Enlarge: After Assembly
Board Size 50mm x 100mm (2"x4"). Controlled stand-off for glass components. Order Glass Components Separately |
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999080 Series board with non-collapsible bumps for
glass "BGA" like components. For visual observation of underfill flow.
Board Features:
Choice of Bump Standoff height:
• 50um to 800um
• See Board Order Table below
Size - 2"x4.0" (50x100mm)
Thickness .125" (3.2mm) Max.
Sites 6x Glass Components
Green Solder Mask
FR4 Tg=175°C
Tooling Holes .125" (3.17mm)
Global Fiducials - 0.062" (1.57mm)
Optional Fixture Tool PN 999099
Borosilicate Glass Component Optional Thickness Order Separately. Not Included with Board.
Side View • Close up
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