CCGA
Ceramic Column Grid Array
and LGA
 
To CCGA Column  •  CCGA Library
CCGA484 CCGA624 CCGA896 CCGA1152 CCGA1272
 
Columns Matrix Pitch Size (mm) Pb80/Sn20
Die under Lid		 Pb80/Sn20
Exposed Dummy Die		 Pb90/Sn10
Die under Lid		 Pb90/Sn10
Exposed Dummy Die		 Availability
484 22x22 1.0mm 23mm CCGA484T1.0-DC225D - - - Tooled
624 25x25 1.27mm 32.5mm CCGA624T1.27-DC254D - CCGA624T1.27A-DC254D - Tooled
896 30x30 1.0mm 31mm CCGA896T1.0-DC308D - - - Tooled
1152 34x34 1.0mm 35mm CCGA1152T1.0-DC346D - CCGA1152T1.0A-DC346D - Tooled
1272 36x36 1.0mm 37.5mm CCGA1272T1.0-DC367D - CCGA1272T1.0A-DC367D - Tooled
 
 
Solder Columns
Shown with Fillet		 Pb80/Sn20
Solder Column
Rotatable
Model		 Pb80/Sn20
Solder Column
Outline		 Pb90/Sn10
Solder Column
Rotatable
Model		 Pb90/Sn10
Solder Column
Outline		  
 
 
 
 
 
 
 
Columns Matrix Pitch Size (mm) Pb80/Sn20
Internal
Dummy Die		 Pb80/Sn20
Top Mounted
Flip Chip Style
Dummy Die		 Pb90/Sn10
Internal
Dummy Die		 Pb90/Sn10
Top Mounted
Flip Chip Style
Dummy Die		 Outline
Drawing
255 16x16 1.27mm 21mm CCGA255T1.27-DC161D CCGA255T1.27-DC161D CCGA255T1.27A-DC161D CCGA255T1.27A-DC161D Under Development
349 19x19 1.27mm 25mm - - CCGA349T1.27A-DC19xD CCGA349T1.27A-DC19xD Under Development
360 19x19 1.27mm 25mm CCGA360T1.27-DC198D CCGA360T1.27-DC198D CCGA360T1.27A-DC198D CCGA360T1.27A-DC198D Under Development
472 22x22 1.27mm 31mm CCGA472T1.27-DC226D CCGA472T1.27-DC226D CCGA472T1.27A-DC226D CCGA472T1.27A-DC226D Under Development
517 23x23 1.27mm 31mm CCGA517T1.27-DC237D CCGA517T1.27-DC237D CCGA517T1.27A-DC237D CCGA517T1.27A-DC237D PDF
Under Development
717 27x27 1.27mm 35mm CCGA717T1.27-DC278D CCGA717T1.27-DC278D CCGA717T1.27A-DC278D CCGA717T1.27A-DC278D PDF
Under Development
1089 33x33 1.27mm 42.5mm CCGA1089T1.27-DC339D CCGA1089T1.27-DC339D CCGA1089T1.27A-DC339D CCGA1089T1.27A-DC339D Under Development
1144 34x34 1.0mm 35mm CCGA1144T1.0-DC347D CCGA1144T1.0-DC347D CCGA1144T1.0A-DC347D CCGA1144T1.0A-DC347D PDF
Under Development
1247 31x41 1.0mm 32.5x42.5mm CCGA1247T1.0-DC3141D CCGA1247T1.0-DC3141D CCGA1247T1.0A-DC3141D CCGA1247T1.0A-DC3141D Under Development
1588 40x40 1.27mm 52.5mm CCGA1588T1.27-DC407D CCGA1588T1.27-DC407D CCGA1588T1.27A-DC407D CCGA1588T1.27A-DC407D Under Development
1657 41x41 1.0mm 42.5mm CCGA1657T1.0-DC417D CCGA1657T1.0-DC417D CCGA1657T1.0A-DC417D CCGA1657T1.0A-DC417D PDF
Under Development
1752 42x42 1.0mm 45mm CCGA1752T1.0-DC427D CCGA1752T1.0-DC427D CCGA1752T1.0A-DC427D CCGA1752T1.0A-DC427D Under Development
2577 51x51 1.0mm 52.5mm CCGA2577T1.0-DC517D CCGA2577T1.0-DC517D CCGA2577T1.0A-DC517D CCGA2577T1.0A-DC517D PDF
Under Development
 
 
 
 
CLGA - Ceramic Land Grid Array with Daisy Chain • Application Practice Attaching Columns
Click to Enlarge
Columns Matrix Pitch Size (mm) Part Number Die Style Pad
Material		 Pad
Diameter
624 25x25 1.27mm 32.5mm CCGA624T1.27-DC254D Internal
Dummy Die		 Ni/Au Ø0.86mm
1152 34x34 1.0mm 35mm CCGA1152T1.0-DC346D Internal
Dummy Die		 Ni/Au Ø0.80mm
1272 36x36 1.0mm 37.5mm CLGA1272T1.0-DC367D Internal
Dummy Die		 Ni/Au Ø0.80mm
 
 
 
 
 
NASA GSFC-STD-6001:
IBM Solder Column: Pb90Sn10 2.21mm L x 0.51mm diameter and 1.62mm L x 0.89mm diameter.
Copper Wrapped Solder Column: Pb80Sn20, Sn-plated Cu Wrap, Sn63Pb37 Finish. 2.21mm L x 0.51mm diameter
 
Component Inspection:
Colpanarity: Less than +/-0.15mm (0.0059-inch)
Single Column Tilt: An individual column shall not be bent more than 5° relative to other columns
Multiple Column Tilt: Tilt is acceptable if all columns are tilted uniformally up to maximum 10°
Visual Inspection: Use 10X magnification
 
PWB Board Requirements:
PWB Board Material: Polyimide recommended due to lower CTE compared with epoxy-class boards.
PWB Allowed Finish: Tin-lead solder or Electroless-Nickel, Immersion Gold (ENIG). Maximum 0.254µm (10 micro-inch) gold.
PWB Prohibited Finish: Pure tin or other lead free surface plating is not allowed.
PWB Pad Diameter: Non-Solder Masked Defined pads (NSMD) minimum 120% of solder column diameter
PWB Component Courtyard: 0.3-inch (7.62mm) minimum clearance to allow sufficient clearance for rework.
 
Assembly Requirements:
Underfill: Not allowed under the CCGA component.
Solder Paste Stencil: Laser cut stencils are recommend, instead of chem-etched stencils.
 
Rework Requirements:
Prohibited Reuse of Columns: Columns shall not be reused even if they remain attached to the CCGA part after removal from the board.
 
Process Validation Testing:
Electrical Continuity: Use daisy chained connections at -55°C , +100°C and +25°C to identify a failed attachment.
 
 
        
 
 
Land Info
 
Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models.
For PC   •   MAC Version
 



TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

 ©2012 TopLine. All Rights Reserved.

Home