GLASS BGA
Visual Underfill Flow Trials

 
Enlarge: After Assembly
Board Size 50mm x 100mm (2"x4").
Controlled stand-off for glass components


 

999080 Series board with non-collapsible bumps for glass "BGA" like components. For visual observation of underfill flow.

Board Features:

  • Choice of Bump Standoff height:
        • 100um to 450um
        • See Board Order Table below
  • Size - 2"x4.0" (50x100mm)
  • Thickness 0.062" (1.6mm)
  • Sites for 6x Glass BGA Components
  • Green Solder Mask
  • FR4 Tg=175°C
  • Tooling Holes .125" (3.17mm)
  • Global Fiducials - 0.062" (1.57mm)
  • Glass "BGA" Optional Thickness

    Side View   •   Close up

  •  
    Board Order Number
    Board Rev Standoff
    Gap

    Order Number
    B 100um ± 25um 999081
    C 125um ± 30um 999082
    D 150um ± 35um 999083
    E 200um ± 50um 999084
    F 250um ± 60um 999085
    G 330um ± 70um 999086
    H 450um ± 100um 999087
    Ask for glass components with other sizes and thickness.
     
     
    Glass Components
    Optional Accessory
    Glass Component Size Thickness
    Quantity
    Glass Components
    4" Waffle Pack tray

    Order Number
    15 x 15mm 0.50mm 25pcs/Tray 215150
    15 x 15mm 0.68mm 25pcs/Tray 215152
    15 x 15mm 1.10mm 25pcs/Tray 215158
    Ask for glass components with other sizes and thickness.
     
     
    Free Download Parts Placement Data
    Step 1. Click Here for TopLine's Document Center. Sign up and Log in.
    Step 2. Click link "Gerber Files"
    Step 3. Click link "999080a"
    Step 4. Download files
     
     
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