Attenuate harmful PCB vibration with Particle Impact Damper PID components.
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Problem: Harsh vibration at fundamental frequency fo causes premature component failure and damage to Printed Circuit Boards (PCB) assemblies.
Solution: Surface mount a PID (Particle Impact Damper) on your PCB assembly. The PID component extends hardware life. It is a lighter, simpler solution, reducing the need for redundant systems. After vibration hardening, old hardware is ready for new missions in new operating environments.
How: The PID is housed in a sealed container that is filled to 90% with tungsten (Wolfram) balls. The counterbalance impact of tungsten balls in the PID dampens fundamental frequency fo mode vibrations in the PCB assembly. This maximizes energy transfer to the PID which dampens vibration. The weight of the tungsten inside the PID is approximately 10% the mass of the PCB assembly.
Where: Place the PID component near the geometric center (anti-node) of the PCB. The damping effect attenuates vibration and increases board assembly reliability. The PID may be located on either side of the board.
Alternatives: The PID may be attached to an optional interposer bridge to straddle existing high density components on the board.
Fun facts: Tungsten (W) is environmentally friendly. Tungsten's properties include high density and extreme tensile strength. The PID can fully function at extreme temperatures without derating.
Vibration at the fundamental frequency fo causes bending, fatigue and cracks in the PCB assembly. Excessive vibration from external excitations lead to catastrophic failure. NASA invented PID technology to reduce vibration and increase reliability in circuit board assemblies.
PID are commercially available COTS components. Mounting methods include: standard surface mount soldering, BGA, screw mounting and epoxy mounting with permanent adhesives. Engineering development kits are available.