°C 275°C 10.27 - 4.5 17 W/m-°C 26.0ppm/°C 4910 psi
In5/Pb95 300°C 313°C 11.06 2.0 psi x 106 5.1 21 W/m-°C 33.0ppm/°C 5160 psi
 
 
Gallium INDIUM (Ga/In) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•C-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
 Gallium Indium Alloy
Ga75.5/In24.5 15.7°C 23°C 6.35 - - - - -
Ga78.6/In21.4 15.7°C 15.7°C 6.16 - - - - -
Ga95/In5 16°C 25°C 6.15 - - - - -
Ga100 29.8°C 29.8°C 5.90 - - - - -
In99.3/Ga0.7 150°C 150°C 7.31 - - - - -
In99.4/Ga0.6 152°C 152°C 7.31 - - - - -
In99.5/Ga0.5 154°C 154°C 7.31 - - - - -
 
 
Material Properties
Metal
Alloy Melting Point
Liquidus
Solidus
Thermal
Conductivity
@ 25°C
CTE
Coefficient
Thermal
Expansion
Electrical
Resistance
Density
Alloy 42 1435°C 10.5 W/m-°K 5.0ppm/°C 72*10-6 Ω/cm 8.1 g/cm3
Kovar 1450°C 16.7 W/m-°K 5.9ppm/°C 49*10-6 Ω/cm 8.4 g/cm3
Alloy C194
Copper
1085°C 260 W/m-°K 17.6ppm/°C
20~300°C
2.87*10-6 Ω/cm 8.9 g/cm3
Tungsten (W) 3422°C 173 W/m-°K 4.5ppm/°C 5.5*10-6 Ω/cm 19.3 g/cm3
Molybdenum 2623°C 138 W/m-°K 5.1ppm/°C 5.2*10-6 Ω/cm 10.2 g/cm3
Niobium R04210 2477°C 54 W/m-°K 7.3ppm/°C @25°C: 152*10-6 Ω/cm
@ ≤ -264°C: Zero Ω/cm
18.6 g/cm3
 
Notes:
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.
Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)
Data is for information only and is not guaranteed for accuracy.
 
 
 
Material Properties
Substrates
Material Density
gm/cc
Hardness Flexural
Strength
Young's
Modulus
Shear
Modulus
Surface
Finish
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
Volume
Resistivity
Dielectric
Constant
Dk
Dissipation
Factor
Df
HTCC Ceramic
92% Alumina
Al2O3
3.62
g/cc
1027
Kg/mm2
443
MPa
275
GPa
112
GPa
<1.14
µm
20.3
W/mk
6.6
ppm/°C
>1014
Ω-cm2/cm
9.2
εr
0.0003
δ @1MHz
 
 
Material Properties
Organic
Material Density
gm/cc
Hardness Flexural
Modulus
Ultimate
Tensile
Strength
Elongation
at Break
Water
Absorption
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
Volume
Resistivity
Dielectric
Constant
Dk
Melt
Temperature
PEEK
Strands
1.3
g/cc
>84
Shore D
3.6-4.0
GPa
100
MPa
40-45% 0.1-0.45% 0.30
W/mk
45
ppm/°C
>1016
Ω-cm
3.1
εr
343 °C
PTFE
Strands
2.2
g/cc
50-65
Shore D
0.5-0.6
GPa
21-35
MPa
200-500% 0.01% <0.30
W/mk
100
ppm/°C
<1018
Ω-cm
2.1
εr
326°C
 
 
Material Properties
Heatsinks
Material Density
gm/cc
Specific
Heat
Flexural
Strength
Young's
Modulus
Shear
Modulus
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
20~150°C
Electrical
Resistance
Al-SiC
37% Aluminum
Alloy A356.2
63% Silicon Carbide
3.01
g/cc
0.741
J/gK @25°C
488
MPa
188
GPa
76
GPa
200
W/mk Typical
8.4
ppm/°C
20.7
µΩ-cm
 
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.
Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)
Data is for information only and is not guaranteed for accuracy.
 
 
 
Specific Heat
Various Materials
Material Water
@ 25°
Ice
@ 0°
Air Aluminum
Al
Titanium
Ti
Nickel
Ni
Copper
Cu
Silver
Ag
Tin
Sn
Tungsten
W
Lead
Pb
Gold
Au
J/g°C 4.1813 2.010 1.012 0.897 0.523 0.440 0.385 0.233 0.227 0.134 0.129 0.129
 
Ambient temperature is ~25 °C.
Specific Heat is the heat required to raise the temperature of the unit mass of a given substance by a given amount (usually one degree).
Data is for information only and is not guaranteed for accuracy.
 
 
 
Solder Paste
Particle Size

80% Minimum Between:
Unit of
Measurement
T3 T4 T5 T6 T7 T8
Microns 20~45 µm 20~38 µm 10~25 µm 5~15 µm 2~11 µm 2~8 µm
MILS 0.8~1.8 Mils 0.8~1.5 Mils 0.4~1.0 Mils 0.2~0.6 Mils 0.08~0.4 Mils 0.08~0.3 Mils
Mesh size
Lines-per-inch
-325 / +500 -400 / +635 -500 / +635 -635 TBA TBA
 
Solder pastes are classified based on the particle size by IPC standard J-STD 005.
The table above shows the classification type of a paste compared with the mesh size and particle size.
A minimum of 4 to 5 solder paste particles should span the width of the stencil aperature.
Data is for information only and is not guaranteed for accuracy.
 
 
Flux Designation System
 
 
BL - Beaking Load & Tensile Strength
Round Wire
Material Temper Diameter
µm
Diameter
mils
UTS
KSI
UTS
Mpa
BL
Gram Force
CTE
Coefficient
Thermal
Expansion
C172
BeCu
Soft 25 µm 1.0 mil 85 KSI 590 Mpa 30 gf 17.9 ppm/°C
38 µm 1.5 mil 85 KSI 590 Mpa 68 gf 17.9 ppm/°C
50 µm 2.0 mil 85 KSI 590 Mpa 121 gf 17.9 ppm/°C
Hard 25 µm 1.0 mil 212.5 KSI 1477 Mpa 75 gf 17.9 ppm/°C
38 µm 1.5 mil 212.5 KSI 1477 Mpa 170 gf 17.9 ppm/°C
50 µm 2.0 mil 212.5 KSI 1477 Mpa 302 gf 17.9 ppm/°C
Cu98-Pd2.0
PCC
Soft 25 µm 1.0 mil 31 KSI 215 Mpa 10 gf 17.0 ppm/°C
38 µm 1.5 mil 31 KSI 215 Mpa 25 gf 17.0 ppm/°C
50 µm 2.0 mil 31 KSI 215 Mpa 44 gf 17.0 ppm/°C
70 µm 2.7 mil 31 KSI 215 Mpa 89 gf 17.0 ppm/°C
Nb
Niobium
R04200 Type 1
Hard 25 µm 1.0 mil 40~84 KSI 275~585 Mpa 14~30 gf
22 gf Nom
7.3 ppm/°C
38 µm 1.5 mil 40~84 KSI 275~585 Mpa 32~67 gf
50 gf Nom
7.3 ppm/°C
50 µm 2.0 mil 40~84 KSI 275~585 Mpa 57~120 gf
88 gf Nom
7.3 ppm/°C
Au Gold
4N
Soft 25 µm 1.0 mil __ KSI __ Mpa 10 gf 14.0 ppm/°C
38 µm 1.5 mil __ KSI __ Mpa 24 gf 14.0 ppm/°C
50 µm 2.0 mil __ KSI __ Mpa 42 gf 14.0 ppm/°C
Au Gold
4N
Hard 25 µm 1.0 mil 46 KSI __ Mpa 18 gf 14.0 ppm/°C
38 µm 1.5 mil 46 KSI __ Mpa 40 gf 14.0 ppm/°C
50 µm 2.0 mil 46 KSI __ Mpa 70 gf 14.0 ppm/°C
Al-1% Si
Aluminum
Soft 25 µm 1.0 mil __ KSI __ Mpa 14 gf 25.0 ppm/°C
38 µm 1.5 mil __ KSI __ Mpa 32 gf 25.0 ppm/°C
50 µm 2.0 mil __ KSI __ Mpa 50 gf 25.0 ppm/°C
Al-1% Si
Aluminum
Hard 25 µm 1.0 mil __ KSI __ Mpa 16 gf 25.0 ppm/°C
38 µm 1.5 mil __ KSI __ Mpa 35 gf 25.0 ppm/°C
50 µm 2.0 mil __ KSI __ Mpa 62 gf 25.0 ppm/°C
Ambient temperature 20 °C.
UTS = Ultimate Tensile Strength.   •   1.0 KSI = 6.954 MPa
BeCu = Beryllium Copper.
Data is for information only and is not guaranteed for accuracy.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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